Hi-Flow 330P
®
Electrically Insulating, High Performance,Thermally Conductive Phase Change Material
Features and Benefits
TYPICAL PROPERTIES OF HI-FLOW 330P
• Thermal impedance:
0.18°C-in
2
/W (@25 psi)
• Natural tack for ease of assembly
• Exceptional thermal performance in an
insulated pad
PROPERTY
Color
Reinforcement Carrier
Thickness (inch) / (mm)
Film Thickness (inch) / (mm)
Inherent Surface Tack (1 or 2-Side)
Elongation (%)
Tensile Strength (psi)
Continuous Use Temp (°F / °C)
Phase Change Softening Temp (°F / °C)
IMPERIAL VALUE
Gold
Polyimide
0.0045 - 0.0055
0.001 - 0.002
1
40
7000
-40 to 257
126
METRIC VALUE
Gold
Polyimide
0.114 - 0.140
0.025 - 0.050
1
40
7000
-40 to 125
52
TEST METHOD
Visual
—
—
ASTM D374
—
ASTM D882A
ASTM D882A
—
ASTM D3418
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Dielectric Constant (1000 Hz)
Volume Resistivity (Ohm-meter)
Flame Rating
THERMAL
5000
4.5
10
12
V-O
5000
4.5
10
12
V-O
ASTM D149
ASTM D150
ASTM D257
U.L. 94
Hi-Flow 330P is a thermally conductive
phase change material featuring a natural
tack on one side and reinforced with a poly-
imide film.The polyimide film provides a high
dielectric strength and cut-through resist-
ance. Hi-Flow 330P offers excellent handling
and consistent liner peel-off characteristics.
The material is designed for use between
a high power electrical device requiring elec-
trical isolation and its heat sink. Bergquist
recommends the use clips or springs for
phase change materials to assure constant
pressure between the component interface
and the heat sink.
Thermal Conductivity (W/m-K)(1)
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
TO-220 Thermal Performance (°C/W) 0.0010"
TO-220 Thermal Performance (°C/W) 0.0015"
TO-220 Thermal Performance (°C/W) 0.0020"
Thermal Impedance (°C-in
2
/W)(2) 0.0010"
Thermal Impedance (°C-in
2
/W)(2) 0.0015"
Thermal Impedance (°C-in
2
/W)(2) 0.0020"
1.4
1.4
ASTM D5470
10
1.22
1.44
1.67
0.19
0.21
0.26
25
1.17
1.40
1.63
0.18
0.21
0.26
50
1.13
1.38
1.60
0.17
0.21
0.24
100
1.10
1.35
1.58
0.16
0.19
0.23
200
1.08
1.33
1.54
0.15
0.18
0.22
1) This is the measured thermal conductivity of the Hi-Flow wax coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of
the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not
accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes inter-
facial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface
roughness, flatness and pressure applied.
Typical Applications
• Spring / clip-mounted devices
• Discrete power semiconductors
and modules
Building a Part Number
HF330P
–
0.001 – 01
–
00
–
ACME10256 Rev a
Standard Options
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1112 = 11" x 12" sheets, 11/250 = 11" x 250' rolls,
or 00 = custom configuration
01 = Natural Tack
Standard Polyimide Thickness Available = 0.001", 0.0015", 0.002"
HF330P = Hi-Flow 330P Phase Change Material
Section A
Section B
Section C
Configurations Available
• Roll form, die-cut parts, sheet form
• Available with 1.0 mil (Hi-Flow 330P1.0),
1.5 mil (Hi-Flow 330P1.5) or 2.0 mil
(Hi-Flow 330P2.0) Polyimide reinforcement
carrier
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi-Flow
®
: U.S. Patent 6,197,859 and others
www.bergquistcompany.com
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company -
European Headquarters
Bramenberg 9a, 3755 BT Eemnes
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company - Asia
Room 15, 8/F Wah Wai Industrial Centre
No. 38-40, Au Pui Wan Street
Fotan, Shatin, N.T. Hong Kong
Ph: 852.2690.9296
Fax: 852.2690.2344
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_HF330P_0609
Section D
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Bergquist Company
:
HF330P-0.005-00-10.512 HF330P-0.0045-00-10.512 HF330P-0.0055-00-10.512
