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EMC1815T-AE/9R

板上安装温度传感器 1.8V 5chnl temp snsr I2C 2alert addrssbl

器件类别:传感器   

厂商名称:Microchip(微芯科技)

厂商官网:https://www.microchip.com

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器件参数
参数名称
属性值
厂商名称
Microchip(微芯科技)
包装说明
VDFN-10
Reach Compliance Code
compliant
Factory Lead Time
6 weeks
其他特性
TEMPERATURE SENSOR RESOLUTION 0.125 DEG CEL
主体宽度
2 mm
主体高度
0.9 mm
主体长度或直径
2.5 mm
外壳
PLASTIC
安装特点
SURFACE MOUNT
位数
11
最大工作电流
0.432 mA
最高工作温度
125 °C
最低工作温度
-40 °C
输出接口类型
2-WIRE INTERFACE
封装形状/形式
RECTANGULAR
传感器/温度传感器类型
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
最大供电电压
3.6 V
最小供电电压
1.62 V
表面贴装
YES
端接类型
SOLDER
文档预览
Multi-Channel Low-Voltage
Remote Diode Sensor Family
EMC1812/13/14/15/33 Data Sheet
Features
Measures Temperature Rate of Change Calculation with Preemptive Alert(s) Limits
Up to Four External Temperature Monitors:
8 Lead Devices:
±1°C maximum accuracy (-20°C to +105°C T
A
, -40°C to +125°C T
D
)
– ±1.5°C maximum accuracy (-40°C to +125°C T
A
, -40°C to +125°C T
D
)
10 Lead Devices:±1°C
maximum accuracy (-20°C to +125°C T
A
, -40°C to +125°C T
D
)
– ±1.5°C maximum accuracy (-40°C to +125°C T
A
, -40°C to +125°C T
D
)
Internal Temperature Sensor:
±1°C maximum accuracy, -40°C to +125°C
Temperature Sensor Resolution (Internal/External): 0.125°C
SMBus/I
2
C-Compatible Interface (up to 400 kHz)
– Programmable or fixed address options
Configurable Alert Pins
Operating Voltage: 1.62V to 3.6V
Temperature Range: -40°C to +125°C
Other Features: Auto-Beta Compensation, Configurable Ideality Factor, Hottest Diode Compare,
Resistance Error Correction
Available in 8-Lead 2x2 mm WDFN and 10-Lead 2.5x2.0 mm VDFN Packages
Typical Applications
Temperature Sensitive Storage
Industrial
IoT for Low-System Voltage
Portable Electronics
Handheld Gaming
Computing
Food Storage
Description
The EMC1812/13/14/15/33 devices are high-accuracy, 2-wire (I
2
C) temperature sensors. The devices
monitor up to five temperature channels. Advanced features, such as Resistance Error Correction (REC),
Beta Compensation (to support CPU diodes requiring the BJT/Transistor model), and rate of temperature
change measurement combine to provide a robust solution for complex environmental monitoring
applications.
©
2018 Microchip Technology Inc.
Datasheet
DS20005751A-page 1
Multi-Channel Low-Voltage Remote Diode Sensor Family
This device family introduces rate of change temperature measurement with associated alerts. This provides
a preemptive system alert and another protective measurement layer to catch and manage variable system
temperatures.
The Resistance Error Correction feature automatically eliminates the temperature error caused by series
resistance, allowing for greater flexibility in routing thermal diodes. Beta compensation eliminates
temperature errors caused by low, variable beta transistors common in current fine geometry processors. The
automatic beta detection feature determines the optimal sensor external diode/transistor settings. This frees
up the user from providing unique sensor configurations for each temperature monitoring application. These
advanced features plus ±1°C measurement accuracy for both external and internal diode temperatures
provide a low-cost, highly flexible and accurate solution for critical temperature monitoring applications.
Package Type
EMC1812
2X2 WDFN*
V
DD
1
DP
2
DN
3
THERM/ADDR
4
EP
9
EMC1813
2.5X2.0 VDFN*
8
SCL
7
SDA
6
ALERT/THERM2
5
GND
EMC1814
2.5X2.0 VDFN*
V
DD
1
DP1 2
DN1 3
DP2/DN3 4
DN2/DP3 5
EP
11
10 SCL
9 SDA
V
DD
1
DP1 2
DN1 3
DP2 4
DN2 5
EP
11
10 SCL
9 SDA
8 ALERT/THERM2
7 THERM/ADDR
6 GND
8 ALERT/THERM2
7 THERM/ADDR
6 GND
EMC1833
2X2 WDFN*
EMC1815
2.5X2.0 VDFN*
V
DD
1
DP1/DN2 2
DN1/DP2 3
DP3/DN4 4
DN3/DP4 5
EP
11
10 SCL
9 SDA
8 ALERT/THERM2
7 THERM/ADDR
6 GND
V
DD
1
DP1/DN2
2
DN1/DP2
3
THERM/ADDR
4
8
SCL
EP
9
7
SDA
6
ALERT/THERM2
5
GND
Note: 
* Includes Exposed Thermal Pad (EP); see
3. Pin Descriptions
©
2018 Microchip Technology Inc.
Datasheet
DS20005751A-page 2
Multi-Channel Low-Voltage Remote Diode Sensor Family
Functional Block Diagram
©
2018 Microchip Technology Inc.
Datasheet
DS20005751A-page 3
Multi-Channel Low-Voltage Remote Diode Sensor Family
Table of Contents
Features.......................................................................................................................... 1
Typical Applications......................................................................................................... 1
Description.......................................................................................................................1
Package Type..................................................................................................................2
Functional Block Diagram................................................................................................3
1. Electrical Characteristics........................................................................................... 6
1.1.
Absolute Maximum Ratings..........................................................................................................6
