型号
- 型号
- 关键词
SPLD - Simple Programmable Logic Devices 16 Input 8 Output 5V Low Power 10ns
厂商名称：Lattice(莱迪斯)
厂商官网：http://www.latticesemi.com
器件标准：
| 型号 | GAL16V8D-10LPN | GAL16V8D-5LJ | GAL16V8D-25LJN | GAL16V8D-25QPN | GAL16V8D-25QJN | GAL16V8D-10LJN | GAL16V8D-25QPI | GAL16V8D-15LJN | GAL16V8D-15QJN |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | SPLD - Simple Programmable Logic Devices 16 Input 8 Output 5V Low Power 10ns | SPLD - Simple Programmable Logic Devices 16 Input 8 Output 5V Low Power 5ns | SPLD - Simple Programmable Logic Devices 16 Input 8 Output 5V Low Power 25ns | SPLD - Simple Programmable Logic Devices 16 Input 8 Output 5V 1/4 Power 25ns | SPLD - Simple Programmable Logic Devices 16 Input 8 Output 5V 1/4 Power 25ns | SPLD - Simple Programmable Logic Devices 16 Input 8 Output 5V Low Power 10ns | SPLD - Simple Programmable Logic Devices 16 Input 8 Output 5V 1/4 Power 25ns | SPLD - Simple Programmable Logic Devices 16 Input 8 Output 5V Low Power 15ns | SPLD - Simple Programmable Logic Devices 16 Input 8 Output 5V 1/4 Power 15ns |
| 是否无铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 不符合 | 符合 | 符合 | 符合 | 符合 | 不符合 | 符合 | 符合 |
| 厂商名称 | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) |
| 零件包装代码 | DIP | QLCC | QLCC | DIP | QLCC | QLCC | DIP | QLCC | QLCC |
| 包装说明 | LEAD FREE, PLASTIC, DIP-20 | PLASTIC, LCC-20 | LEAD FREE, PLASTIC, LCC-20 | LEAD FREE, PLASTIC, DIP-20 | LEAD FREE, PLASTIC, LCC-20 | QCCJ, LDCC20,.4SQ | PLASTIC, DIP-20 | QCCJ, LDCC20,.4SQ | LEAD FREE, PLASTIC, LCC-20 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | not_compliant | unknown | unknown | unknown | unknown | not_compliant | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| 最大时钟频率 | 66.7 MHz | 142.8 MHz | 37 MHz | 37 MHz | 37 MHz | 66.7 MHz | 37 MHz | 45.5 MHz | 45.5 MHz |
| JESD-30 代码 | R-PDIP-T20 | S-PQCC-J20 | S-PQCC-J20 | R-PDIP-T20 | S-PQCC-J20 | S-PQCC-J20 | R-PDIP-T20 | S-PQCC-J20 | S-PQCC-J20 |
| JESD-609代码 | e3 | e0 | e3 | e3 | e3 | e3 | e0 | e3 | e3 |
| 长度 | 26.162 mm | 8.9662 mm | 8.9662 mm | 26.162 mm | 8.9662 mm | 8.9662 mm | 26.162 mm | 8.9662 mm | 8.9662 mm |
| 专用输入次数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| I/O 线路数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 输入次数 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| 输出次数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 产品条款数 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C |
| 组织 | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | QCCJ | QCCJ | DIP | QCCJ | QCCJ | DIP | QCCJ | QCCJ |
| 封装等效代码 | DIP20,.3 | LDCC20,.4SQ | LDCC20,.4SQ | DIP20,.3 | LDCC20,.4SQ | LDCC20,.4SQ | DIP20,.3 | LDCC20,.4SQ | LDCC20,.4SQ |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 225 | 250 | NOT SPECIFIED | 250 | 250 | 225 | 250 | 250 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 10 ns | 5 ns | 25 ns | 25 ns | 25 ns | 10 ns | 25 ns | 15 ns | 15 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.334 mm | 4.572 mm | 4.572 mm | 5.334 mm | 4.572 mm | 4.572 mm | 5.334 mm | 4.572 mm | 4.572 mm |
| 最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V |
| 最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | YES | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND | J BEND |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | QUAD | DUAL | QUAD | QUAD | DUAL | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | 40 | NOT SPECIFIED | 40 | 40 | 30 | 40 | 40 |
| 宽度 | 7.62 mm | 8.9662 mm | 8.9662 mm | 7.62 mm | 8.9662 mm | 8.9662 mm | 7.62 mm | 8.9662 mm | 8.9662 mm |
| 湿度敏感等级 | - | 1 | 1 | - | 1 | 1 | - | 1 | 1 |
ARM技术
FPGA/CPLD
嵌入式系统
模拟电子
stm32/stm8
模拟与混合信号
