型号
- 型号
- 关键词
64 k SRAM (8-kword x 8-bit)
厂商名称：Hitachi （Renesas ）
厂商官网：http://www.renesas.com/eng/
下载文档| 型号 | HM9264BLP-8L | HM9264BLFP-10L | HM9264BLP-10L | HM9264B | HM9264BLFP-8L |
|---|---|---|---|---|---|
| 描述 | 64 k SRAM (8-kword x 8-bit) | 64 k SRAM (8-kword x 8-bit) | 64 k SRAM (8-kword x 8-bit) | 64 k SRAM (8-kword x 8-bit) | 64 k SRAM (8-kword x 8-bit) |
| 是否Rohs认证 | 不符合 | - | 不符合 | - | 不符合 |
| 厂商名称 | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | - | Hitachi （Renesas ） |
| 零件包装代码 | DIP | SOIC | DIP | - | SOIC |
| 包装说明 | DIP, DIP28,.6 | SOP, SOP28,.45 | DIP, DIP28,.6 | - | SOP, SOP28,.45 |
| 针数 | 28 | 28 | 28 | - | 28 |
| Reach Compliance Code | unknown | unknown | unknown | - | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 |
| 最长访问时间 | 85 ns | 100 ns | 100 ns | - | 85 ns |
| 其他特性 | BATTERY BACK-UP OPERATION | BATTERY BACK-UP OPERATION | BATTERY BACK-UP OPERATION | - | BATTERY BACK-UP OPERATION |
| I/O 类型 | COMMON | COMMON | COMMON | - | COMMON |
| JESD-30 代码 | R-PDIP-T28 | R-PDSO-G28 | R-PDIP-T28 | - | R-PDSO-G28 |
| JESD-609代码 | e0 | - | e0 | - | e0 |
| 长度 | 35.6 mm | 18 mm | 35.6 mm | - | 18 mm |
| 内存密度 | 65536 bit | 65536 bit | 65536 bit | - | 65536 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | - | STANDARD SRAM |
| 内存宽度 | 8 | 8 | 8 | - | 8 |
| 功能数量 | 1 | 1 | 1 | - | 1 |
| 端子数量 | 28 | 28 | 28 | - | 28 |
| 字数 | 8192 words | 8192 words | 8192 words | - | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 | - | 8000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | - | 70 °C |
| 组织 | 8KX8 | 8KX8 | 8KX8 | - | 8KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | DIP | - | SOP |
| 封装等效代码 | DIP28,.6 | SOP28,.45 | DIP28,.6 | - | SOP28,.45 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | - | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | - | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 5.7 mm | 3 mm | 5.7 mm | - | 3 mm |
| 最大待机电流 | 0.000025 A | 0.000025 A | 0.000025 A | - | 0.000025 A |
| 最小待机电流 | 2 V | 2 V | 2 V | - | 2 V |
| 最大压摆率 | 0.045 mA | 0.045 mA | 0.045 mA | - | 0.045 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | 5 V |
| 表面贴装 | NO | YES | NO | - | YES |
| 技术 | CMOS | CMOS | CMOS | - | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | - | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | - | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED |
| 宽度 | 15.24 mm | 8.4 mm | 15.24 mm | - | 8.4 mm |
| Base Number Matches | 1 | 1 | 1 | - | 1 |