型号
- 型号
- 关键词
Bus Driver, HCT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDIP20, METAL SEALED, CERAMIC, DIP-20
厂商名称：Harris
厂商官网：http://www.harris.com/
下载文档| 型号 | HCTS240DMSR | HCTS240KMSR | HCTS240KMSH | HCTS240DMSH |
|---|---|---|---|---|
| 描述 | Bus Driver, HCT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDIP20, METAL SEALED, CERAMIC, DIP-20 | Bus Driver, HCT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, METAL SEALED, CERAMIC, DFP-20 | Bus Driver, HCT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, METAL SEALED, CERAMIC, DFP-20 | Bus Driver, HCT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDIP20, METAL SEALED, CERAMIC, DIP-20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP20,.3 | DFP, FL20,.3 | DFP, FL20,.3 | DIP, DIP20,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 其他特性 | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| 系列 | HCT | HCT | HCT | HCT |
| JESD-30 代码 | R-CDIP-T20 | R-CDFP-F20 | R-CDFP-F20 | R-CDIP-T20 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.006 A | 0.006 A | 0.005 A | 0.005 A |
| 位数 | 4 | 4 | 4 | 4 |
| 功能数量 | 2 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DFP | DFP | DIP |
| 封装等效代码 | DIP20,.3 | FL20,.3 | FL20,.3 | DIP20,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | FLATPACK | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 20 ns | 20 ns | 25 ns | 25 ns |
| 传播延迟（tpd） | 20 ns | 20 ns | 25 ns | 25 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535V;38534K;883S | 38535V;38534K;883S | 38535V;38534K;883S | 38535V;38534K;883S |
| 座面最大高度 | 5.08 mm | 2.92 mm | 2.92 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 总剂量 | 200k Rad(Si) V | 200k Rad(Si) V | 1M Rad(Si) V | 1M Rad(Si) V |
| 宽度 | 7.62 mm | 6.92 mm | 6.92 mm | 7.62 mm |
| 厂商名称 | - | Harris | Harris | Harris |
