1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc
2 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
3 Isat: Peak current for approximately 20% rolloff at +25°C.
4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L *
ΔI.
Bp-p (mT): (Gauss), K:
(K-factor from table), L: (inductance in
μH), ΔI
(peak-to-peak ripple current in amps).
5 Part Number Definition: FP1308-xxx-R
• FP1308 = Product code and size
• xxx= Inductance value in
μH,
R = decimal point. If no “R” is present, then
third character = # of zeros.
• “-R” suffix = RoHS compliant
Technical Data
DS4313
Effective June 2017
FP1308
High frequency, high current power inductors
Dimensions - mm
Top View
12.95 max.
Bottom View
2.54 (2pl s)
c
Front View
Recommended Pad Layout
7.62
3.18
Schematic
1
7.2
1
5.4
RE F
CO P1
M 30
NE M 8
W EN R3
DE DE -R
SI D
GN FO
S R
13.70 max.
8.0
FP1308- XX
X
wwllyy R
2
2
Left View
8.0 max.
Part Marking: FP1308
xxx = Inductance value in
μH.
(R = Decimal point). If no “R” is present, then last character is # 0f zeros
wwllyy = Date code
R = Revision level
Packaging Information - mm
1.5 dia. +0.1/-0.0
4.0
2.0
1.5 d min
iia.
A
1.75
Section A-A
11.5
24.0 ±0.3
13.9
FP1308
-XXX
wwllyy R
8.2
13.2
User direction of feed
A
Supplied in tape-and-reel packaging, 400 parts per reel, 13” diameter reel.
Temperature Rise vs. Total Loss
100
80
60
40
20
0
Temperature Rise (°C)
0
0.5
1
1.5
Total Loss (W)
2
2.5
3
2
www.eaton.com/electronics
FP1308
High frequency, high current power inductors
Effective June 2017
Technical Data
DS4313
Core Loss
Core Loss vs B p-p
10
1MHz
500kHz 100kHz
300kHz
50kHz
1
RE F
CO P1
M 30
NE M 8
W EN R3
DE DE -R
SI D
GN FO
S R
C o r e L o s s (W )
0.1
0.01
0.001
0.0001
1
10
100
1000
B p-p (mT)
Inductance Characteristics
OCL vs I sat
120%
100%
80%
% of OCL
60%
-40 °C
40%
+25 °C
20%
+125 °C
0%
0%
20%
40%
60%
80%
100%
120%
140%
160%
% of Isat
www.eaton.com/electronics
3
Technical Data
DS4313
Effective June 2017
FP1308
High frequency, high current power inductors
Solder Reflow Profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
T
ab
l
e
1 -
S
t
a
n
da
r
d S
nP
b S
ol
de
r (T c)
Package
Thickness
<2.5mm
_
>2.5mm
Volume
mm
3
<350
235°C
220°C
Volume
mm
3
_
>350
220°C
220°C
RE F
CO P1
M 30
NE M 8
W EN R3
DE DE -R
SI D
GN FO
S R
t
s
Temperature
T
smax
T
ab
l
e
2 - L
ead
(P
b
) Fr
ee S
ol
de
r (T c)
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
Volume
mm
3
<350
260°C
260°C
250°C
Volume
mm
3
350 - 2000
260°C
250°C
245°C
Volume
mm
3
>2000
260°C
245°C
245°C
T
smin
25°C
Time 25°C to Peak
Time
Reference JDEC J-STD-020
Profile Feature
Preheat
and Soak
• T
e
mperature min. (Tsmin)
Standard SnPb Solder
100°C
150°C
60-120 Seconds
Lead (Pb) Free Solder
150°C
200°C
60-120 Seconds
217°C
60-150 Seconds
T
able
2
30
Seconds**
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
L
)
Time
at
liquidous (tL)
3°C/
Second
Max.
183°C
60-150 Seconds
Table 1
20
Seconds**
3°C/
Second
Max.
Peak package
body
temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
6°C/ Second
Max.
6
Minutes Max.
6°C/ Second
Max.
8 Minutes Max.
*
Tolerance for peak profile temperature (Tp) is
defined as a
supplier minimum
and a
user maximum.
**
Tolerance for time
at
peak profile temperature (tp) is
defined as a
supplier minimum
and a
user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Compan . Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant inju y to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
