SRAM 3.3V 256K x 8 2M I Temp
厂商名称:GSI Technology
厂商官网:http://www.gsitechnology.com/
器件标准:
下载文档型号 | GS72108AGP-12I | GS72108AGP-7I | GS72108AGP-8I | GS72108AGP-10 | GS72108AGP-7 | GS72108AGP-12 |
---|---|---|---|---|---|---|
描述 | SRAM 3.3V 256K x 8 2M I Temp | SRAM 3.3V 256K x 8 2M I Temp | SRAM 3.3V 256K x 8 2M I Temp | SRAM 3.3V 256K x 8 2M C Temp | SRAM 3.3V 256K x 8 2M C Temp | SRAM 3.3V 256K x 8 2M C Temp |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology |
零件包装代码 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
包装说明 | TSOP2, TSOP44,.46,32 | 0.400 INCH, LEAD FREE, TSOP2-44 | 0.400 INCH, TSOP2-44 | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 |
针数 | 44 | 44 | 44 | 44 | 44 | 44 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
Factory Lead Time | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 6 weeks |
最长访问时间 | 12 ns | 7 ns | 8 ns | 10 ns | 7 ns | 12 ns |
JESD-30 代码 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 |
长度 | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm |
内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 44 | 44 | 44 | 44 | 44 | 44 |
字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C |
组织 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Pure Matte Tin (Sn) | Pure Matte Tin (Sn) | Pure Matte Tin (Sn) | Pure Matte Tin (Sn) | Pure Matte Tin (Sn) | Pure Matte Tin (Sn) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
I/O 类型 | COMMON | - | - | COMMON | COMMON | COMMON |
输出特性 | 3-STATE | - | - | 3-STATE | 3-STATE | 3-STATE |
可输出 | YES | - | - | YES | YES | YES |
封装等效代码 | TSOP44,.46,32 | - | - | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 |
最大待机电流 | 0.02 A | - | - | 0.02 A | 0.025 A | 0.015 A |
最小待机电流 | 3 V | - | - | 3 V | 3 V | 3 V |
最大压摆率 | 0.085 mA | - | - | 0.095 mA | 0.135 mA | 0.08 mA |