型号
- 型号
- 关键词
Standard SRAM, 256KX1, 35ns, CMOS, PDSO24, 0.300 INCH, SOJ-24
厂商名称：Hitachi （Renesas ）
厂商官网：http://www.renesas.com/eng/
下载文档| 型号 | HM6207HLJP-35 | HM6207HJP-25 | HM6207HP-45 | HM6207HLP-35 | HM6207HP-35 |
|---|---|---|---|---|---|
| 描述 | Standard SRAM, 256KX1, 35ns, CMOS, PDSO24, 0.300 INCH, SOJ-24 | Standard SRAM, 256KX1, 25ns, CMOS, PDSO24, 0.300 INCH, SOJ-24 | Standard SRAM, 256KX1, 45ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Standard SRAM, 256KX1, 35ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Standard SRAM, 256KX1, 35ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 |
| 厂商名称 | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） |
| 零件包装代码 | SOJ | SOJ | DIP | DIP | DIP |
| 包装说明 | SOJ, SOJ24,.34 | SOJ, SOJ24,.34 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 |
| 针数 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 35 ns | 25 ns | 45 ns | 35 ns | 35 ns |
| 其他特性 | TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP | TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP | TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP | TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP | TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP |
| I/O 类型 | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 代码 | R-PDSO-J24 | R-PDSO-J24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 |
| 长度 | 15.63 mm | 15.63 mm | 29.88 mm | 29.88 mm | 29.88 mm |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOJ | SOJ | DIP | DIP | DIP |
| 封装等效代码 | SOJ24,.34 | SOJ24,.34 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.76 mm | 3.76 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| 最大待机电流 | 0.0001 A | 0.002 A | 0.002 A | 0.0001 A | 0.002 A |
| 最小待机电流 | 2 V | 4.5 V | 4.5 V | 2 V | 4.5 V |
| 最大压摆率 | 0.1 mA | 0.12 mA | 0.1 mA | 0.1 mA | 0.1 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
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