Hardware
Documentation
Data S h e e t
HAL 300
Differential Hall Effect
Sensor IC
®
Edition Nov. 24, 2008
DSH000016_002EN
HAL300
Copyright, Warranty, and Limitation of Liability
The information and data contained in this document are
believed to be accurate and reliable. The software and
proprietary information contained therein may be pro-
tected by copyright, patent, trademark and/or other intel-
lectual property rights of Micronas. All rights not ex-
pressly granted remain reserved by Micronas.
Micronas assumes no liability for errors and gives no
warranty representation or guarantee regarding the suit-
ability of its products for any particular purpose due to
these specifications.
By this publication, Micronas does not assume responsi-
bility for patent infringements or other rights of third par-
ties which may result from its use. Commercial condi-
tions, product availability and delivery are exclusively
subject to the respective order confirmation.
Any information and data which may be provided in the
document can and do vary in different applications, and
actual performance may vary over time.
All operating parameters must be validated for each cus-
tomer application by customers technical experts. Any
new issue of this document invalidates previous issues.
Micronas reserves the right to review this document and
to make changes to the documents content at any time
without obligation to notify any person or entity of such
revision or changes. For further advice please contact
us directly.
Do not use our products in life-supporting systems, avi-
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cronas products are not designed, intended or autho-
rized for use as components in systems intended for sur-
gical implants into the body, or other applications
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plication in which the failure of the product could create
a situation where personal injury or death could occur.
No part of this publication may be reproduced, photoco-
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Micronas Trademarks
– HAL
Micronas Patents
DATA SHEET
Choppered Offset Compensation protected by Micronas
patents no. US5260614A, US5406202A, EP052523B1,
and EP0548391B1.
Third-Party Trademarks
All other brand and product names or company names
may be trademarks of their respective companies.
2
Micronas
DATA SHEET
HAL300
Contents
Page
4
4
4
4
5
5
5
6
7
7
12
12
12
12
13
14
15
20
20
20
20
21
22
Section
1.
1.1.
1.2.
1.3.
1.4.
1.5.
1.6.
2.
3.
3.1.
3.2.
3.3.
3.4.
3.4.1.
3.5.
3.6.
3.7.
4.
4.1.
4.2.
4.3.
4.4.
5.
Title
Introduction
Features
Marking Code
Operating Junction Temperature Range
Hall Sensor Package Codes
Solderability and Welding
Pin Connections
Functional Description
Specifications
Outline Dimensions
Dimensions of Sensitive Area
Positions of Sensitive Areas
Absolute Maximum Ratings
Storage and Shelf Life
Recommended Operating Conditions
Characteristics
Magnetic Characteristics
Application Notes
Ambient Temperature
Extended Operating Conditions
Start-up Behavior
EMC and ESD
Data Sheet History
Micronas
3
HAL300
Differential Hall Effect Sensor IC
in CMOS technology
Release Notes: Revision bars indicate significant
changes to the previous edition.
1. Introduction
The HAL 300 is a differential Hall switch produced in
CMOS technology. The sensor includes 2 temperature-
compensated Hall plates (2.05 mm apart) with active off-
set compensation, a differential amplifier with a Schmitt
trigger, and an open-drain output transistor (see Fig.
2–1).
The HAL 300 is a differential sensor which responds to
spatial differences of the magnetic field. The Hall volt-
ages at the two Hall plates, S
1
and S
2
, are amplified with
a differential amplifier. The differential signal is
compared with the actual switching level of the internal
Schmitt trigger. Accordingly, the output transistor is
switched on or off.
The sensor has a bipolar switching behavior and re-
quires positive and negative values of
ΔB
= B
S1
– B
S2
for
correct operation.
The HAL 300 is an ideal sensor for applications with a ro-
tating multi-pole-ring in front of the branded side of the
package (see Fig. 3–1, Fig. 3–2 and Fig. 3–3), such as
ignition timing and revolution counting.
For applications in which a magnet is mounted on the
back side of the package (back-biased applications), the
HAL320 is recommended.
The active offset compensation leads to constant mag-
netic characteristics over supply voltage and tempera-
ture.
The sensor is designed for industrial and automotive ap-
plications and operates with supply voltages from 4.5 V
to 24 V in the ambient temperature range from –40
°C
up to 150
°C.
The HAL 300 is available in the SMD-package
SOT89B-2 and in the leaded versions TO92UA-3 and
TO92UA-4.
1.1. Features:
DATA SHEET
– distance between Hall plates: 2.05 mm
– operates from 4.5 V to 24 V supply voltage
– switching offset compensation at 62 kHz
– overvoltage protection
– reverse-voltage protection at V
DD
-pin
– short-circuit protected open-drain output by thermal
shutdown
– operates with magnetic fields from DC to 10 kHz
– output turns low with magnetic south pole on branded
side of package and with a higher magnetic flux densi-
ty in sensitive area S1 as in S2
– on-chip temperature compensation circuitry mini-
mizes shifts of the magnetic parameters over temper-
ature and supply voltage range
– the decrease of magnetic flux density caused by rising
temperature in the sensor system is compensated by
a built-in negative temperature coefficient of hystere-
sis
– EMC corresponding to ISO 7637
1.2. Marking Code
Type
Temperature Range
A
HAL300
300A
K
300K
1.3. Operating Junction Temperature Range (T
J
)
A:
T
J
= –40
°C
to +170
°C
K:
T
J
= –40
°C
to +140
°C
The relationship between ambient temperature (T
A
) and
junction temperature (T
J
) is explained in section 4.1. on
page 20.
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Micronas
DATA SHEET
HAL300
1.4. Hall Sensor Package Codes
HALXXXPA-T
Temperature Range: A or K
Package: SF for SOT89B-2,
UA for TO92UA
Type: 300
Example:
HAL300UA-K
→
Type: 300
→
Package: TO92UA
→
Temperature Range: T
J
= –40
°C
to +140
°C
Hall sensors are available in a wide variety of packaging
versions and quantities. For more detailed information,
please refer to the brochure: “Hall Sensors: Ordering
Codes, Packaging, Handling”.
1.5. Solderability and Welding
Soldering
During soldering reflow processing and manual rework-
ing, a component body temperature of 260
°C
should not
be exceeded.
Welding
Device terminals should be compatible with laser and re-
sistance welding. Please note that the success of the
welding process is subject to different welding parame-
ters which will vary according to the welding technique
used. A very close control of the welding parameters is
absolutely necessary in order to reach satisfying results.
Micronas, therefore, does not give any implied or ex-
press warranty as to the ability to weld the component.
1.6. Pin Connections
V
DD
1
OUT
3
2
GND
Fig. 1–1:
Pin configuration
Micronas
5
