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EM3581

SPECIALTY MICROPROCESSOR CIRCUIT
专业微处理器电路

器件类别:半导体    嵌入式处理器和控制器   

厂商名称:SILABS

厂商官网:http://www.silabs.com

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器件参数
参数名称
属性值
状态
ACTIVE-UNCONFIRMED
微处理器类型
MICROPROCESSOR CIRCUIT
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High-Performance, Integrated ZigBee/802.15.4 System-on-Chip Family
EM358x
Complete System-on-Chip
-
32-bit ARM® Cortex -M3 processor
-
2.4 GHz IEEE 802.15.4-2003 transceiver & lower MAC
-
256 or 512 kB flash, with optional read protection
-
32 or 64 kB RAM memory
-
AES128 encryption accelerator
-
Flexible ADC, UART/SPI/TWI serial communications,
and general purpose timers
-
Optional USB serial communications
-
24 highly configurable GPIOs with Schmitt trigger inputs
Exceptional RF Performance
-
Normal mode link budget up to 103 dB; configurable up
to 110 dB
-
–100 dBm normal RX sensitivity; configurable to
–102 dBm (1% PER, 20 byte packet)
-
+3 dB normal mode output power; configurable up to
+8 dBm
-
Robust Wi-Fi and Bluetooth coexistence
Industry-leading ARM® Cortex -M3 processor
-
Leading 32-bit processing performance
-
Highly efficient Thumb-2 instruction set
-
Operation at 6, 12, or 24 MHz
-
Flexible Nested Vectored Interrupt Controller
Low power consumption, advanced management
-
RX Current (w/ CPU): 27 mA
-
TX Current (w/ CPU, +3 dBm TX): 31 mA
-
Low deep sleep current, with retained RAM and GPIO:
1.0
A
without/1.25
A
with sleep timer
-
Low-frequency internal RC oscillator for low-power sleep
timing
-
High-frequency internal RC oscillator for fast (110 µs)
processor start-up from sleep
Innovative network and processor debug
-
Packet Trace Port for non-intrusive packet trace with
Ember development tools
-
Serial Wire/JTAG interface
-
Standard ARM debug capabilities: Flash Patch & Break-
point; Data Watchpoint & Trace; Instrumentation Trace
Macrocell
Application Flexibility
-
Single voltage operation: 2.1–3.6 V with internal 1.8 and
-
-
-
-
1.25 V regulators
Optional 32.768 kHz crystal for higher timer accuracy
Low external component count with single 24 MHz
crystal
Support for external power amplifier
Small 7x7 mm 48-pin QFN package
PA select
TX_ACTIVE
RF_TX_ALT_P,N
PA
SYNTH
PA
DAC
Data
RAM
64 kB
Program
Flash
512 kB
RF_P,N
LNA
IF
ADC
MAC
+
Baseband
ARM
®
Cortex
TM
-M3
CPU with NVIC
and MPU
2
nd
level
Interrupt
controller
Bias
Packet Trace
OSCA
OSCB
VDD_CORE
VREG_OUT
nRESET
HF crystal 
OSC
1.25V 
Regulator
1.8V 
Regulator
POR
LF crystal 
OSC
Internal HF
RC-OSC
Calibration
ADC
General 
purpose 
timers
GPIO
registers
CPU debug
TPIU/ITM/FPB/
DWT/ETM
Always
Powered
Domain
Watchdog
Encryption 
acclerator
USB
Device
General
Purpose
ADC
Internal LF
RC-OSC
Serial
Wire and
JTAG
debug
SWCLK, JTCK 
UART/
SPI/TWI
Chip
manager
Sleep
timer
GPIO multiplexor switch
PA[7:0], PB[7:0], PC[7:0]
Rev 1.0 4/14
Copyright © 2014 by Silicon Laboratories
EM358x
EM358x
General Description
The Ember EM358x is a fully integrated System-on-Chip that integrates a 2.4 GHz, IEEE 802.15.4-2003-compliant
transceiver, 32-bit ARM
®
Cortex
TM
-M3 microprocessor, flash and RAM memory, and peripherals of use to
designers of ZigBee-based systems.
The transceiver uses an efficient architecture that exceeds the dynamic range requirements imposed by the IEEE
802.15.4-2003 standard by over 15 dB. The integrated receive channel filtering allows for robust co-existence with
other communication standards in the 2.4 GHz spectrum, such as IEEE 802.11-2007 and Bluetooth. The integrated
regulator, VCO, loop filter, and power amplifier keep the external component count low. An optional high
performance radio mode (boost mode) is software-selectable to boost dynamic range.
The integrated 32-bit ARM
®
Cortex
TM
-M3 microprocessor is highly optimized for high performance, low power
consumption, and efficient memory utilization. Including an integrated MPU, it supports two different modes of
operation—privileged mode and user mode. This architecture could allow for separation of the networking stack
from the application code, and prevents unwanted modification of restricted areas of memory and registers
resulting in increased stability and reliability of deployed solutions.
The EM358x has either 256 or 512 kB of embedded flash memory and either 32 or 64 kB of integrated RAM for
data and program storage. The Ember software for the EM358x employs an effective wear-leveling algorithm that
optimizes the lifetime of the embedded flash.
To maintain the strict timing requirements imposed by the ZigBee and IEEE 802.15.4-2003 standards, the EM358x
integrates a number of MAC functions, AES128 encryption accelerator, and automatic CRC handling into the
hardware. The MAC hardware handles automatic ACK transmission and reception, automatic backoff delay, and
clear channel assessment for transmission, as well as automatic filtering of received packets. The Ember Packet
Trace Interface is also integrated with the MAC, allowing complete, non-intrusive capture of all packets to and from
the EM358x with Ember development tools.
The EM358x offers a number of advanced power management features that enable long battery life. A high-
frequency internal RC oscillator allows the processor core to begin code execution quickly upon waking. Various
deep sleep modes are available with less than 2 µA power consumption while retaining RAM contents. To support
user-defined applications, on-chip peripherals include optional USB, UART, SPI, TWI, ADC, and general-purpose
timers, as well as up to 24 GPIOs. Additionally, an integrated voltage regulator, power-on-reset circuit, and sleep
timer are available.
Finally, the EM358x utilizes standard Serial Wire and JTAG interfaces for powerful software debugging and
programming of the ARM Cortex
TM
-M3 core. The EM358x integrates the standard ARM
®
system debug
components: Flash Patch and Breakpoint (FPB), Data Watchpoint and Trace (DWT), and Instrumentation Trace
Macrocell (ITM) as well as the advanced Embedded Trace Macrocell (ETM).
Target applications for the EM358x include:
Energy

