型号
- 型号
- 关键词
| 型号 | HPC36400V17 | HPC36400E17 | HPC46400E17 | HPC46400V17 |
|---|---|---|---|---|
| 描述 | IC,MICROCONTROLLER,16-BIT,HPC CPU,CMOS,LDCC,68PIN,PLASTIC | IC,MICROCONTROLLER,16-BIT,HPC CPU,CMOS,LLCC,68PIN,CERAMIC | IC,MICROCONTROLLER,16-BIT,HPC CPU,CMOS,LLCC,68PIN,CERAMIC | IC,MICROCONTROLLER,16-BIT,HPC CPU,CMOS,LDCC,68PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | QCCJ, LDCC68,1.0SQ | QCCN, LCC68,.95SQ | QCCN, LCC68,.95SQ | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 位大小 | 16 | 16 | 16 | 16 |
| CPU系列 | HPC | HPC | HPC | HPC |
| JESD-30 代码 | S-PQCC-J68 | S-XQCC-N68 | S-XQCC-N68 | S-PQCC-J68 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 端子数量 | 68 | 68 | 68 | 68 |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCN | QCCN | QCCJ |
| 封装等效代码 | LDCC68,1.0SQ | LCC68,.95SQ | LCC68,.95SQ | LDCC68,1.0SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 256 | 256 | 256 | 256 |
| ROM可编程性 | N/A | N/A | N/A | N/A |
| 速度 | 17 MHz | 17 MHz | 17 MHz | 17 MHz |
| 最大压摆率 | 70 mA | 70 mA | 70 mA | 70 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | NO LEAD | NO LEAD | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |