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DA14531-00000OG2

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厂商名称:Dialog Semiconductor(戴乐格半导体)

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DA14531
Ultra Low Power Bluetooth 5.1 SoC
Final
General Description
The DA14531 is an ultra-low power SoC integrating a 2.4 GHz transceiver and an Arm® Cortex-M0+
microcontroller with a RAM of 48 kB and a One-Time Programmable (OTP) memory of 32 kB. It can
be used as a standalone application processor or as a data pump in hosted systems.
The radio transceiver, the baseband processor, and the qualified Bluetooth® low energy stack is fully
compliant with the Bluetooth® Low Energy 5.1 standard.
The DA14531 has dedicated hardware for the Link Layer implementation of BLE and interface
controllers for enhanced connectivity capabilities.
The BLE firmware includes the L2CAP service layer protocols, Security Manager (SM), Attribute
Protocol (ATT), the Generic Attribute Profile (GATT), and the Generic Access Profile (GAP). All
profiles published by the Bluetooth® SIG as well as custom profiles are supported.
The device is suitable for disposables, wireless sensor nodes, beacons, proximity tags and trackers,
smart HID devices (stylus, keyboards, mice, and trackpads), toys, and medical and industrial
applications.
Key Features
Compatible with Bluetooth v5.1, ETSI EN 300
Clocks
328 and EN 300 440 Class 2 (Europe), FCC
32 MHz crystal and 32 MHz RC osc.
CFR47 Part 15 (US) and ARIB STD-T66
32 kHz crystal and 32/512 kHz RC osc.
(Japan)
15 kHz RCX as crystal replacement
Supports up to three BLE connections
Programmable Reset Circuitry
Typical cold boot to radio active 35 ms
2× General purpose Timers with capture and
Processing power
16 MHz 32-bit Arm
®
Cortex-M0+ with
SWD interface
PWM capabilities
18300 EEMBC IoTMark-BLE
®
score
Dedicated Link Layer and AES-128
Encryption Processor
Software-based True Random Number
Generator (TRNG)
Memories
32 kB One-Time-Programmable (OTP)
48 kB Retainable System RAM
144 kB ROM
Power management
Integrated Buck/Boost DCDC converter
Buck: 1.1 V ≤ V
BAT_HIGH
≤ 3.3 V (min 1.8V if
OTP read needed)
Digital interfaces
GPIOs: 6 (WLCSP17), 12 (FCGQFN24)
2× UARTs (one with flow control)
SPI Master/Slave up to 32 MHz (Master)
I2C bus at 100 kHz and 400 kHz
3-axis capable Quadrature Decoder
Keyboard controller
Analog interfaces
4-channel 10-bit ADC
Radio transceiver
Fully integrated 2.4 GHz CMOS
transceiver
Boost: 1.1 V ≤ V
BAT_LOW
≤ 1.65 V
Clock-less hibernation mode: Buck 270
nA, Boost 240 nA
Single wire antenna
TX: 3.5 mA, RX: 2.2 mA (system currents
with DC-DC, V
BAT_HIGH
=3 V and 0 dBm)
Programmable transmit output power from
-19.5 dBm to +2.5 dBm
Built-in temperature sensor for die
temperature monitoring
-94 dBm receiver sensitivity
Packages:
WLCSP 17 balls, 1.7 × 2.05, 0.5 mm pitch
FCGQFN 24 pins, 2.2 × 3, 0.4 mm pitch
Revision 3.0
1 of 374
Datasheet
CFR0011-120-00
12-Mar-2020
© 2020 Dialog Semiconductor
DA14531
Ultra Low Power Bluetooth 5.1 SoC
Final
Applications
Medical applications
Disposables
Beacons
Proximity tags and trackers
Wireless sensor nodes
Fitness trackers
Consumer health
Smartwatches
Human interface devices (HID)
Stylus pens
Keyboards
Mouse devices
Trackpads
Toys
Industrial appliances
Key Benefits
Lowest power consumption
Smallest system size
Lowest system cost
System Diagram
Figure 1: System Diagram
Datasheet
CFR0011-120-00
Revision 3.0
2 of 374
12-Mar-2020
© 2020 Dialog Semiconductor
DA14531
Ultra Low Power Bluetooth 5.1 SoC
Final
Contents
General Description ............................................................................................................................ 1
Key Features ........................................................................................................................................ 1
Applications ......................................................................................................................................... 2
Key Benefits ......................................................................................................................................... 2
System Diagram .................................................................................................................................. 2
Contents ............................................................................................................................................... 3
Figures .................................................................................................................................................. 9
Tables ................................................................................................................................................. 10
1
2
Block Diagram ............................................................................................................................. 19
Packages and Pinout .................................................................................................................. 20
2.1 WLCSP17 ........................................................................................................................... 20
2.2 FCGQFN24 ......................................................................................................................... 24
Specifications .............................................................................................................................. 28
3.1 Absolute Maximum Ratings ................................................................................................ 30
3.2 Recommended Operating Conditions ................................................................................. 30
3.3 DC Characteristics .............................................................................................................. 31
3.4 Timing Characteristics......................................................................................................... 33
3.5 RCX Oscillator ..................................................................................................................... 33
3.6 XTAL32MHz Oscillator ........................................................................................................ 34
3.7 XTAL32kHz Oscillator ......................................................................................................... 34
3.8 RC32MHz Oscillator ............................................................................................................ 35
3.9 DC-DC Converter ................................................................................................................ 35
3.10 LDO_LOW Characteristics .................................................................................................. 36
3.11 Digital I/O Characteristics.................................................................................................... 37
3.12 Power On Reset .................................................................................................................. 39
