型号
- 型号
- 关键词
| 型号 | HN62338BP-10 | HN62338BF-10 | HN62338BTT-10 |
|---|---|---|---|
| 描述 | 1M X 8 MASK PROM, 100 ns, PDIP32, PLASTIC, DIP-32 | 1MX8 MASK PROM, 100ns, PDSO32, PLASTIC, SOP-32 | 1MX8 MASK PROM, 100ns, PDSO32, PLASTIC, TSOP2-32 |
| 零件包装代码 | DIP | SOIC | TSOP2 |
| 包装说明 | DIP, | SOP, | TSOP2, |
| 针数 | 32 | 32 | 32 |
| Reach Compliance Code | compli | compliant | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 100 ns | 100 ns | 100 ns |
| JESD-30 代码 | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-G32 |
| 长度 | 41.9 mm | 20.45 mm | 20.95 mm |
| 内存密度 | 8388608 bi | 8388608 bit | 8388608 bi |
| 内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM |
| 内存宽度 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 |
| 字数 | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX8 | 1MX8 | 1MX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | TSOP2 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 3.05 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL |
| 厂商名称 | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) |
| 宽度 | 15.24 mm | - | 10.16 mm |