REJ09B0258-0300
16
H8/3068F-ZTAT
Hardware Manual
Renesas 16-Bit Single-Chip Microcomputer
H8 Family/H8/300H Series
H8/3068F
HD64F3068F,
HD64F3068TE
Rev. 3.00
Revision Date: Sep 14, 2005
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corp. product best suited to the customer's application; they do not convey any license
under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or
a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-
party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corp. without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or
an authorized Renesas Technology Corp. product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising
from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means,
including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data,
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total
system before making a final decision on the applicability of the information and products. Renesas
Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or
system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when
considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
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whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must
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other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
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8. Please contact Renesas Technology Corp. for further details on these materials or the products
contained therein.
Rev. 3.00 Sep 14, 2005 page ii of xxii
Preface
The H8/3068F is a group of high-performance single-chip microcontrollers that integrate system
supporting functions together with an H8/300H CPU core.
The H8/300H CPU has a 32-bit internal architecture with sixteen 16-bit general registers, and a
concise, optimized instruction set designed for speed. It can address a 16-Mbyte linear address
space.
The on-chip supporting functions include ROM, RAM, 16-bit timers, 8-bit timers, a
programmable timing pattern controller (TPC), a watchdog timer (WDT), a serial communication
interface (SCI), an A/D converter, a D/A converter, I/O ports, a DMA controller (DMAC), and
other facilities. The three-channel SCI has been expanded to support the ISO/IEC7816-3 smart
card interface. Functions have also been added to reduce power consumption in battery-powered
applications: individual modules can be placed in standby, and the frequency of the system clock
supplied to the chip can be divided down under software control.
The address space is divided into eight areas. The data bus width and access cycle length can be
selected independently in each area, simplifying the connection of different types of memory.
Seven MCU operating modes (modes 1 to 7) are provided, offering a choice of data bus width and
address space size.
With these features, the H8/3068F offers easy implementation of compact, high-performance
systems.
The H8/3068F has an F-ZTAT™* version with on-chip flash memory that can be programmed
on-board. This version enables users to respond quickly and flexibly to changing application
specifications.
This manual describes the H8/3068F hardware. For details of the instruction set, refer to the
H8/300H Series Programming Manual.
Note: * F-ZTAT™ (Flexible ZTAT) is a registered trademark of Renesas Technology Corp.
Rev. 3.00 Sep 14, 2005 page iii of xxii
Rev. 3.00 Sep 14, 2005 page iv of xxii
Main Revisions for this Edition
Item
All
Page
Revision (See Manual for Details)
All references to Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and
other Hitachi brand names changed to Renesas Technology Corp.
Designation for categories changed from “series” to “group”
19.2.1 Connecting 651
a Crystal Resonator
Table 19.1 (1)
Damping Resistance
Value
Section 21
Electrical
Characteristics
21.1.2 DC
Characteristics
Table 21.2 DC
Characteristics (1)
675 to
706
Note amended
Note: A crystal resonator between 2 MHz and 25 MHz can be
used. If the chip is to be operated at less than 2 MHz, the
on-chip frequency divider should be used. (A crystal
resonator of less than 2 MHz cannot be used.)
“Preliminary” deleted
677, 678 Table and note amended
Item
Normal
Current
2
dissipation* operation
Symbol
I
CC
*
4
Min
—
Typ
Max
Unit
mA
Test
Conditions
f = 20 MHz
f = 25 MHz
32
47
(5.0 V)
37
58
(5.0 V)
Sleep mode
—
24
38
(5.0 V)
29
47
(5.0 V)
mA
f = 20 MHz
f = 25 MHz
Module
standby mode
—
19
31
(5.0 V)
21
37
(5.0 V)
mA
f = 20 MHz
f = 25 MHz
Standby
3
mode*
Flash memory
programming/
5
erasing*
—
—
—
1.0
—
37
10
80
57
µA
µA
mA
T
a
50˚C
T
a
50˚C
f = 20 MHz
42
68
f = 25 MHz
Notes: 3. The values are for V
RAM
≤
V
CC
< 4.5 V, V
IH
min = V
CC
×
0.9, and V
IL
max = 0.3 V.
4. I
CC
max. (normal operation)
= 3.0 (mA) + 0.40 (mA/(MHz
×
V))
×
V
CC
×
f
I
CC
max. (sleep mode)
= 3.0 (mA) + 0.32 (mA/(MHz
×
V))
×
V
CC
×
f
I
CC
max. (sleep mode + module standby mode)
= 3.0 (mA) + 0.25 (mA/(MHz
×
V))
×
V
CC
×
f
The Typ values for power consumption are reference
values.
5. Sum of current dissipation in normal operation and
current dissipation in program/erase operations.
Rev. 3.00 Sep 14, 2005 page v of xxii
