型号
- 型号
- 关键词
EE PLD, 30ns, PLS-Type, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24
厂商名称：Lattice(莱迪斯)
厂商官网：http://www.latticesemi.com
下载文档| 型号 | GAL6001-30P | GAL6001-35P | GAL6001-35J | GAL6001-30J |
|---|---|---|---|---|
| 描述 | EE PLD, 30ns, PLS-Type, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | EE PLD, 35ns, PLS-Type, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | EE PLD, 35ns, PLS-Type, CMOS, PQCC28, PLASTIC, LCC-28 | EE PLD, 30ns, PLS-Type, CMOS, PQCC28, PLASTIC, LCC-28 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | QLCC | QLCC |
| 包装说明 | 0.300 INCH, PLASTIC, DIP-24 | DIP, DIP24,.3 | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ |
| 针数 | 24 | 24 | 28 | 28 |
| Reach Compliance Code | not_compliant | not_compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | PAL WITH MACROCELLS; 38 MACROCELLS; 2 EXTERNAL CLOCKS; INPUT MACROCELLS; BURIED MACROCELLS | PAL WITH MACROCELLS; 38 MACROCELLS; 2 EXTERNAL CLOCKS; INPUT MACROCELLS; BURIED MACROCELLS | PAL WITH MACROCELLS; 38 MACROCELLS; 2 EXTERNAL CLOCKS; INPUT MACROCELLS; BURIED MACROCELLS | PAL WITH MACROCELLS; 38 MACROCELLS; 2 EXTERNAL CLOCKS; INPUT MACROCELLS; BURIED MACROCELLS |
| 架构 | PLS-TYPE | PLS-TYPE | PLS-TYPE | PLS-TYPE |
| 最大时钟频率 | 27 MHz | 22.9 MHz | 22.9 MHz | 27 MHz |
| JESD-30 代码 | R-PDIP-T24 | R-PDIP-T24 | S-PQCC-J28 | S-PQCC-J28 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 31.855 mm | 31.855 mm | 11.5062 mm | 11.5062 mm |
| 专用输入次数 | 10 | 10 | 10 | 10 |
| I/O 线路数量 | 10 | 10 | 10 | 10 |
| 输入次数 | 20 | 20 | 20 | 20 |
| 输出次数 | 10 | 10 | 10 | 10 |
| 产品条款数 | 75 | 75 | 75 | 75 |
| 端子数量 | 24 | 24 | 28 | 28 |
| 最高工作温度 | 75 °C | 75 °C | 75 °C | 75 °C |
| 组织 | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | QCCJ | QCCJ |
| 封装等效代码 | DIP24,.3 | DIP24,.3 | LDCC28,.5SQ | LDCC28,.5SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 30 ns | 35 ns | 35 ns | 30 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm |
| 最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | QUAD |
| 宽度 | 7.62 mm | 7.62 mm | 11.5062 mm | 11.5062 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