3.13 GP ADC .............................................................................................................................. 39
3.14 Temperature Sensor ........................................................................................................... 41
3.15 Radio ................................................................................................................................... 41
System Overview ......................................................................................................................... 46
4.1 Internal Blocks..................................................................................................................... 46
4.2 Power Management Unit..................................................................................................... 47
4.2.1
Introduction .......................................................................................................... 47
4.2.2
Architecture .......................................................................................................... 47
4.2.2.1
Digital Power Domains .................................................................... 49
4.2.2.2
Power Modes ................................................................................... 50
4.2.2.3
VDD Level in Hibernation ................................................................ 53
4.2.2.4
Retainable Registers ....................................................................... 53
4.2.3
Programming ....................................................................................................... 53
4.2.3.1
Buck Configuration .......................................................................... 53
4.2.3.2
Boost Configuration ......................................................................... 54
4.2.3.3
Bypass Configuration....................................................................... 55
4.3 HW FSM (Power-up, Wake-up, and Go-to-Sleep) .............................................................. 56
Revision 3.0
3 of 374
3
4
Datasheet
CFR0011-120-00
12-Mar-2020
© 2020 Dialog Semiconductor
DA14531
Ultra Low Power Bluetooth 5.1 SoC
Final
4.4
4.5
5
4.3.1
Power-up/Wake-up in Buck Configuration........................................................... 56
4.3.2
Power-up/Wake-up in Boost Configuration ......................................................... 58
4.3.3
Go-to-Sleep and Refresh Bandgap ..................................................................... 59
OTP Memory Layout ........................................................................................................... 60
4.4.1
OTP Header ......................................................................................................... 60
4.4.2
Configuration Script ............................................................................................. 62
BootROM Sequence ........................................................................................................... 63
Reset ............................................................................................................................................. 67
5.1 Introduction ......................................................................................................................... 67
5.2 Architecture ......................................................................................................................... 67
5.2.1
POR, HW, and SW Reset .................................................................................... 67
5.2.2
POR Functionality ................................................................................................ 69
5.2.2.1
POR Timer Clock ............................................................................. 69
5.2.2.2
RST Pad .......................................................................................... 69
5.2.2.3
POR from GPIO ............................................................................... 69
5.2.3
POR Timing Diagram ........................................................................................... 69
5.2.4
POR Considerations ............................................................................................ 70
5.3 Programming ....................................................................................................................... 70
Arm Cortex-M0+........................................................................................................................... 71
6.1 Introduction ......................................................................................................................... 71
6.2 Architecture ......................................................................................................................... 72
6.2.1
Interrupts .............................................................................................................. 72
6.2.2
System Timer (systick) ........................................................................................ 74
6.2.3
Wake-Up Interrupt Controller ............................................................................... 74
6.3 Programming ....................................................................................................................... 74
AMBA Bus .................................................................................................................................... 75
7.1 Introduction ......................................................................................................................... 75
7.2 Architecture ......................................................................................................................... 75
7.3 Programming ....................................................................................................................... 76
Memory Map................................................................................................................................. 77
Memory Controller ...................................................................................................................... 79
9.1 Introduction ......................................................................................................................... 79
9.2 Architecture ......................................................................................................................... 79
9.2.1
Arbitration ............................................................................................................ 80
6
7
8
9
10 Clock Generation ......................................................................................................................... 81
10.1 Clock Tree ........................................................................................................................... 81
10.1.1 General Clock Constraints ................................................................................... 83
