Digital Signal Processors & Controllers - DSP, DSC 30MIPS 144 KB
器件类别:半导体 嵌入式处理器和控制器
厂商名称:Microchip(微芯科技)
厂商官网:https://www.microchip.com
下载文档型号 | DSPIC30F6015T-30I-PT | DSPIC30F6015T-20E/PT | dsPIC30F6010AT-30I/PT | dsPIC30F6010A-30I/PF | DSPIC30F6010AT-20E/PT |
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描述 | Digital Signal Processors & Controllers - DSP, DSC 30MIPS 144 KB | 数字信号处理器和控制器 - DSP, DSC 20MIPS 144 KB | 数字信号处理器和控制器 - DSP, DSC 30MIPS 144 KB | 数字信号处理器和控制器 - DSP, DSC 30MIPS 144 KB | 数字信号处理器和控制器 - DSP, DSC 20MIPS 144 KB |
是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 |
厂商名称 | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
零件包装代码 | - | QFP | QFP | QFP | QFP |
包装说明 | - | 10 X 10 MM, 1 MM HEIGHT, PLASTIC, TQFP-64 | 12 X 12 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-80 | 14 X 14 MM, 1 MM HEIGHT, PLASTIC, MS-026, TQFP-80 | 12 X 12 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-80 |
针数 | - | 64 | 80 | 80 | 80 |
Reach Compliance Code | - | compliant | compliant | compliant | compliant |
ECCN代码 | - | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
Factory Lead Time | - | 5 weeks | 14 weeks | 15 weeks | 14 weeks |
具有ADC | - | YES | YES | YES | YES |
其他特性 | - | OPERATES AT 3V MINIMUM SUPPLY AT 15 MHZ | ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10 MHZ | ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10 MHZ | ALSO OPERATES AT 3V MINIMUM SUPPLY AT 15 MHZ |
位大小 | - | 16 | 16 | 16 | 16 |
最大时钟频率 | - | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
DAC 通道 | - | NO | NO | NO | NO |
DMA 通道 | - | NO | NO | NO | NO |
格式 | - | FIXED POINT | FIXED POINT | FIXED POINT | FIXED-POINT |
JESD-30 代码 | - | S-PQFP-G64 | S-PQFP-G80 | S-PQFP-G80 | S-PQFP-G80 |
JESD-609代码 | - | e3 | e3 | e3 | e3 |
长度 | - | 10 mm | 12 mm | 14 mm | 12 mm |
湿度敏感等级 | - | 3 | 3 | 3 | 3 |
I/O 线路数量 | - | 52 | 68 | 68 | 68 |
端子数量 | - | 64 | 80 | 80 | 80 |
片上程序ROM宽度 | - | 24 | 24 | 24 | 24 |
最高工作温度 | - | 125 °C | 85 °C | 85 °C | 125 °C |
最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C |
PWM 通道 | - | YES | YES | YES | YES |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | TFQFP | TFQFP | TQFP | TFQFP |
封装等效代码 | - | TQFP64,.47SQ | TQFP80,.55SQ | TQFP80,.63SQ,25 | TQFP80,.55SQ |
封装形状 | - | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | - | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE | FLATPACK, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | - | 260 | 260 | 260 | 260 |
电源 | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | - | 8192 | 8192 | 8192 | 8192 |
RAM(字数) | - | 8192 | 8192 | 8192 | 8192 |
ROM(单词) | - | 49152 | 49152 | 49152 | 49152 |
ROM可编程性 | - | FLASH | FLASH | FLASH | FLASH |
座面最大高度 | - | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
速度 | - | 20 MHz | 30 MHz | 30 MHz | 20 MHz |
最大供电电压 | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | - | 4.5 V | 2.5 V | 4.5 V | 3 V |
标称供电电压 | - | 5 V | 5 V | 5 V | 5 V |
表面贴装 | - | YES | YES | YES | YES |
技术 | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE |
端子面层 | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | - | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | - | 0.5 mm | 0.5 mm | 0.65 mm | 0.5 mm |
端子位置 | - | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | - | 40 | 40 | 40 | 40 |
宽度 | - | 10 mm | 12 mm | 14 mm | 12 mm |
uPs/uCs/外围集成电路类型 | - | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |