参数对比
与GD74HCT08J相近的元器件有:GD74HC08J、GD74HC08D、SLVU2.8-4、GD74HCT08、GD74HCT08D、GD54HCT08J、GD54HC08J。描述及对比如下:
型号 |
GD74HCT08J |
GD74HC08J |
GD74HC08D |
SLVU2.8-4 |
GD74HCT08 |
GD74HCT08D |
GD54HCT08J |
GD54HC08J |
描述 |
AND Gate, CMOS, CDIP14, |
AND Gate, CMOS, CDIP14, |
AND Gate, CMOS, PDSO14, |
2.8V TVS Array For ESD and Latch-Up Protection |
AND Gate, CMOS, PDIP14, |
AND Gate, CMOS, PDSO14, |
AND Gate, CMOS, CDIP14, |
AND Gate, CMOS, CDIP14, |
是否Rohs认证 |
不符合 |
不符合 |
不符合 |
- |
不符合 |
不符合 |
不符合 |
不符合 |
Reach Compliance Code |
unknown |
unknown |
unknown |
- |
unknown |
unknown |
unknown |
unknown |
JESD-30 代码 |
R-XDIP-T14 |
R-XDIP-T14 |
R-PDSO-G14 |
- |
R-PDIP-T14 |
R-PDSO-G14 |
R-XDIP-T14 |
R-XDIP-T14 |
JESD-609代码 |
e0 |
e0 |
e0 |
- |
e0 |
e0 |
e0 |
e0 |
负载电容(CL) |
50 pF |
50 pF |
50 pF |
- |
50 pF |
50 pF |
50 pF |
50 pF |
逻辑集成电路类型 |
AND GATE |
AND GATE |
AND GATE |
- |
AND GATE |
AND GATE |
AND GATE |
AND GATE |
最大I(ol) |
0.004 A |
0.004 A |
0.004 A |
- |
0.004 A |
0.004 A |
0.004 A |
0.004 A |
端子数量 |
14 |
14 |
14 |
- |
14 |
14 |
14 |
14 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
- |
85 °C |
85 °C |
125 °C |
125 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
- |
-40 °C |
-40 °C |
-55 °C |
-55 °C |
封装主体材料 |
CERAMIC |
CERAMIC |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
CERAMIC |
CERAMIC |
封装代码 |
DIP |
DIP |
SOP |
- |
DIP |
SOP |
DIP |
DIP |
封装等效代码 |
DIP14,.3 |
DIP14,.3 |
SOP14,.25 |
- |
DIP14,.3 |
SOP14,.25 |
DIP14,.3 |
DIP14,.3 |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
IN-LINE |
IN-LINE |
SMALL OUTLINE |
- |
IN-LINE |
SMALL OUTLINE |
IN-LINE |
IN-LINE |
电源 |
5 V |
2/6 V |
2/6 V |
- |
5 V |
5 V |
5 V |
2/6 V |
Prop。Delay @ Nom-Sup |
30 ns |
23 ns |
23 ns |
- |
30 ns |
30 ns |
36 ns |
27 ns |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
施密特触发器 |
NO |
NO |
NO |
- |
NO |
NO |
NO |
NO |
表面贴装 |
NO |
NO |
YES |
- |
NO |
YES |
NO |
NO |
技术 |
CMOS |
CMOS |
CMOS |
- |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
INDUSTRIAL |
INDUSTRIAL |
MILITARY |
MILITARY |
端子面层 |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
- |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
端子形式 |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
- |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
端子节距 |
2.54 mm |
2.54 mm |
1.27 mm |
- |
2.54 mm |
1.27 mm |
2.54 mm |
2.54 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
- |
DUAL |
DUAL |
DUAL |
DUAL |
Base Number Matches |
1 |
1 |
1 |
- |
1 |
1 |
- |
- |