首页 > 器件类别 > 半导体 > 其他集成电路(IC)

GL82HM175 S R30W

Chipsets CHIPSET

器件类别:半导体    其他集成电路(IC)   

厂商名称:Intel(英特尔)

厂商官网:http://www.intel.com/

器件标准:

下载文档
器件参数
参数名称
属性值
Product Attribute
Attribute Value
制造商
Manufacturer
Intel(英特尔)
产品种类
Product Category
Chipsets
RoHS
Details
产品
Product
Mobile Chipsets
类型
Type
PCH
Code Name
Skylake
Embedded Options
Embedded
PCIe Revision
3.0
PCIe Configurations
16 Lanes, x1, x2, x4
Integrated Graphics
Without Graphics
Number of USB Ports
14
Number of SATA Ports
4
TDP - Max
2.6 W
系列
Packaging
Reel
长度
Length
23 mm
宽度
Width
23 mm
安装风格
Mounting Style
SMD/SMT
Number of Displays Supported
3 Display
工厂包装数量
Factory Pack Quantity
725
USB Revision
3.0/2.0
文档预览
Intel
®
100 Series and Intel
®
C230
Series Chipset Family Platform
Controller Hub (PCH)
Datasheet – Volume 1 of 2
May 2016
Document Number: 332690-004EN
You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel
products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted
which includes subject matter disclosed herein.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
Intel technologies may require enabled hardware, specific software, or services activation. Check with your system manufacturer
or retailer.
All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel
product specifications and roadmaps
The products described in this document may contain design defects or errors known as errata which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any
damages resulting from such losses.
Warning: Altering PC clock or memory frequency and/or voltage may (i) reduce system stability and use life of the system,
memory and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system
performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel assumes no responsibility that
the memory, included if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. Check with
memory manufacturer for warranty and additional details.
Code names featured are used internally within Intel to identify products that are in development and not yet publicly announced
for release. Customers, licensees and other third parties are not authorized by Intel to use code names in advertising, promotion or
marketing of any product or services and any such use of Intel's internal code names is at the sole risk of the user.
I
2
C is a two-wire communications bus/protocol developed by NXP. SMBus is a subset of the I2C bus/protocol and was developed by
Intel. Implementations of the I2C bus/protocol may require licenses from various entities, including NXP Semiconductors N.V.
Intel
®
Active Management Technology (Intel
®
AMT) requires activation and a system with a corporate network connection, an
Intel
®
AMT-enabled chipset, network hardware and software. For notebooks, Intel AMT may be unavailable or limited over a host
OS-based VPN, when connecting wirelessly, on battery power, sleeping, hibernating or powered off. Results dependent upon
hardware, setup & configuration. For more information, visit http://www.intel.com/technology/platform-technology/intel-amt
Intel
®
High Definition Audio (Intel
®
HD Audio) Requires an Intel
®
HD Audio enabled system. Consult your PC manufacturer for
more information. Sound quality will depend on equipment and actual implementation. For more information about Intel HD Audio,
visit http://www.intel.com/design/chipsets/hdaudio.htm.
Intel
®
Rapid Storage Technology (Intel
®
RST) requires a select Intel
®
processor, enabled chipset, and Intel
®
Rapid Storage
Technology (Intel
®
RST) software.
Intel
®
Smart Response Technology requires a Intel
®
Core™ processor, select Intel
®
chipset, Intel
®
Rapid Storage Technology
software version 12.5 or higher, and a solid state hybrid drive reporting at least 16GB capacity and supporting SATA-IO hybrid
information feature. Depending on system configuration, your results may vary. Contact your system manufacturer for more
information.
No computer system can provide absolute security under all conditions. Intel
®
Trusted Execution Technology (Intel
®
TXT) requires
a computer system with Intel
®
Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code
Modules and an Intel TXT-compatible Measured Launched Environment (MLE). Intel TXT also requires the system to contain a TPM
v1.s. For more information, visit http://www.intel.com/technology/security.
Intel
®
Virtualization Technology requires a computer system with an enabled Intel processor, BIOS, virtual machine monitor
(VMM). Functionality, performance or other benefits will vary depending on hardware and software configurations. Software
applications may not be compatible with all operating systems. Consult your PC manufacturer. For more information, visit http://
www.intel.com/go/virtualization
Intel, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2015-2016, Intel Corporation
2
Datasheet, Volume 1
Contents
1
Introduction
............................................................................................................ 19
1.1
About this Manual ............................................................................................. 19
1.2
References ....................................................................................................... 19
1.3
Overview ......................................................................................................... 19
1.4
PCH SKUs ........................................................................................................ 21
PCH Controller Device IDs
....................................................................................... 25
2.1
Device and Revision ID Table .............................................................................. 25
Flexible I/O
............................................................................................................. 27
