Fremont Micro Devices
Preliminary FT886xx
High Performance Non-isolated Buck LED Driver
FEATURES
DESCRIPTION
winding
for
sensing
and
FT886x is optimized for low cost non-isolated Buck
switching mode LED driver applications. It operates
in inductor current boundary conduction mode. With
source driving architecture, special demagnetization
sensing technology and the ultra low operating
current, FT886xx doesn’t need the auxiliary winding
FT886x also integrates a 500V power MOSFET that
further improves the system reliability and lowers
the system cost and complexity.
No
Auxiliary
supplying
Inductor current boundary conduction mode
（BCM）
Constant current control without secondary
sense and feedback circuit
Built-in 500V Power MOSFET
±3% LED current accuracy
Ultra low operating current to improve
efficiency
Built-in line compensation
Cycle-by-Cycle current limiting
Precision OVP voltage for best LED open
circuit protection
LED short circuit protection
Over temperature compensation
CS resistor short circuit protection.
Inductor short circuit protection.
VCC under-voltage lockout
Its highly integrated functions such as Leading Edge
Blanking (LEB) and built-in line compensation offer
users a high efficiency and low cost solution for
constant current LED driver applications.
Furthermore, FT886x offers fruitful protections like
LED open and short circuit protection, over
temperature
compensation,
CS
resistor
and
inductor short circuit protection.
The industry leading OVP voltage accuracy ensures
the best LED open circuit protection
Available in SOP8 and DIP8 packages
APPLICATIONS
FM
DC/DC or AC/DC LED Driver Applications
Back Lighting of Flat Panel Displays
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Preliminary FT886xx
TYPICAL APPLICATION CIRCUIT
Figure 1: Typical Application Circuit
ABSOLUTE MAXIMUM RATINGS
VCC to GND…………………………………..………….………………………………………-0.3V to +20V
DRAIN to GND…………………………………...…………………………….……….………-0.3V to +500V
TP to GND………………………………...…………………………………….………….….…………. -0.3V to +20V
Operating Temperature Range…………………………………………………………………..-40℃ to +125℃
Junction Temperature………………………………..……………………………………….. -40℃ to +150℃
Storage Temperature Range ……………………………..……………………………….….-60℃ to +150℃
ESD Protection HBM………………………………………………………………………………………………2000V
ESD Protection MM………………..……………………………….……………………………………………….200V
FM
*
Stresses exceed those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. Functional operation of the device at conditions beyond those listed in the specification
is not guaranteed. Prolonged exposure to extreme conditions may affect device reliability or
functionality.
© 2013 Fremont Micro Devices Inc.
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CS to GND…………………………………………...……………………………………….……..-0.3V to +7V
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Preliminary FT886xx
PIN CONFIGURATION
T o p V ie w
GND
1
NC
VCC
TP
2
3
4
8
7
6
5
CS
CS
D
D
Figure 2: Pin Assignments
TERMINAL DESCRIPTION
No.
1
2
3
4
5,6
7,8
PIN
GND
NC
VCC
TP
D
CS
Ground
No connection
Power supply
Test Point
Internal high voltage MOSFET Drain
Current sense. This pin connects a current sense resistor to GND
Table1
FM
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Preliminary FT886xx
ORDERING INFORMATION
FT886 xx – x x x
Circuit Type
Internal MOS Type
HSF and Packaging
RB: RoHS and Tube
RT: RoHS and T&R
GB: Green and Tube
GT: Green and T&R
Package
Max Output
Internal
MOS
Type
Package
Max
Output
Current
90V-264V
Voltage/Power
en
HSF
Tube
RoHS
T&R
Tube
Green
T&R
Tube
RoHS
T&R
Tube
Green
T&R
RoHS
Tube
Tube
Green
fid
176V-264V
150V/18W
150V/27W
150V/40W
Confidential Rev0.8
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60V/10W
60V/15W
60V/22W
A
SOP8
180mA
C
D
FM
C
SOP8
280mA
CD
DIP8
380mA
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Packaging
Ordering
Code
FT886A-RB
FT886A-RT
FT886A-GB
FT886A-GT
FT886C-RB
FT886C-RT
FT886C-GB
FT886C-GT
FT886CD-DRB
FT886CD-DGB
DS886x-A0-page4
D: DIP8
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Blank: SOP8
Fremont Micro Devices
Preliminary FT886xx
MARKING RULE
①②③④⑤⑥
for internal reference
BLOCK DIAGRAM
fid
15V
en
DRAIN
5,6
Internal reference
& bias
VCC
Constant Current
& Logic Control
4
Figure 3 marking rule
+
-
12.8V/ 9V
UVLO
C
OCP
on
OVP
OTP
Current Sense
VCC
3
VOLTAGE
REGULATOR
tia
TP
LEB
FM
GND
1
D
+
-
0.5V
Figure 4 Block Diagram
© 2013 Fremont Micro Devices Inc.
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