型号
- 型号
- 关键词
| 型号 | EBE11FD8AHFE | EBE11FD8AHFT-6E-E | EBE11FD8AHFT-5C-E | EBE11FD8AHFL-6E-E | EBE11FD8AHFT | EBE11FD8AHFL | EBE11FD8AHFL-5C-E | EBE11FD8AHFE-5C-E | EBE11FD8AHFE-6E-E |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 1GB Fully Buffered DIMM | 1GB Fully Buffered DIMM | 1GB Fully Buffered DIMM | 1GB Fully Buffered DIMM | 1GB Fully Buffered DIMM | 1GB Fully Buffered DIMM | 1GB Fully Buffered DIMM | 1GB Fully Buffered DIMM | 1GB Fully Buffered DIMM |
| 厂商名称 | - | ELPIDA | ELPIDA | ELPIDA | - | - | ELPIDA | ELPIDA | - |
| 零件包装代码 | - | DIMM | DIMM | DIMM | - | - | DIMM | DIMM | - |
| 包装说明 | - | DIMM, | DIMM, DIMM240,40 | DIMM, | - | - | DIMM, DIMM240,40 | DIMM, DIMM240,40 | - |
| 针数 | - | 240 | 240 | 240 | - | - | 240 | 240 | - |
| Reach Compliance Code | - | unknown | unknown | unknow | - | - | unknown | unknow | - |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | - | - | EAR99 | EAR99 | - |
| 访问模式 | - | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | - | - | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | - |
| 其他特性 | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - |
| JESD-30 代码 | - | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | - | - | R-XDMA-N240 | R-XDMA-N240 | - |
| 内存密度 | - | 19327352832 bit | 19327352832 bit | 19327352832 bi | - | - | 19327352832 bit | 19327352832 bi | - |
| 内存集成电路类型 | - | DRAM MODULE | DRAM MODULE | DRAM MODULE | - | - | DRAM MODULE | DRAM MODULE | - |
| 内存宽度 | - | 72 | 72 | 72 | - | - | 72 | 72 | - |
| 功能数量 | - | 1 | 1 | 1 | - | - | 1 | 1 | - |
| 端口数量 | - | 1 | 1 | 1 | - | - | 1 | 1 | - |
| 端子数量 | - | 240 | 240 | 240 | - | - | 240 | 240 | - |
| 字数 | - | 268435456 words | 268435456 words | 268435456 words | - | - | 268435456 words | 268435456 words | - |
| 字数代码 | - | 256000000 | 256000000 | 256000000 | - | - | 256000000 | 256000000 | - |
| 工作模式 | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | - | SYNCHRONOUS | SYNCHRONOUS | - |
| 组织 | - | 256MX72 | 256MX72 | 256MX72 | - | - | 256MX72 | 256MX72 | - |
| 封装主体材料 | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - | - | UNSPECIFIED | UNSPECIFIED | - |
| 封装代码 | - | DIMM | DIMM | DIMM | - | - | DIMM | DIMM | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | - |
| 自我刷新 | - | YES | YES | YES | - | - | YES | YES | - |
| 最大供电电压 (Vsup) | - | 1.9 V | 1.9 V | 1.9 V | - | - | 1.9 V | 1.9 V | - |
| 最小供电电压 (Vsup) | - | 1.7 V | 1.7 V | 1.7 V | - | - | 1.7 V | 1.7 V | - |
| 标称供电电压 (Vsup) | - | 1.8 V | 1.8 V | 1.8 V | - | - | 1.8 V | 1.8 V | - |
| 表面贴装 | - | NO | NO | NO | - | - | NO | NO | - |
| 技术 | - | CMOS | CMOS | CMOS | - | - | CMOS | CMOS | - |
| 端子形式 | - | NO LEAD | NO LEAD | NO LEAD | - | - | NO LEAD | NO LEAD | - |
| 端子位置 | - | DUAL | DUAL | DUAL | - | - | DUAL | DUAL | - |