3.1
Acronyms......................................................................................................... 27
3.2
References ....................................................................................................... 27
3.3
Overview ......................................................................................................... 27
3.4
Description ....................................................................................................... 27
3.4.1 PCH-H Flexible I/O ................................................................................. 28
3.5
HSIO Port Selection ........................................................................................... 29
3.5.1 PCIe/SATA Port Selection ........................................................................ 29
Memory Mapping
..................................................................................................... 31
4.1
Overview ......................................................................................................... 31
4.2
Functional Description........................................................................................ 31
4.2.1 PCI Devices and Functions....................................................................... 31
4.2.2 Fixed I/O Address Ranges ....................................................................... 32
4.2.3 Variable I/O Decode Ranges .................................................................... 34
4.3
Memory Map..................................................................................................... 35
4.3.1 Boot Block Update Scheme ...................................................................... 37
System Management
............................................................................................... 39
5.1
Acronyms......................................................................................................... 39
5.2
References ....................................................................................................... 39
5.3
Overview ......................................................................................................... 39
5.4
Features .......................................................................................................... 39
5.4.1 Theory of Operation................................................................................ 40
5.4.1.1 Detecting a System Lockup ........................................................ 40
5.4.1.2 Handling an Intruder ................................................................. 40
5.4.1.3 Detecting Improper Flash Programming ....................................... 40
5.4.2 TCO Modes ............................................................................................ 41
5.4.2.1 TCO Compatible Mode ............................................................... 41
5.4.2.2 Advanced TCO Mode ................................................................. 42
High Precision Event Timer (HPET)
.......................................................................... 43
6.1
References ....................................................................................................... 43
6.2
Overview ......................................................................................................... 43
6.2.1 Timer Accuracy ...................................................................................... 43
6.2.2 Timer Off-load ....................................................................................... 43
6.2.3 Off-loadable Timer.................................................................................. 44
6.2.4 Interrupt Mapping .................................................................................. 45
6.2.4.1 Mapping Option #1 (Legacy Replacement Option) ......................... 45
6.2.4.2 Mapping Option #2 (Standard Option) ......................................... 45
6.2.4.3 Mapping Option #3 (Processor Message Option)............................ 45
6.2.5 Periodic Versus Non-Periodic Modes .......................................................... 46
6.2.5.1 Non-Periodic Mode .................................................................... 46
6.2.5.2 Periodic Mode ........................................................................... 46
2
3
4
5
6
Datasheet, Volume 1
3
6.2.6
6.2.7
6.2.8
6.2.9
7
Enabling the Timers ................................................................................46
Interrupt Levels......................................................................................47
Handling Interrupts.................................................................................47
Issues Related to 64-Bit Timers with 32-Bit Processors ................................47
Thermal Management
..............................................................................................49
7.1
PCH Thermal Sensor ..........................................................................................49
7.1.1 Modes of Operation .................................................................................49
7.1.2 Temperature Trip Point............................................................................49
7.1.3 Thermal Sensor Accuracy (Taccuracy) .......................................................49
7.1.4 Thermal Reporting to an EC .....................................................................49
7.1.5 Thermal Trip Signal (PCHHOT#) ...............................................................50
Power and Ground Signals
.......................................................................................51
Pin Straps
................................................................................................................53
