EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SO-8
厂商名称:Fairchild
厂商官网:http://www.fairchildsemi.com/
下载文档型号 | FM25C040ULEM8 | FM25C040ULM8X | FM25C040ULZEM8X | FM25C040ULZEN | FM25C040ULMT8X | FM25C040ULEM8X | FM25C040ULZN |
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描述 | EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SO-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 512X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 512X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 |
零件包装代码 | SOIC | SOIC | SOIC | DIP | SOIC | SOIC | DIP |
包装说明 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 | TSSOP, TSSOP8,.25 | SOP, SOP8,.25 | PLASTIC, DIP-8 |
针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大时钟频率 (fCLK) | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
数据保留时间-最小值 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 |
长度 | 4.9 mm | 4.9 mm | 4.9 mm | 9.817 mm | 4.4 mm | 4.9 mm | 9.817 mm |
内存密度 | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
字数代码 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | - | -40 °C | - |
组织 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | SOP | DIP | TSSOP | SOP | DIP |
封装等效代码 | SOP8,.25 | SOP8,.25 | SOP8,.25 | DIP8,.3 | TSSOP8,.25 | SOP8,.25 | DIP8,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
电源 | 2.7/4.5 V | 2.7/4.5 V | 2.7/4.5 V | 2.7/4.5 V | 2.7/4.5 V | 2.7/4.5 V | 2.7/4.5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 5.08 mm | 1.2 mm | 1.75 mm | 5.08 mm |
串行总线类型 | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
最大待机电流 | 0.00001 A | 0.00001 A | 0.000001 A | 0.000001 A | 0.00001 A | 0.00001 A | 0.000001 A |
最大压摆率 | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
最大供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | NO | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
端子形式 | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 0.65 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm | 3 mm | 3.9 mm | 7.62 mm |
最长写入周期时间 (tWC) | 15 ms | 15 ms | 15 ms | 15 ms | 15 ms | 15 ms | 15 ms |
写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 |
JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 | e0 |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Base Number Matches | - | 1 | 1 | 1 | 1 | - | - |