型号
- 型号
- 关键词
| 型号 | HD74HC125P | HD74HC125 | HD74HC126 | HD74HC126TELL | HD74HC125TELL | HD74HC125FPEL | HD74HC126RPEL |
|---|---|---|---|---|---|---|---|
| 描述 | Quad. Bus Buffer Gates (with 3-state outputs) | Quad. Bus Buffer Gates (with 3-state outputs) | Quad. Bus Buffer Gates (with 3-state outputs) | Quad. Bus Buffer Gates (with 3-state outputs) | Quad. Bus Buffer Gates (with 3-state outputs) | Quad. Bus Buffer Gates (with 3-state outputs) | Quad. Bus Buffer Gates (with 3-state outputs) |
| 是否无铅 | 不含铅 | - | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | - | - | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Renesas(瑞萨电子) | - | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 零件包装代码 | DIP | - | - | TSSOP | TSSOP | SOIC | SOIC |
| 包装说明 | 6.30 X 19.20 MM, 2.54 MM PITCH, PLASTIC, DIP-14 | - | - | 4.40 X 5 MM, 0.65 PITCH, PLASTIC, TSSOP-14 | TSSOP, TSSOP14,.25 | SOP, SOP14,.3 | SOP, SOP14,.25 |
| 针数 | 14 | - | - | 14 | 14 | 14 | 14 |
| Reach Compliance Code | compli | - | - | compliant | compli | compli | compli |
| 控制类型 | ENABLE LOW | - | - | ENABLE HIGH | ENABLE LOW | ENABLE LOW | ENABLE HIGH |
| 系列 | HC/UH | - | - | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | R-PDIP-T14 | - | - | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| 长度 | 19.2 mm | - | - | 5 mm | 5 mm | 10.06 mm | 8.65 mm |
| 负载电容（CL） | 50 pF | - | - | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | - | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.006 A | - | - | 0.006 A | 0.006 A | 0.006 A | 0.006 A |
| 位数 | 1 | - | - | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | - | - | 4 | 4 | 4 | 4 |
| 端口数量 | 2 | - | - | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | - | - | 14 | 14 | 14 | 14 |
| 最高工作温度 | 85 °C | - | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | - | - | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | - | - | TSSOP | TSSOP | SOP | SOP |
| 封装等效代码 | DIP14,.3 | - | - | TSSOP14,.25 | TSSOP14,.25 | SOP14,.3 | SOP14,.25 |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | - | 260 | 260 | 260 | 260 |
| 电源 | 2/6 V | - | - | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
| Prop。Delay @ Nom-Su | 25 ns | - | - | - | 25 ns | 25 ns | 25 ns |
| 传播延迟（tpd） | 125 ns | - | - | 125 ns | 125 ns | 125 ns | 125 ns |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.06 mm | - | - | 1.1 mm | 1.1 mm | 2.2 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 6 V | - | - | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | - | - | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 4.5 V | - | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 表面贴装 | NO | - | - | YES | YES | YES | YES |
| 技术 | CMOS | - | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | - | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | - | - | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | - | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | - | - | 4.4 mm | 4.4 mm | 5.5 mm | 3.95 mm |
| 湿度敏感等级 | - | - | - | 1 | 1 | 1 | 1 |
| 包装方法 | - | - | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