Building automation and control

Home automation and control

Security and monitoring

General ZigBee wireless sensor networking

Smart
This technical data sheet details the EM358x features available to customers using it with Ember software.
2
Rev 1.0
EM358x
Ta b l e o f C o n t e n ts
1. Related Documents and Conventions ...............................................................................5
1.1. Related Documents........................................................................................................5
1.1.1. Ember EM358x Reference Manual........................................................................5
1.1.2. ZigBee Specification ..............................................................................................5
1.1.3. ZigBee PRO Stack Profile .....................................................................................5
1.1.4. ZigBee Stack Profile ..............................................................................................5
1.1.5. Bluetooth Core Specification .................................................................................5
1.1.6. EEE 802.15.4-2003 ...............................................................................................5
1.1.7. EEE 802.11g..........................................................................................................5
1.1.8. USB 2.0 Specification ............................................................................................5
1.1.9. ARM® Cortex™-M3 Reference Manual ................................................................5
1.2. Conventions ...................................................................................................................6
2. Typical Connection Diagrams ............................................................................................9
3. Electrical Specifications.................................................................................................... 13
3.1. Absolute Maximum Ratings..........................................................................................13
3.2. Recommended Operating Conditions .......................................................................... 13
3.3. Environmental Characteristics...................................................................................... 14
3.4. DC Electrical Characteristics........................................................................................ 14
3.5. Digital I/O Specifications .............................................................................................. 19
3.6. Non-RF System Electrical Characteristics ................................................................... 20
3.7. RF Electrical Characteristics ........................................................................................ 21
3.7.1. Receive................................................................................................................ 21
3.7.2. Transmit...............................................................................................................24
3.7.3. Synthesizer .......................................................................................................... 26
4. EM358x System Overview.................................................................................................27
4.1. Microprocessor and Memory........................................................................................ 28
4.1.1. ARM® Cortex™-M3 Microprocessor ................................................................... 28
4.1.2. Embedded Memory ............................................................................................. 29
4.2. Interrupt System ........................................................................................................... 29
4.2.1. Nested Vectored Interrupt Controller (NVIC) .......................................................29
4.2.2. Event Manager .................................................................................................... 29
4.2.3.
Memory Protection Unit ............................................................................29
4.3. Radio Module ...............................................................................................................29
4.3.1. Receive (Rx) Path................................................................................................ 29
4.3.2. Transmit (Tx) Path ............................................................................................... 30
4.3.3. Integrated MAC Module....................................................................................... 30
4.3.4. Packet Trace Interface (PTI)................................................................................ 30
4.3.5. Random Number Generator ................................................................................ 30
4.4. System Modules........................................................................................................... 30
4.4.1. Power domains .................................................................................................... 30
4.4.2. Resets.................................................................................................................. 31
4.4.3. Clocks .................................................................................................................. 31
4.4.4. System Timers..................................................................................................... 31
4.4.5. Power Management............................................................................................. 31
Rev 1.0
3
EM358x
4.5. Integrated Voltage Regulator ....................................................................................... 32
4.6. Peripherals ................................................................................................................... 32
