型号
- 型号
- 关键词
| 型号 | HD74LV11AFPEL | HD74LV11A | HD74LV11ATELL | HD74LV11ARPEL |
|---|---|---|---|---|
| 描述 | Triple 3-input Positive AND Gates | Triple 3-input Positive AND Gates | Triple 3-input Positive AND Gates | Triple 3-input Positive AND Gates |
| 厂商名称 | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 零件包装代码 | SOIC | - | TSSOP | SOIC |
| 包装说明 | SOP-14 | - | TSSOP, TSSOP14,.25 | SOP-14 |
| 针数 | 14 | - | 14 | 14 |
| Reach Compliance Code | compli | - | compli | compli |
| 系列 | LV/LV-A/LVX/H | - | LV/LV-A/LVX/H | LV/LV-A/LVX/H |
| JESD-30 代码 | R-PDSO-G14 | - | R-PDSO-G14 | R-PDSO-G14 |
| 长度 | 10.06 mm | - | 5 mm | 8.65 mm |
| 负载电容（CL） | 50 pF | - | 50 pF | 50 pF |
| 逻辑集成电路类型 | AND GATE | - | AND GATE | AND GATE |
| 最大I（ol） | 0.006 A | - | 0.006 A | 0.006 A |
| 功能数量 | 3 | - | 3 | 3 |
| 输入次数 | 3 | - | 3 | 3 |
| 端子数量 | 14 | - | 14 | 14 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | - | TSSOP | SOP |
| 封装等效代码 | SOP14,.3 | - | TSSOP14,.25 | SOP14,.25 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 包装方法 | TAPE AND REEL | - | TAPE AND REEL | TAPE AND REEL |
| 电源 | 3.3 V | - | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Su | 14 ns | - | 14 ns | 14 ns |
| 传播延迟（tpd） | 21 ns | - | 21 ns | 21 ns |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
| 施密特触发器 | NO | - | NO | NO |
| 座面最大高度 | 2.2 mm | - | 1.1 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | - | 2 V | 2 V |
| 标称供电电压 (Vsup) | 2.5 V | - | 2.5 V | 2.5 V |
| 表面贴装 | YES | - | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | - | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | - | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | DUAL |
| 宽度 | 5.5 mm | - | 4.4 mm | 3.95 mm |