HCPL-0708
High Speed CMOS Optocoupler
Data Sheet
Description
Available in SO-8 package, the HCPL-0708 optocoupler
utilizes the latest CMOS IC technology to achieve
outstanding performance with very low power
consumption. Basic building blocks of the HCPL-0708
are a high speed LED and a CMOS detector IC. The
detector incorporates an integrated photodiode, a
high-speed trans-impedance amplifier, and a voltage
comparator with an output driver.
Features
• +5 V CMOS compatibility
• 15 ns typical pulse width distortion
• 30 ns max. pulse width distortion
• 40 ns max. propagation delay skew
• High speed: 15 MBd
• 60 ns max. propagation delay
• 10 kV/µs minimum common mode rejection
• –40 to 100°C temperature range
• Safety and regulatory approvals pending
– UL recognized
3750 V rms for 1 min. per UL 1577 for HCPL-0708
– CSA component acceptance Notice #5
– IEC/EN/DIN EN 60747-5-2
approved for HCPL-0708 Option 060
Applications
• Scan drive in PDP
• Digital field bus isolation: DeviceNet, SDS, Profibus
• Multiplexed data transmission
• Computer peripheral interface
• Microprocessor system interface
• DC/DC converter
Functional Diagram
NC
1
8
V
DD
ANODE
2
7
NC
CATHODE
3
6
V
O
NC
4
5
GND
TRUTH TABLE
LED
OFF
ON
V
O
, OUTPUT
H
L
*A 0.1
µF
bypass capacitor
must be connected between
pins 5 and 8.
CAUTION:
It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and/or degradation which may be induced by ESD.
Ordering Information
HCPL-0708 is UL Recognized with 3750 Vrms for 1 minute per UL1577.
Option
Part
RoHS
non RoHS
Number Compliant Compliant
-000E
no option
HCPL-0708 -500E
-500
-060E
-060
-560E
-560
Package
SO-8
Surface
Mount
X
X
X
X
Gull
Wing
Tape
& Reel
X
X
UL 5000 Vrms/
1 Minute rating
IEC/EN/DIN
EN 60747-5-2 Quantity
100 per tube
1500 per reel
X
100 per tube
X
1500 per reel
To order, choose a part number from the part number column and combine with the desired option from the option
column to form an order entry.
Example 1:
HCPL-0708-500E to order product of Small Outline SO-8 package in Tape and Reel packaging and RoHS compliant.
Example 2:
HCPL-0708 to order product of Small Outline SO-8 package in Tube packaging and non RoHS compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since July 15, 2001 and
RoHS compliant will use ‘–XXXE.’
2
Package Outline Drawing
HCPL-0708 (Small Outline SO-8 Package)
LAND PATTERN RECOMMENDATION
8
7
6
5
3.937 ± 0.127
(0.155 ± 0.005)
XXXV
YWW
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
4
7.49 (0.295)
PIN ONE
1
0.406 ± 0.076
(0.016 ± 0.003)
2
3
1.9 (0.075)
1.270 BSC
(0.050)
0.64 (0.025)
*
5.080 ± 0.127
(0.200 ± 0.005)
7°
45° X
0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
0 ~ 7°
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
0.228 ± 0.025
(0.009 ± 0.001)
*
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
0.305 MIN.
(0.012)
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
3
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
3°C + 1°C/–0.5°C
30
SEC.
30
SEC.
SOLDERING
TIME
200°C
TEMPERATURE (°C)
200
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
t
p
T
p
T
L
260 +0/-5 °C
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
TEMPERATURE
T
smax
T
smin
RAMP-DOWN
6 °C/SEC. MAX.
t
s
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
t
L
60 to 150 SEC.
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
Note: Non-halide flux should be used.
Regulatory Information
The HCPL-0708 has been
approved by the following
organizations:
UL
Recognized under UL 1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
(Option 060 only)
4
Insulation and Safety Related Specifications
Parameter
Symbol
Minimum External Air
L(I01)
Gap (Clearance)
Minimum External
L(I02)
Tracking (Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
All Avago data sheets report the
creepage and clearance inherent
to the optocoupler component
itself. These dimensions are
needed as a starting point for the
equipment designer when
determining the circuit insulation
requirements. However, once
mounted on a printed circuit
CTI
Value
4.9
4.8
0.08
Units
mm
mm
mm
≥175
Volts
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
There are recommended
techniques such as grooves and
ribs which may be used on a
printed circuit board to achieve
desired creepage and clearances.
Creepage and clearance distances
will also change depending on
factors such as pollution degree
and insulation level.
board, minimum creepage and
clearance requirements must be
met as specified for individual
equipment standards. For
creepage, the shortest distance
path along the surface of a
printed circuit board between the
solder fillets of the input and
output leads must be considered.
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