4.6.1. GPIO .................................................................................................................. 32
4.6.2. Serial Controllers .................................................................................................32
4.6.3. USB .................................................................................................................. 33
4.6.4. General Purpose Timers...................................................................................... 33
4.6.5. Analog-to-Digital Converter (ADC) ...................................................................... 34
4.7. Debugging .................................................................................................................... 34
4.7.1. Trace Port Interface Unit (TPIU) .......................................................................... 34
4.7.2. Instrumentation Trace Macrocell (ITM)................................................................ 34
4.7.3. Embedded Trace Macrocell (ETM)...................................................................... 34
4.7.4.
Data Watchpoint and Trace (DWT)........................................................... 34
4.7.5. Flash Patch and Breakpoint (FPB) ...................................................................... 35
4.7.6. Serial Wire and JTAG (SWJ) Interface ................................................................ 35
5. Ordering Information ......................................................................................................... 36
6. Pin Assignments................................................................................................................37
6.1. Mechanical Details ....................................................................................................... 50
6.1.1. QFN48 Footprint Recommendations ................................................................... 52
6.1.2. Solder Temperature Profile.................................................................................. 54
6.2. Part Marking ................................................................................................................. 56
Document Change List ........................................................................................................... 58
Contact Information ................................................................................................................ 59
4
Rev 1.0
EM358x
1. Related Documents and Conventions
1.1. Related Documents
This data sheet accompanies several documents to provide the complete description of the Ember EM358x
devices.
1.1.1. Ember EM358x Reference Manual
The Silicon Laboratories Ember EM358x Reference Manual provides the detailed description for each peripheral
on the EM358x devices.
1.1.2. ZigBee Specification
The core ZigBee specification (Document 053474) defines ZigBee's smart, cost-effective and energy-efficient
mesh network. It can be downloaded from the ZigBee website (www.zigbee.org). ZigBee Alliance membership is
required.
1.1.3. ZigBee PRO Stack Profile
The ZigBee PRO Stack Profile specification (Document 074855) is optimized for low power consumption and to
support large networks with thousands of devices. It can be downloaded from the ZigBee website (111.zigbee.org).
ZigBee Alliance membership is required.
1.1.4. ZigBee Stack Profile
The ZigBee Stack Profile specification (Document 064321) is designed to support smaller networks with hundreds
of devices in a single network. It can be downloaded from the ZigBee website (111.zigbee.org). ZigBee Alliance
membership is required.
1.1.5. Bluetooth Core Specification
The Bluetooth specification is the global short-range wireless standard enabling connectivity for a broad range of
electronic devices. Version 2.1 + EDR (Enhanced Data Rate) can be found here:
http://www.bluetooth.org/docman/handlers/downloaddoc.ashx?doc_id=241363
1.1.6. EEE 802.15.4-2003
This standard defines the protocol and compatible interconnection for data communication devices using low data
rate, low power and low complexity, short-range radio frequency (RF) transmissions in a wireless personal area
network (WPAN). It can be found here:
IEEE 802.15.4-2003 (http://standards.ieee.org/getieee802/download/802.15.4-2003.pdf)
1.1.7. EEE 802.11g
This version provides changes and additions to support the further higher data rate extension for operation in the
2.4 GHz band. It can be found here:
http://standards.ieee.org/getieee802/download/802.11g-2003.pdf
1.1.8. USB 2.0 Specification
The Universal Serial Bus Revision 2.0 specification provides the technical details to understand USB requirements
and design USB compatible products. The main specification (usb_20.pdf) is part of the zipfile found here:
http://www.usb.org/developers/docs/usb_20_101111.zip
1.1.9. ARM
®
Cortex™-M3 Reference Manual
ARM-specific features like the Nested Vector Interrupt Controller are described in the ARM
®
Cortex™-M3
reference documentation. The online reference manual can be found here:
http://infocenter.arm.com/help/topic/com.arm.doc.subset.cortexm.m3/index.html#cortexm3
Rev 1.0
5
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参数对比
与EM3581相近的元器件有:EM3581-RTR、EM3582-RTR、EM3585-RTR、EM3586-RTR、EM3587-RTR、EM3588-RTR。描述及对比如下:
型号 EM3581 EM3581-RTR EM3582-RTR EM3585-RTR EM3586-RTR EM3587-RTR EM3588-RTR
描述 SPECIALTY MICROPROCESSOR CIRCUIT SPECIALTY MICROPROCESSOR CIRCUIT SPECIALTY MICROPROCESSOR CIRCUIT SPECIALTY MICROPROCESSOR CIRCUIT SPECIALTY MICROPROCESSOR CIRCUIT SPECIALTY MICROPROCESSOR CIRCUIT SPECIALTY MICROPROCESSOR CIRCUIT
状态 ACTIVE-UNCONFIRMED ACTIVE-UNCONFIRMED ACTIVE Active-Unconfirmed ACTIVE-UNCONFIRMED ACTIVE-UNCONFIRMED ACTIVE-UNCONFIRMED
微处理器类型 MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT - MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT
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