HCPL-0708
High Speed CMOS Optocoupler
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
Description
Available in SO-8 package, the HCPL-0708 optocoupler
utilizes the latest CMOS IC technology to achieve out-
standing performance with very low power consump-
tion. Basic building blocks of the HCPL-0708 are a high
speed LED and a CMOS detector IC. The detector incor-
porates an integrated photodiode, a high-speed trans-
impedance amplifier, and a voltage comparator with an
output driver.
Features
•
+5 V CMOS compatibility
•
15 ns typical pulse width distortion
•
30 ns max. pulse width distortion
•
40 ns max. propagation delay skew
•
High speed: 15 MBd
•
•
•
•
60 ns max. propagation delay
10 kV/µs minimum common mode rejection
–40 to 100°C temperature range
Safety and regulatory approvals pending
– UL recognized
3750 V rms for 1 min. per UL 1577 for HCPL-0708
– CSA component acceptance Notice #5
– IEC/EN/DIN EN 60747-5-2
approved for HCPL-0708 Option 060
Functional Diagram
NC
1
8
V
DD
NC
ANODE
2
7
CATHODE
3
6
V
O
Applications
•
•
•
•
•
Scan drive in PDP
Digital field bus isolation: DeviceNet, SDS, Profibus
Multiplexed data transmission
Computer peripheral interface
Microprocessor system interface
NC
4
5
GND
TRUTH TABLE
LED
OFF
ON
V
O
, OUTPUT
H
L
*A 0.1 µF bypass capacitor must be
connected between pins 5 and 8.
HCPL-0710 Functional Diagram
CAUTION:
It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Ordering Information
HCPL-0708 is UL Recognized with 3750 Vrms for 1 minute per UL1577.
Option
Part
Number
RoHS
Compliant
-000E
HCPL-0708 -500E
-560E
non RoHS
Compliant
no option
#500
-
Package
SO-8
Surface
Mount
X
X
X
Gull
Wing
Tape
& Reel
X
X
UL 5000 Vrms/
1 Minute rating
IEC/EN/DIN
EN 60747-5-2
Quantity
100 per tube
1500 per reel
X
1500 per reel
To order, choose a part number from the part number column and combine with the desired option from the option
column to form an order entry.
Example1:
HCPL-0708-500E to order product of Small Outline SO-8 package in Tape and Reel packaging and RoHS compliant.
Example 2:
HCPL-0708 to order product of Small Outline SO-8 package in Tube packaging and non RoHS compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since July 15, 2001 and
RoHS compliant will use ‘–XXXE.’
Package Outline Drawing
LAND PATTERN RECOMMENDATION
8
7
6
5
3.937 ± 0.127
(0.155 ± 0.005)
PIN ONE
1
0.406 ± 0.076
(0.016 ± 0.003)
2
XXXV
YWW
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
7.49 (0.295)
3
4
1.9 (0.075)
1.270 BSC
(0.050)
0.64 (0.025)
0.432
(0.017)
*
5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005)
7°
45° X
1.524
(0.060)
0 ~ 7°
0.228 ± 0.025
(0.009 ± 0.001)
0.203 ± 0.102
(0.008 ± 0.004)
*
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
0.305 MIN.
(0.012)
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
TEMPERATURE (°C)
200
160°C
150°C
140°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
30
SEC.
3°C + 1°C/–0.5°C
30
SEC.
SOLDERING
TIME
200°C
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
t
p
T
p
T
L
TEMPERATURE
260 +0/-5 °C
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
T
smax
T
smin
RAMP-DOWN
6 °C/SEC. MAX.
t
s
PREHEAT
60 to 180 SEC.
25
t
L
60 to 150 SEC.
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
Note: Non-halide flux should be used.
Regulatory Information
The HCPL-0708 has been approved by the following organizations:
UL
Recognized under UL 1577, component recognition program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5, File CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884Teil 2):2003-01 (Option 060 only)
Insulation and Safety Related Specifications
Parameter
Minimum External Air
Gap (Clearance)
Minimum External
Tracking (Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
CTI
Symbol
L(I01)
L(I02)
Value
4.9
4.8
0.08
Units
mm
mm
mm
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
≥175
IIIa
Volts
All Avago data sheets report the creepage and clearance
inherent to the optocoupler component itself. These
dimensions are needed as a starting point for the equip-
ment designer when determining the circuit insulation
requirements. However, once mounted on a printed
circuit board, minimum creepage and clearance require-
ments must be met as specified for individual equipment
standards. For creepage, the shortest distance path along
the surface of a printed circuit board between the solder
fillets of the input and output leads must be considered.
There are recommended techniques such as grooves
and ribs which may be used on a printed circuit board to
achieve desired creepage and clearances. Creepage and
clearance distances will also change depending on fac-
tors such as pollution degree and insulation level.