Electrical Characteristics..........................................................................................57
10.1 Absolute Maximum Ratings .................................................................................57
10.2 Thermal Specification .........................................................................................57
10.3 PCH Power Supply Range....................................................................................58
10.4 General DC Characteristics..................................................................................58
10.5 AC Characteristics..............................................................................................69
10.5.1 Panel Power Sequencing and Backlight Control ...........................................71
10.6 Overshoot/Undershoot Guidelines ........................................................................89
Ballout Definition
.....................................................................................................91
8254 Timers...........................................................................................................
103
12.1 Overview ........................................................................................................ 103
12.1.1 Timer Programming .............................................................................. 103
12.1.2 Reading from the Interval Timer ............................................................. 104
12.1.2.1 Simple Read ........................................................................... 104
12.1.2.2 Counter Latch Command .......................................................... 105
12.1.2.3 Read Back Command ............................................................... 105
Integrated High Definition Audio
........................................................................... 107
13.1 Acronyms ....................................................................................................... 107
13.2 References...................................................................................................... 107
13.3 Overview ........................................................................................................ 107
13.4 Signal Description ............................................................................................ 107
13.5 Integrated Pull-Ups and Pull-Downs.................................................................... 108
13.6 I/O Signal Planes and States ............................................................................. 109
13.7 Features ......................................................................................................... 109
13.7.1 High Definition Audio Controller Capabilities ............................................. 109
13.7.2 Audio DSP Capabilities........................................................................... 110
13.7.3 High Definition Audio Link Capabilities ..................................................... 110
13.7.4 Display Audio Link Capabilities................................................................ 110
13.7.5 DSP I/O Peripherals Capabilities.............................................................. 110
Controller Link
....................................................................................................... 111
14.1 Overview ........................................................................................................ 111
14.2 Signal Description ............................................................................................ 111
14.3 Integrated Pull-Ups and Pull-Downs.................................................................... 111
14.4 I/O Signal Planes and States ............................................................................. 111
14.5 Functional Description ......................................................................................111
8
9
10
11
12
13
14
4
Datasheet, Volume 1
15
Processor Sideband Signals
................................................................................... 113
15.1 Acronyms....................................................................................................... 113
15.2 Overview ....................................................................................................... 113
15.3 Signal Description ........................................................................................... 113
15.4 Integrated Pull-Ups and Pull-Downs ................................................................... 113
15.5 I/O Signal Planes and States............................................................................. 113
15.6 Functional Description...................................................................................... 114
Digital Display Signals
........................................................................................... 115
16.1 Acronyms....................................................................................................... 115
16.2 References ..................................................................................................... 115
16.3 Signal Description ........................................................................................... 115
16.4 Embedded DisplayPort* (eDP*) Backlight Control Signals ..................................... 116
16.5 Integrated Pull-Ups and Pull-Downs ................................................................... 116
16.6 I/O Signal Planes and States............................................................................. 116
Enhanced Serial Peripheral Interface (eSPI)
......................................................... 119
