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HCD64338024

Microcontroller, MROM, 8MHz, CMOS, 3.99 X 3.99 MM, DIE-81

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Hitachi (Renesas )

厂商官网:http://www.renesas.com/eng/

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器件参数
参数名称
属性值
厂商名称
Hitachi (Renesas )
零件包装代码
DIE
包装说明
DIE,
针数
81
Reach Compliance Code
unknown
具有ADC
YES
其他特性
OPERATES AT 1.8V MIN SUPPLY
地址总线宽度
最大时钟频率
16 MHz
DAC 通道
NO
DMA 通道
NO
外部数据总线宽度
JESD-30 代码
S-XUUC-N81
I/O 线路数量
66
端子数量
81
最高工作温度
75 °C
最低工作温度
-20 °C
PWM 通道
YES
封装主体材料
UNSPECIFIED
封装代码
DIE
封装形状
SQUARE
封装形式
UNCASED CHIP
认证状态
Not Qualified
ROM可编程性
MROM
速度
8 MHz
最大供电电压
5.5 V
最小供电电压
4.5 V
标称供电电压
5 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL EXTENDED
端子形式
NO LEAD
端子位置
UPPER
uPs/uCs/外围集成电路类型
MICROCONTROLLER
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To all our customers
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Cautions
Keep safety first in your circuit designs!
1.
Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but
there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire
or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i)
placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or
mishap.
Notes regarding these materials
1.
These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation
product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any
other rights, belonging to Renesas Technology Corporation or a third party.
2.
Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights,
originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in
these materials.
3.
All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents
information on products at the time of publication of these materials, and are subject to change by Renesas Technology
Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these
inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various means, including the
Renesas Technology Corporation Semiconductor home page (http://www.renesas.com).
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When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and
algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of
the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other
loss resulting from the information contained herein.
5.
Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used
under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an
authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for
any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea
repeater use.
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materials.
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If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license
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Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is
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8.
Please contact Renesas Technology Corporation for further details on these materials or the products contained therein.
H8/38024 Series, H8/38024F-ZTAT™
H8/38024 HD64738024, HD64338024, HCD64338024,
HD64F38024, HCD64F38024
H8/38023 HD64338023, HCD64338023
H8/38022 HD64338022, HCD64338022
H8/38021 HD64338021, HCD64338021
H8/38020 HD64338020, HCD64338020
Hardware Manual
The revision list can be viewed directly by
clicking the title page.
The revision list summarizes the locations of
revisions and additions. Details should always
be checked by referring to the relevant text.
ADE-602-231A
Rev. 2.0
2/20/03
Hitachi Ltd.
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s
patent, copyright, trademark, or other intellectual property rights for information contained in
this document. Hitachi bears no responsibility for problems that may arise with third party’s
rights, including intellectual property rights, in connection with use of the information
contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you
have received the latest product standards or specifications before final design, purchase or
use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.
However, contact Hitachi’s sales office before using the product in an application that
demands especially high quality and reliability or where its failure or malfunction may directly
threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear
power, combustion control, transportation, traffic, safety equipment or medical equipment for
