To all our customers
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corporation product best suited to the customer's application; they do not convey any
license under any intellectual property rights, or any other rights, belonging to Renesas Technology
Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any
third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corporation without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corporation
or an authorized Renesas Technology Corporation product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss
rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various
means, including the Renesas Technology Corporation Semiconductor home page
(http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams,
charts, programs, and algorithms, please be sure to evaluate all information as a total system before
making a final decision on the applicability of the information and products. Renesas Technology
Corporation assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device
or system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor
when considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in
whole or in part these materials.
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Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corporation for further details on these materials or the products
contained therein.
Hitachi Single-Chip Microcomputer
H8S/2199 Series
H8S/2199
HD6432199
H8S/2198
HD6432198
H8S/2197
HD6432197
H8S/2196
HD6432196
H8S/2199F-ZTAT
HD64F2199
™
Hardware Manual
ADE-602-191
Rev 1.0
2/15/00
Hitachi, Ltd.
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s
patent, copyright, trademark, or other intellectual property rights for information contained in
this document. Hitachi bears no responsibility for problems that may arise with third party’s
rights, including intellectual property rights, in connection with use of the information
contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you
have received the latest product standards or specifications before final design, purchase or
use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.
However, contact Hitachi’s sales office before using the product in an application that
demands especially high quality and reliability or where its failure or malfunction may directly
threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear
power, combustion control, transportation, traffic, safety equipment or medical equipment for
life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi
particularly for maximum rating, operating supply voltage range, heat radiation characteristics,
installation conditions and other characteristics. Hitachi bears no responsibility for failure or
damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,
consider normally foreseeable failure rates or failure modes in semiconductor devices and
employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi
product does not cause bodily injury, fire or other consequential damage due to operation of
the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document
without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi
semiconductor products.
Contents
Section 1
1.1
1.2
1.3
Overview
..........................................................................................................
Overview ..........................................................................................................................
Internal Block Diagram ....................................................................................................
Pin Arrangement and Functions........................................................................................
1.3.1
Pin Arrangement...............................................................................................
1.3.2
Pin Functions....................................................................................................
1
1
7
8
8
9
Section 2
2.1
CPU
.................................................................................................................... 17
17
17
18
18
19
20
25
26
26
27
28
29
30
30
32
33
33
34
35
45
46
47
47
50
54
54
55
56
57
58
59
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
Overview ..........................................................................................................................
2.1.1
Features ............................................................................................................
2.1.2
Differences between H8S/2600 CPU and H8S/2000 CPU...............................
2.1.3
Differences from H8/300 CPU .........................................................................
2.1.4
Differences from H8/300H CPU ......................................................................
CPU Operating Modes......................................................................................................
Address Space...................................................................................................................
Register Configuration......................................................................................................
2.4.1
Overview ..........................................................................................................
2.4.2
General Registers..............................................................................................
2.4.3
Control Registers ..............................................................................................
2.4.4
Initial Register Values ......................................................................................
Data Formats.....................................................................................................................
2.5.1
General Register Data Formats.........................................................................
2.5.2
Memory Data Formats......................................................................................
Instruction Set...................................................................................................................
2.6.1
Overview ..........................................................................................................
2.6.2
Instructions and Addressing Modes..................................................................
2.6.3
Table of Instructions Classified by Function....................................................
2.6.4
Basic Instruction Formats.................................................................................
2.6.5
Notes on Use of Bit-Manipulation Instructions................................................
Addressing Modes and Effective Address Calculation.....................................................
2.7.1
Addressing Mode .............................................................................................
2.7.2
Effective Address Calculation ..........................................................................
Processing States...............................................................................................................
2.8.1
Overview ..........................................................................................................
2.8.2
Reset State ........................................................................................................
2.8.3
Exception-Handling State.................................................................................
2.8.4
Program Execution State ..................................................................................
2.8.5
Power-Down State............................................................................................
Basic Timing.....................................................................................................................
Rev. 1.0, 02/00, page i of 19
WindowsCE