17.1 Acronyms....................................................................................................... 119
17.2 References ..................................................................................................... 119
17.3 Overview ....................................................................................................... 119
17.4 Signal Description ........................................................................................... 119
17.5 Integrated Pull-Ups and Pull-Downs ................................................................... 120
17.6 I/O Signal Planes and States............................................................................. 120
17.7 Functional Description...................................................................................... 120
17.7.1 Features ............................................................................................. 120
17.7.2 Protocols ............................................................................................. 121
17.7.3 WAIT States from eSPI Slave ................................................................. 122
17.7.4 In-Band Link Reset ............................................................................... 122
17.7.5 Slave Discovery ................................................................................... 122
17.7.6 Channels and Supported Transactions ..................................................... 122
17.7.6.1 Peripheral Channel (Channel 0) Overview................................... 122
17.7.6.2 Virtual Wire Channel (Channel 1) Overview ................................ 123
17.7.6.3 Out-of-Band Channel (Channel 2) Overview ............................... 124
17.7.6.4 Flash Access Channel (Channel 3) Overview ............................... 126
General Purpose Input and Output (GPIO)
............................................................ 129
18.1 Acronyms....................................................................................................... 129
18.2 References ..................................................................................................... 129
18.3 Overview ....................................................................................................... 129
18.4 Signal Description ........................................................................................... 130
18.5 Integrated Pull-ups and Pull-downs.................................................................... 141
18.6 Functional Description...................................................................................... 141
18.6.1 SMI# / SCI and NMI ............................................................................. 141
18.6.2 Blink/PWM Capability ............................................................................ 141
18.6.2.1 PWM Programing Sequence ...................................................... 142
18.6.3 Triggering ........................................................................................... 143
18.6.4 Sx GPIO Implementation Considerations ................................................. 143
18.6.5 GPIO Ownership................................................................................... 144
18.6.6 GPIO Pad Voltage Tolerance Configuration ............................................... 144
Intel
®
Serial I/O Generic SPI (GSPI) Controllers...................................................
145
19.1 Acronyms....................................................................................................... 145
19.2 References ..................................................................................................... 145
19.3 Overview ....................................................................................................... 145
19.4 Signal Description ........................................................................................... 145
19.5 Integrated Pull-Ups and Pull-Downs ................................................................... 146
19.6 I/O Signal Planes and States............................................................................. 146
16
17
18
19
Datasheet, Volume 1
5
查看更多>
参数对比
与GL82HM175 S R30W相近的元器件有:GLC232-S-R2CB、GLQ150-S-R2C6、GLZ170-S-R2C9、GL82CM238 S R30U。描述及对比如下:
型号 GL82HM175 S R30W GLC232-S-R2CB GLQ150-S-R2C6 GLZ170-S-R2C9 GL82CM238 S R30U
描述 Chipsets CHIPSET Chipsets CHIPSET Chipsets CHIPSET Chipsets CHIPSET Chipsets CHIPSET
Product Attribute Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value
制造商
Manufacturer
Intel(英特尔) Intel(英特尔) Intel(英特尔) Intel(英特尔) Intel(英特尔)
产品种类
Product Category
Chipsets Chipsets Chipsets Chipsets Chipsets
RoHS Details Details Details Details Details
产品
Product
Mobile Chipsets Server Chipsets Desktop Chipsets Desktop Chipsets Mobile Chipsets
类型
Type
PCH PCH PCH PCH PCH
Code Name Skylake Skylake Skylake Skylake Skylake
Embedded Options Embedded Non-Embedded Non-Embedded Non-Embedded Embedded
PCIe Revision 3.0 3.0 2.0/3.0 3.0 3.0
PCIe Configurations 16 Lanes, x1, x2, x4 8 Lanes, x1, x2, x4 10 Lanes, x1, x2, x4 20 Lanes, x1, x2, x4 20 Lanes, x1, x2, x4
Integrated Graphics Without Graphics Without Graphics Without Graphics Without Graphics Without Graphics
Number of USB Ports 14 12 14 14 14
Number of SATA Ports 4 6 6 6 8
TDP - Max 2.6 W 6 W 6 W 6 W 3.67 W
系列
Packaging
Reel Reel Reel Reel Reel
长度
Length
23 mm 23 mm 23 mm 23 mm 23 mm
宽度
Width
23 mm 23 mm 23 mm 23 mm 23 mm
安装风格
Mounting Style
SMD/SMT SMD/SMT SMD/SMT SMD/SMT SMD/SMT
Number of Displays Supported 3 Display 0 Display 3 Display 3 Display 3 Display
工厂包装数量
Factory Pack Quantity
725 725 725 725 725
USB Revision 3.0/2.0 3.0/2.0 3.0 - 3.0/2.0
热门器件
热门资源推荐
器件捷径:
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
需要登录后才可以下载。
登录取消