2. Typical Operating Curves........................................................................................ 10
3. Pin Descriptions....................................................................................................... 11
3.1.
3.2.
3.3.
3.4.
3.5.
3.6.
3.7.
3.8.
3.9.
3.10.
3.11.
3.12.
3.13.
3.14.
3.15.
Power Supply (V
DD
)................................................................................................................... 12
Diode 1 Pair (DN1/DP1)............................................................................................................. 12
THERM LIMIT ALERT (THERM/ADDR).................................................................................... 12
Ground (GND)............................................................................................................................ 12
Maskable ALERT (ALERT/THERM2).........................................................................................12
SMBus/I
2
C Data (SDA).............................................................................................................. 12
DP/DP1...................................................................................................................................... 12
DN/DN1...................................................................................................................................... 12
DP2............................................................................................................................................ 12
DN2............................................................................................................................................ 12
Anti-Parallel Diode Pair (DP2/DN3 and DN2/DP3).................................................................... 12
Anti-Parallel Diode Pair (DP1/DN2 and DN1/DP2).................................................................... 13
Anti-Parallel Diode Pair (DP3/DN4 and DN3/DP4).................................................................... 13
SMBus Clock (SCL)................................................................................................................... 13
Exposed Thermal Pad (EP)........................................................................................................13
4. Detailed Description................................................................................................ 14
5. System Block Diagram............................................................................................ 15
5.1.
5.2.
5.3.
5.4.
5.5.
5.6.
5.7.
5.8.
5.9.
5.10.
Temperature Measurement........................................................................................................ 15
Temperature Measurement Results and Data............................................................................15
Limit Registers............................................................................................................................16
Limit Register Interaction............................................................................................................17
ALERT/THERM2 Output............................................................................................................ 17
THERM Output...........................................................................................................................18
THERM Pin Address Decoding.................................................................................................. 18
External Diode Connections.......................................................................................................19
Power States.............................................................................................................................. 19
Conversion Rates.......................................................................................................................19
©
2018 Microchip Technology Inc.
Datasheet
DS20005751A-page 4
Multi-Channel Low-Voltage Remote Diode Sensor Family
5.11.
5.12.
5.13.
5.14.
5.15.
5.16.
5.17.
5.18.
5.19.
Dynamic Averaging.................................................................................................................... 20
Digital Filter................................................................................................................................ 21
Beta Compensation....................................................................................................................22
Resistance Error Correction (REC)............................................................................................ 23
Programmable External Diode Ideality Factor............................................................................24
Diode Faults............................................................................................................................... 25
Consecutive Alerts..................................................................................................................... 26
“Hottest Of” Comparison............................................................................................................ 27
