EDI8F32256B15MNC,EDI8F32256B15MNC pdf中文资料,EDI8F32256B15MNC引脚图,EDI8F32256B15MNC电路-Datasheet-电子工程世界

参数对比

与EDI8F32256B15MNC相近的元器件有：EDI8F32256B10MMC-G、EDI8F32256C20MNC-G、EDI8F32256B12MMC-G、EDI8F32256C35MNC-G、EDI8F32256B10MNC-G、EDI8F32256C25MNC-G、EDI8F32256B15MZC、EDI8F32256B12MNC-G、EDI8F32256B15MMC。描述及对比如下：

型号	EDI8F32256B15MNC	EDI8F32256B10MMC-G	EDI8F32256C20MNC-G	EDI8F32256B12MMC-G	EDI8F32256C35MNC-G	EDI8F32256B10MNC-G	EDI8F32256C25MNC-G	EDI8F32256B15MZC	EDI8F32256B12MNC-G	EDI8F32256B15MMC
描述	SRAM Module, 1MX8, 15ns, BICMOS,	SRAM Module, 1MX8, 10ns, BICMOS,	SRAM Module, 1MX8, 20ns, CMOS,	SRAM Module, 1MX8, 12ns, BICMOS,	SRAM Module, 1MX8, 35ns, CMOS,	SRAM Module, 1MX8, 10ns, BICMOS,	SRAM Module, 1MX8, 25ns, CMOS,	SRAM Module, 1MX8, 15ns, BICMOS,	SRAM Module, 1MX8, 12ns, BICMOS,	SRAM Module, 256KX32, 15ns, BICMOS,
Reach Compliance Code	unknow	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow	unknow
最长访问时间	15 ns	10 ns	20 ns	12 ns	35 ns	10 ns	25 ns	15 ns	12 ns	15 ns
JESD-30 代码	R-XSMA-N64	R-XSMA-N64	R-XSMA-N64	R-XSMA-N64	R-XSMA-N64	R-XSMA-N64	R-XSMA-N64	R-XZMA-T64	R-XSMA-N64	R-XSMA-N64
内存密度	8388608 bi	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bi	8388608 bi
内存集成电路类型	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
内存宽度	8	8	8	8	8	8	8	8	8	32
功能数量	1	1	1	1	1	1	1	1	1	1
端口数量	1	1	1	1	1	1	1	1	1	1
端子数量	64	64	64	64	64	64	64	64	64	64
字数	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	262144 words
字数代码	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000	256000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	256KX32
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
可输出	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
封装主体材料	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
技术	BICMOS	BICMOS	CMOS	BICMOS	CMOS	BICMOS	CMOS	BICMOS	BICMOS	BICMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD
端子位置	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	ZIG-ZAG	SINGLE	SINGLE
厂商名称	EDI [Electronic devices inc.]	-	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]
其他特性	CONFIGURABLE AS 256K X 32	CONFIGURABLE AS 256K X 32	CONFIGURABLE AS 256K X 32	CONFIGURABLE AS 256K X 32	CONFIGURABLE AS 256K X 32	CONFIGURABLE AS 256K X 32	CONFIGURABLE AS 256K X 32	CONFIGURABLE AS 256K X 32	CONFIGURABLE AS 256K X 32	-
备用内存宽度	16	16	16	16	16	16	16	16	16	-