Aluminium Electrolytic Capacitors/NXL
Aluminium Electrolytic Capacitors
(Radial lead Type)
Series:
NXL
s
Features
s
Specifications
Operating Temp. Range
Rated W.V.Range
Nominal Cap.Range
Capacitance Tolerance
DC Leakage Current
tan
Characteristics at
Low Temperature
-55 to + 105
°C
10 to 50 V.DC
1 to 100 µF
20% (120Hz/+20
°C)
Type:
A
Lifetime:105
°C
10000h
discontinued
I 0.01 CV or 3 (µA) after 2 minutes
W.V. (V)
tan
δ
W.V. (V)
10
Z(-25°C)/Z(+20°C) 2
Z(-40°C)/Z(+20°C) 3
Whichever, greater
10 16 25 35 50 (120Hz/+20
°C)
0.19 0.16 0.14 0.12 0.10 (max.)
16
2
3
25
2
2
35
2
2
50
2
2
Impedance ratio at 120Hz
After 10000 hours with DC voltage and specified ripple current value a pplied at
+105°C (THE sum of DC and ripple peak voltage shall not exceed the rated working
voltage), the capacitor shall meet the following limits.
Endurance
Capacitance change
tan
DC leakage current
<±20%
of initial measured value
<
200% of initial specified value
<
Initial specified value
Sheif Life
After storage for 1000 hours at +105
°C
with no voltage applied and then being
stabilized at +20
°C,
capacitor shall meet the limits specified in Endurance .
Az to taping and lead formed , ask factory for technical specifications before purchase and/or use.
s
Explanation of Part Numbers
E
C
A
Style
X
L
N.Capacitance Code
Option
Product CodE
R.W. Voltage Code Series Code
s
Dimensions in mm (not to scale)
Vinyl sleeve
P
±
0.5
Body Dia.
φD
4
5
6.3
0.5
2.5
Lead Dia.
φd
0.45 0.5
Lead spase P
1.5 2
L+1 max
14 min
3 min
φD+0.5
max
DxL(mm)
25 (1E)
35 (1V)
4 x11
4 x11
4 x11
4 x11
4 x11
4 x11
4 x11
43
78
3.3 5 x11
1.7
60
2.35
6.3x11.2
6.3x11.2
Case size
s
Case size/Ripple current/Impedance
W.V. (V)
Cap. ( F)
10 (1A)
16 (1C)
50 (1H)
11
24
34
34
34
34
125
125
4.5
4.5
4.5
4.5
4.5
4.5
1.05
1.05
1.0 (010)
2.2 (2R2)
3.3 (3R3)
4.7 (4R7)
6.8 (6R8)
10 (100)
22 (220)
33 (330)
47 (470)
68 (680)
100 (101)
(
) shows W.V. and capacitance code.
4 x11
4x11
43
3.3
5 x11
5 x11
43
78
78
3.3
1.7
1.7
5 x11
(mA) r.m.s.
(
Ω)
(100kHz
(100kHz/
/+105
°C)
+20°C)
Ripple
current
Impe-
dance
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and / or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
Mar. 2005
Ñ
EE9
Ñ
Aluminum Electrolytic Capacitor
Application Guidelines
1. Circuit Design
E n s u r e t h a t operational and mounting conditions
follw the specified conditions detailed in the catalog
and specification sheets.
1.2 Operating Temperature and Life Expectancy
(1) Expected life is affected by operating temperature.
Generally, each 10°C reduction in temperature
will double the expected life. Use capacitors at
the lowest possible temperature below the
maximum guaranteed temperature.
(2) I f o p e ra t i n g c o n d i t i o n s ex c e e d t h e m a x i m u m
guaranteed limit, rapid eIectrical parameter
deterioration will occur, and irreversible damage
will result.
Check for maximum capacitor operating tempera-
tures including ambient temperature, inter nal
capacitor temperature rise caused by ripple current,
a n d t h e e f fe c t s o f r a d i a t e d h e a t f r o m p ow e r
transistors, IC?s or resistors.
Avoid placing components which could conduct
heat to the capacitor from the back side of the circuit
board.
(3)The formula for calculating expected Iife at lower
operating temperatures is as fllows;
L
2
= L
1
x 2
T
1
-
T
2
10
1.1 Operating Temperature and Frequency
E l e c t r o l y t i c c a p a c i t o r e l e c t r i c a l p a ra m e t e r s a r e
normally specified at 20°C temperature and 120Hz
frequency. These parameter s var y with changes in
t e m p e r a t u r e a n d f r e q u e n c y. C i r c u i t d e s i g n e r s
should take these changes into consideration.
(1) Effects of o p e ra t i n g t e m p e ra t u r e on electrical
parameters
a ) A t h i g h e r t e m p e ra t u r e s, l e a k a g e c u r r e n t a n d
c a p a c i t a n c e i n c r e a s e while equivalent series
resistance(ESR) decreases.
b)At l o w e r t e m p e r a t u r e s , l e a k a g e c u r r e n t a n d
c a p a c i t a n c e decrease while equivalent series
resistance(ESR) increases.