Rate of Change.......................................................................................................................... 27
6. System Management Bus Protocol......................................................................... 31
6.1.
6.2.
6.3.
6.4.
6.5.
6.6.
6.7.
6.8.
6.9.
6.10.
SMBus Start Bit.......................................................................................................................... 31
SMBus Address and RD/WR Bit................................................................................................ 31
SMBus ACK and NACK Bits...................................................................................................... 31
SMBus Stop Bit.......................................................................................................................... 31
SMBus Time-Out........................................................................................................................ 31
SMBus and I
2
C Compliance.......................................................................................................32
SMBus Protocols........................................................................................................................32
THERM Pin Considerations....................................................................................................... 34
Register Summary......................................................................................................................35
Data Read Interlock....................................................................................................................38
7. Packaging Information.............................................................................................90
7.1.
Package Marking Information.....................................................................................................90
8. Revision History.......................................................................................................97
The Microchip Web Site................................................................................................ 98
Customer Change Notification Service..........................................................................98
Customer Support......................................................................................................... 98
Product Identification System........................................................................................ 99
Microchip Devices Code Protection Feature............................................................... 100
Legal Notice.................................................................................................................100
Trademarks................................................................................................................. 100
Quality Management System Certified by DNV...........................................................101
Worldwide Sales and Service......................................................................................102
©
2018 Microchip Technology Inc.
Datasheet
DS20005751A-page 5
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参数对比
与EMC1815T-AE/9R相近的元器件有:EMC1812T-2E/RW、EMC1813T-1E/9R、EMC1815T-2E/9R、EMC1833T-AE/RW、EMC1815T-1E/9R、EMC1814T-AE/9R、EMC1813T-AE/9R。描述及对比如下:
型号 EMC1815T-AE/9R EMC1812T-2E/RW EMC1813T-1E/9R EMC1815T-2E/9R EMC1833T-AE/RW EMC1815T-1E/9R EMC1814T-AE/9R EMC1813T-AE/9R
描述 板上安装温度传感器 1.8V 5chnl temp snsr I2C 2alert addrssbl DIGITAL TEMP SENSOR-SERIAL 板上安装温度传感器 1.8V 3chnl temp snsr I2C 2alert addrssbl 板上安装温度传感器 1.8V 5chnl temp snsr I2C 2alert addrssbl 板上安装温度传感器 1.8V 3 chnl temp snsr I2C 2 alerts 板上安装温度传感器 1.8V 5chnl temp snsr I2C 2alert addrssbl 板上安装温度传感器 1.8V 4chnl temp snsr I2C 2alert addrssbl 板上安装温度传感器 1.8V 3chnl temp snsr I2C 2alert addrssbl
厂商名称 Microchip(微芯科技) - Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技)
包装说明 VDFN-10 WDFN-8 - VDFN-10 WDFN-8 VDFN-10 - -
Reach Compliance Code compliant compliant - compliant compliant compliant - -
Factory Lead Time 6 weeks 41 weeks - 6 weeks 7 weeks 6 weeks - -
主体宽度 2 mm 2 mm - 2 mm 2 mm 2 mm - -
主体高度 0.9 mm 0.73 mm - 0.9 mm 0.75 mm 0.9 mm - -
主体长度或直径 2.5 mm 2 mm - 2.5 mm 2 mm 2.5 mm - -
外壳 PLASTIC PLASTIC - PLASTIC PLASTIC PLASTIC - -
安装特点 SURFACE MOUNT SURFACE MOUNT - SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT - -
最大工作电流 0.432 mA 0.432 mA - 0.432 mA 0.432 mA 0.432 mA - -
最高工作温度 125 °C 125 °C - 125 °C 125 °C 125 °C - -
最低工作温度 -40 °C -40 °C - -40 °C -40 °C -40 °C - -
输出接口类型 2-WIRE INTERFACE 2-WIRE INTERFACE - 2-WIRE INTERFACE I2C INTERFACE 2-WIRE INTERFACE - -
封装形状/形式 RECTANGULAR SQUARE - RECTANGULAR SQUARE RECTANGULAR - -
传感器/温度传感器类型 TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL - TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL - -
最大供电电压 3.6 V 3.6 V - 3.6 V 3.6 V 3.6 V - -
最小供电电压 1.62 V 1.62 V - 1.62 V 1.62 V 1.62 V - -
表面贴装 YES YES - YES YES YES - -
端接类型 SOLDER SOLDER - SOLDER SOLDER SOLDER - -
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