10.2 Crystal Oscillators ............................................................................................................... 83
10.2.1 Frequency Control (32 MHz Crystal) ................................................................... 83
10.2.2 Automated Trimming and Settling Notification .................................................... 84
10.3 RC Oscillators ..................................................................................................................... 85
10.3.1 Frequency Calibration.......................................................................................... 86
11 OTP Controller ............................................................................................................................. 87
11.1 Introduction ......................................................................................................................... 87
11.2 Architecture ......................................................................................................................... 87
Datasheet
CFR0011-120-00
Revision 3.0
4 of 374
12-Mar-2020
© 2020 Dialog Semiconductor
DA14531
Ultra Low Power Bluetooth 5.1 SoC
Final
11.2.1 OTP Accessing Considerations ........................................................................... 89
11.3 Programming ....................................................................................................................... 89
12 DMA Controller ............................................................................................................................ 90
12.1 Introduction ......................................................................................................................... 90
12.2 Architecture ......................................................................................................................... 90
12.2.1 DMA Peripherals .................................................................................................. 90
12.2.2 Input/Output Multiplexer....................................................................................... 91
12.2.3 DMA Channel Operation...................................................................................... 91
12.2.4 DMA Arbitration ................................................................................................... 92
12.2.5 Freezing DMA Channels...................................................................................... 93
12.3 Programming ....................................................................................................................... 93
12.3.1 Memory to Memory Transfers.............................................................................. 93
12.3.2 Peripheral to Memory Transfers .......................................................................... 93
13 I2C Interface ................................................................................................................................. 95
13.1 Introduction ......................................................................................................................... 95
13.2 Architecture ......................................................................................................................... 95
13.2.1 I2C Bus Terms ..................................................................................................... 96
13.2.1.1
Bus Transfer Terms ......................................................................... 97
13.2.2 I2C Behavior ........................................................................................................ 97
13.2.2.1
START and STOP Generation ........................................................ 98
13.2.2.2
Combined Formats .......................................................................... 98
13.2.3 I2C Protocols ....................................................................................................... 98
13.2.3.1
START and STOP Conditions ......................................................... 98
13.2.3.2
Addressing Slave Protocol .............................................................. 99
13.2.3.3
Transmitting and Receiving Protocols ........................................... 100
13.2.4 Multiple Master Arbitration ................................................................................. 101
13.2.5 Clock Synchronization ....................................................................................... 102
13.3 Programming ..................................................................................................................... 103
14 UART ........................................................................................................................................... 105
14.1 Introduction ....................................................................................................................... 105
14.2 Architecture ....................................................................................................................... 106
14.2.1 UART (RS232) Serial Protocol .......................................................................... 106
14.2.2 Clock Support .................................................................................................... 107
14.2.3 Interrupts ............................................................................................................ 107
14.2.4 Programmable THRE Interrupt .......................................................................... 108
14.2.5 Shadow Registers .............................................................................................. 110
14.2.6 Direct Test Mode ............................................................................................... 110
14.3 Programming ..................................................................................................................... 110
15 SPI Interface ............................................................................................................................... 112
15.1 Introduction ....................................................................................................................... 112
15.2 Architecture ....................................................................................................................... 113
15.2.1 SPI Timing ......................................................................................................... 113
15.3 Programming ..................................................................................................................... 114
15.3.1 Master Mode ...................................................................................................... 114
15.3.2 Slave Mode ........................................................................................................ 115
Datasheet
CFR0011-120-00
Revision 3.0
5 of 374
12-Mar-2020
© 2020 Dialog Semiconductor
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