(2) Effects of fr e q u e n c y on e l e c t r i c a l p a r a m e t e r s
a)At higher frequencies, capacitance and
impedance decrease while tan
δ
increases.
b)At lower frequencies, r ipple current generated
heat will ri s e d u e t o a n increase in equivalent
series resistance (ESR).
where,
L
1
: Guaranteed life (h) at temperature, T
1
°
C
L
2
: Expected life (h) at temperature,T
2
°C
T
1
: Maximum operating temperature (°C)
T
2
: Actual operating temperature, ambient
temperature + temperature rise due to
ripple currentheating(°C)
A quick eference capacitor guide for estimating
exected life is included for your reference.
s
Expected Life Estimate Quick Reference Guide
Capacitor Ambient Temperature
120
110
100
90
80
70
60
50
40
s
Failure rate curve
2
1
3
4
1. 85°C2000h
2.105°C1000h
3.105°C2000h
4.105°C5000h
Initial failure period
Random failure period
Wear failure period
Failure rate
Life Time
24h
(h)
2000
5000
10,000
1
3
20,000
2
6
3
10
50,000 100,000 200,000
4 5
7
30
20
operat-
Years
ion
Time
8h/d
Years
15 20
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
Mar. 2005
–
EE16
–
Aluminum Electrolytic Capacitor
s
Typical failure modes and their factors
Faliure mode
Faliure mechanism (internal phenomenon)
Production factor
Application factor
Overvoltage applied
Vent operates
Increase in
internal pressure
•
Increase in inter-
•
nal temperature
•
Capacitance
reduction
•
tan
d
increase
•
Reduced cathode
foil capacitance
Reduced anode foil
capacitance
•
•
•
Excessive ripple current
•
Reverse voltage applied
•
Severe charging-discharging
AC voltage applied
•
•
Deterioration of
oxide film
Leakage current
increase
•
•
Electrolyte evapora-
tion
•
•
Short circuit
Insulation breakdown of film
or electrolytic paper
•
•
Burr(s) on foil leads
Metal particles
in capacitor
Stress applied to leads
•
•
Insufficient
electrolyte
Used for a long period of time
Defect of oxide film
•
Used for a high temperature
Leads improperly
connected
Leads improperly connected
•
Mechanical stress
Open
•
•
Use of Halogenated solvent
Corrosion
Infiltration of Cl
•
Use of adhesive
Use of coating material
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
Mar. 2005
–
EE17
–
Aluminum Electrolytic Capacitor
1.3 Common Application Conditions to Avoid
The following misapplication load conditions will
cause rapid deter ioration to capacitor electr ical
p a r a m e t e r s. l n a d d i t i o n , ra p i d h e a t i n g a n d g a s
generation within the capacitor can occur causing
the pressure relief vent to operate and resuItant
leakage of electrolyte. Under extreme conditions,
explosion and fire could result. Leakinq electrolyte
is combustible and electrically conductive.
The vinyl sleeve of the capacitor can be damaged
i f s o l d e r p a s s e s t h r o u g h a l e a d h o l e for
subsequently processed parts. Special care when
locating hole positions in proximity to capacitors is
recommended.
(3) Circuit Board Hole Spacing
The circuit board holes spacing should match the
capacitor lead wire spacing within the specified
tolerances. Incorrect spacing can cause excessive
lead wire stress during the insertion process. This
may resuIt in premature capacitor failure due to
short or open circuit, increased leakage current,
or electrolyte leakage.
(1) Reverse Voltaqe
DC capacitors have polarity. Verify correct polarity
before inser tion. For circuits with changing or
uncertain polarity,use DC bipolar capacitors. DC
bipolar capacitors are not suitable for use in AC
circuits.
(4)Land/Pad Pattern
The circuit board land/pad pattern size for chip
capacitors is specified in the following table.
(2) Charqe/Discharqe Applications
Standard capacitors are not suitable for use in
repeating charge/discharge applications. For
charqe/discharqe applications consult us and advise
actual conditions.
[ Table of Board Land Size vs. Capacitor Size ]
(3) Overvoltage
Do not appIy voltaqes exceeding the maximum
specified rated voltages. Voltage up to the surge
voltage rating are acceptable for short periods of
time. Ensure that the sum of the DC voltage and
the superimposed AC ripple vo l t a g e does not
exceed the rated voltage.
c
b
a
b
Board land part
(mm)
c
1.5
1.6
1.6
1.6
1.6
2.0
2.0
(4) Ripple Current
Do not apply ripple currents exceeding the maximum
specified value. For high ripple current applications,
use a capacitor designed for high rippIe currents
or contact us with your requirements.
Ensure that allowable ripple currents superimposed
on low DC bias voltages do not cause reverse voltage
conditions.
Size
A(φ3)
B(φ4)
C(φ5)
D(φ6.3)
E(φ8 x 6.2L)
F(φ8 x 10.2L)
G(φ10 x 10.2L)
a
0.6
1.0
1.5
1.8
2.2
3.1
4.6
b
2.2
2.5.
