D/A Converter, 1 Func, Parallel, 8 Bits Input Loading, 0.007us Settling Time, CDIP24,
厂商名称:Signal Processing Technologies
下载文档型号 | HDAC51400SID | HDAC51400SMD/883 | HDAC51400SMD |
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描述 | D/A Converter, 1 Func, Parallel, 8 Bits Input Loading, 0.007us Settling Time, CDIP24, | D/A Converter, 1 Func, Parallel, 8 Bits Input Loading, 0.007us Settling Time, CDIP24, | D/A Converter, 1 Func, Parallel, 8 Bits Input Loading, 0.007us Settling Time, CDIP24, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown |
转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
输入位码 | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY |
输入格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
JESD-30 代码 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 |
JESD-609代码 | e0 | e0 | e0 |
最大线性误差 (EL) | 0.37% | 0.37% | 0.37% |
标称负供电电压 | -5.2 V | -5.2 V | -5.2 V |
位数 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 24 |
最高工作温度 | 85 °C | 125 °C | 125 °C |
最低工作温度 | -25 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | DIP | DIP | DIP |
封装等效代码 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | -5.2 V | -5.2 V | -5.2 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
标称安定时间 (tstl) | 0.007 µs | 0.007 µs | 0.007 µs |
最大压摆率 | 220 mA | 220 mA | 220 mA |
表面贴装 | NO | NO | NO |
技术 | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | OTHER | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
厂商名称 | Signal Processing Technologies | - | Signal Processing Technologies |