GD74HC193D,GD74HC193D pdf中文资料,GD74HC193D引脚图,GD74HC193D电路-Datasheet-电子工程世界

参数对比

与GD74HC193D相近的元器件有：GD74HCT193D、GD54HCT193J、GD74HC193J、GD54HC193J、GD74HC193、GD74HCT193、GD74HCT193J。描述及对比如下：

型号	GD74HC193D	GD74HCT193D	GD54HCT193J	GD74HC193J	GD54HC193J	GD74HC193	GD74HCT193	GD74HCT193J
描述	Binary Counter, Synchronous, Bidirectional, CMOS, PDSO16,	Binary Counter, Synchronous, Bidirectional, CMOS, PDSO16,	Binary Counter, Synchronous, Bidirectional, CMOS, CDIP16,	Binary Counter, Synchronous, Bidirectional, CMOS, CDIP16,	Binary Counter, Synchronous, Bidirectional, CMOS, CDIP16,	Binary Counter, Synchronous, Bidirectional, CMOS, PDIP16,	Binary Counter, Synchronous, Bidirectional, CMOS, PDIP16,	Binary Counter, Synchronous, Bidirectional, CMOS, CDIP16,
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	LG Semicon Co Ltd	LG Semicon Co Ltd	LG Semicon Co Ltd	LG Semicon Co Ltd	LG Semicon Co Ltd	LG Semicon Co Ltd	LG Semicon Co Ltd	LG Semicon Co Ltd
Reach Compliance Code	unknow	unknown	unknown	unknown	unknown	unknow	unknow	unknow
计数方向	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL
JESD-30 代码	R-PDSO-G16	R-PDSO-G16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-PDIP-T16	R-XDIP-T16
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0
负载电容（CL）	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
负载/预设输入	YES	YES	YES	YES	YES	YES	YES	YES
逻辑集成电路类型	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER
最大I（ol）	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
功能数量	1	1	1	1	1	1	1	1
端子数量	16	16	16	16	16	16	16	16
最高工作温度	85 °C	85 °C	125 °C	85 °C	125 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-55 °C	-40 °C	-55 °C	-40 °C	-40 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
封装代码	SOP	SOP	DIP	DIP	DIP	DIP	DIP	DIP
封装等效代码	SOP16,.25	SOP16,.25	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
电源	2/6 V	5 V	5 V	2/6 V	2/6 V	2/6 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
表面贴装	YES	YES	NO	NO	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	MILITARY	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
端子节距	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
包装说明	SOP, SOP16,.25	SOP, SOP16,.25	-	-	-	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3

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