2.8
3.2
4.0
4.0
4.1
1.4 Using Two or More Capacitors in Series
or Parallel
(1) Capacitors Connected in Parallel
The circuit resistance can closely approximate the
ser ies resistance of the capacitor causing an
imbalance of ripple current loads w i t h in the
capacitors. Careful design of wiring methods can
minimize the possibility of excessive ripple currents
applied to a capacitor.
Among others, when the size a is wide , back fillet can
not be made, decreasing fitting strength.
h
Decide considering mounting condition, solderability
and fitting strength, etc. based on the design
standards of your company.
(2) Capacitors Connected in Series
Normal DC leakage current differences among
capacitors can cause voltage imbalances. The use
of voltage divider shunt resistors with consideration
to leakage currents, can prevent capacitor voltage
imbaIances.
1.5 Capacitor Mounting Considerations
(1) DoubIe - Sided Circuit Boards
Avoid wiring Pattern runs which pass between
the mounted capacitor and the circuit board. When
dipping into a solder bath, excess solder may collect
u n d e r t h e c a p a c i t o r by c a p i l l a r y a c t i o n a n d
shortcircuit the anode and cathode terminals.
(2) Circuit Board Hole Positioning
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
Mar. 2005
–
EE18
–
Aluminum Electrolytic Capacitor
(5)Clearance for Case Mounted Pressure
Relief Vents
Capacitors with case mounted pressure relief vents
require sufficient clearance to allow for proper vent
operation. The minimum clearances are dependent
on capacitor diameters as follows.
f6.3
to
f16
mm : 2 mm minimum,
f18
to
f35
mm : 3 mm minimum.
f40
mm or greater: 5 mm minimum
2. Capacitor Handling Techniques
2.1 Considerations Before Using
(1) Capacitors have a finite life. Do not reuse or
recycle capacitors from used equipment.
(2) Transient recovery voltage may be generated in
the capacitor due to dielectric absorption. If
required, this voltage can be discharged with a
resistor with a value of about 1 kΩ.
(3) Capacitors stored for long periods of time may
exhibit an increase in leakage current. This can
be corrected by gradually applying rated voltage
in series with a resistor of approximately 1 kΩ.
(4) If capacitors are dropped, they can be damaged
mechanically or electrically. Avoid using dropped
capacitors.
(5) Dented or crushed capacitors should not be
used. The seal integrity can be compromised
and loss of electrolyte/shortened life can result.
(6)Clearance for Seal Mounted Pressure
Relief Vents
A hole in the circuit board directly under the seal
vent location is required to allow proper release
of pressure.
(7)Wiring Near the Pressure Relief Vent
Avoid locating high voltage or high current wiring
or circuit board paths above the pressure relief
vent. Flammable, high temperature gas exceeding
100°C may be released which could dissolve the
wire insulation and ignite.
(8)Circuit Board Patterns Under the Capacitor
Avoid circuit board runs under the capacitor as
electrolyte leakage could cause an electrical short.
2.2 Capacitor Insertion
(1) Verify the correct capacitance and rated voltage
of the capacitor.
(2) Verify the correct polarity of the capacitor before
inserting.
(3) Verify the correct hole spacing before insertion
(land pattern size on chip type) to avoid stress
on the terminals.
(4) Ensure that the auto insertion equipment lead
clinching operation does not stress the capacitor
leads where they enter the seal of the capacitor.
For chip type capacitors, excessive mounting
pressure can cause high leakage current, short
circuit, or disconnection.
(9)Screw Terminal Capacitor Mounting
Do not orient the capacitor with the screw terminal
side of the capacitor facing downwards.
q
Tighten the terminal and mounting bracket screws
within the torque range specified in the
specification.
q
1.6Electrical Isolation of the Capacitor
Completely isolate the capacitor as follows.
q
Between the cathode and the case (except for
axially leaded B types) and between the anode
terminal and other circuit paths.
q
Between the extra mounting terminals (on T types)
and the anode terminal, cathode terminal, and
other circuit paths.
2.3 Manual Soldering
(1) O b s e r v e t e m p e r a t u r e a n d t i m e s o l d e r i n g
specifications or do not exceed temperatures of
350°C for 3 seconds or less.
(2) If lead wires must be formed to meet terminal
board hole spacing, avoid stress on the leadwire
where it enters the capacitor seal.
(3) If a soldered capacitor must be removed and
reinserted, avoid excessive stress to the capacitor
leads.
(4) Aviod touching the tip of the soldering iron to the
capacitor, to prevent melting of the vinyl sleeve.
1.7 Capacitor Sleeve
The vinyl sleeve or laminate coating is intended for
marking and identification purposes and is not meant
to electrically insulate the capacitor.
The s l e e v i n g may split or crack if immersed into
solvents such as toluene or xylene, and then exposed
to high temperatures.
Always consider safety when designing equipment
and circuits. Plan for worst case failure modes such
as short circuits and open circuits which could occur
during use.
(1)Provide protection circuits and protection devices
to allow safe failure modes.
(2)Design redundant or secondary circuits where
possible to assure continued operation in case of
main circuit failure.
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
Mar. 2005
–
EE19
–
stm32/stm8