life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi
particularly for maximum rating, operating supply voltage range, heat radiation characteristics,
installation conditions and other characteristics. Hitachi bears no responsibility for failure or
damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,
consider normally foreseeable failure rates or failure modes in semiconductor devices and
employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi
product does not cause bodily injury, fire or other consequential damage due to operation of
the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document
without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi
semiconductor products.
Preface
The H8/300L Series of single-chip microcomputers has the high-speed H8/300L CPU at its core,
with many necessary peripheral functions on-chip. The H8/300L CPU instruction set is
compatible with the H8/300 CPU.
The H8/38024 Series has a system-on-a-chip architecture that includes such peripheral functions
as an LCD controller/driver, six timers, a two-channel 10-bit PWM, a serial communication
interface, and an A/D converter. This allows H8/38024 Series devices to be used as embedded
microcomputers in systems requiring LCD display.
Its on-chip ROM is PROM (ZTAT“), single-
power-supply flash memory (F-ZTAT“), and mask ROM that provides flexibility as it can be
reprogrammed in no time to cope with all situations from the early stages of mass production to
full-scale mass production. This is particularly applicable to application devices with
specifications that will most probably change.
This manual describes the hardware of the H8/38024 Series. For details on the H8/38024 Series
instruction set, refer to the H8/300L Series Programming Manual.
Notes:
Please follow the limitations below when developing a program and debugging H8/38024 using
the on-chip emulator (E10T).
1. The P95 pin is not available for use because it is dedicated to E10T.
2. The P33, P34, and P35 pins are also not available for use. To use these pins, additional
hardware is required on the user’s board.
3. Users cannot use the regions of addresses H'7000 to H'7FFF because they are used by E10T.
4. Regions of addresses H'F780 to H'FB7F must not be accessed.
5. When E10T is used, the P95 pin is for I/O, the P33 and P34 pins are for input, and the P35 pins
is for output.
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参数对比
与HCD64338024相近的元器件有:HCD64338021、HCD64338022、HCD64338023、HCD64338020、HCD64F38024。描述及对比如下:
型号 HCD64338024 HCD64338021 HCD64338022 HCD64338023 HCD64338020 HCD64F38024
描述 Microcontroller, MROM, 8MHz, CMOS, 3.99 X 3.99 MM, DIE-81 Microcontroller, MROM, 8MHz, CMOS, 3.99 X 3.99 MM, DIE-81 Microcontroller, MROM, 8MHz, CMOS, 3.99 X 3.99 MM, DIE-81 Microcontroller, MROM, 8MHz, CMOS, 3.99 X 3.99 MM, DIE-81 Microcontroller, MROM, 8MHz, CMOS, 3.99 X 3.99 MM, DIE-81 Microcontroller, FLASH, 5MHz, CMOS, 3.99 X 3.99 MM, DIE-81
零件包装代码 DIE DIE DIE DIE DIE DIE
包装说明 DIE, DIE, DIE, DIE, DIE, DIE,
针数 81 81 81 81 81 81
Reach Compliance Code unknown unknown unknown unknown unknown unknown
具有ADC YES YES YES YES YES YES
最大时钟频率 16 MHz 16 MHz 16 MHz 16 MHz 16 MHz 10 MHz
DAC 通道 NO NO NO NO NO NO
DMA 通道 NO NO NO NO NO NO
JESD-30 代码 S-XUUC-N81 S-XUUC-N81 S-XUUC-N81 S-XUUC-N81 S-XUUC-N81 S-XUUC-N81
I/O 线路数量 66 66 66 66 66 66
端子数量 81 81 81 81 81 81
最高工作温度 75 °C 75 °C 75 °C 75 °C 75 °C 75 °C
最低工作温度 -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C
PWM 通道 YES YES YES YES YES YES
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装代码 DIE DIE DIE DIE DIE DIE
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 UNCASED CHIP UNCASED CHIP UNCASED CHIP UNCASED CHIP UNCASED CHIP UNCASED CHIP
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
ROM可编程性 MROM MROM MROM MROM MROM FLASH
速度 8 MHz 8 MHz 8 MHz 8 MHz 8 MHz 5 MHz
最大供电电压 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 3.6 V
最小供电电压 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 2.7 V
标称供电电压 5 V 5 V 5 V 5 V 5 V 3 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子位置 UPPER UPPER UPPER UPPER UPPER UPPER
uPs/uCs/外围集成电路类型 MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
厂商名称 Hitachi (Renesas ) Hitachi (Renesas ) - Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas )
其他特性 OPERATES AT 1.8V MIN SUPPLY OPERATES AT 1.8V MIN SUPPLY OPERATES AT 1.8V MIN SUPPLY OPERATES AT 1.8V MIN SUPPLY OPERATES AT 1.8V MIN SUPPLY -
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