型号 | HV1814X | HV1814C | HV1814CS | HV1816P | HV1814P | HV1814PJ | HV1816C | HV1816CS |
---|---|---|---|---|---|---|---|---|
描述 | Single-Ended Multiplexer, 1 Func, 8 Channel, NMOS, DIE | Single-Ended Multiplexer, 1 Func, 8 Channel, NMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28 | Single-Ended Multiplexer, 1 Func, 8 Channel, NMOS, CQFP36, CERAMIC, LCC-36 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDIP28, PLASTIC, DIP-28 | Single-Ended Multiplexer, 1 Func, 8 Channel, NMOS, PDIP28, PLASTIC, DIP-28 | Single-Ended Multiplexer, 1 Func, 8 Channel, NMOS, PQCC28, PLASTIC, LCC-28 | Single-Ended Multiplexer, 1 Func, 8 Channel, NMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28 | Single-Ended Multiplexer, 1 Func, 8 Channel, NMOS, CQFP36, CERAMIC, LCC-36 |
厂商名称 | Supertex | Supertex | Supertex | Supertex | Supertex | Supertex | Supertex | Supertex |
零件包装代码 | DIE | DIP | QFP | DIP | DIP | QLCC | DIP | QFP |
包装说明 | DIE, | DIP, | QFP, | DIP, | DIP, | QCCJ, | DIP, | QFP, |
针数 | 30 | 28 | 36 | 28 | 28 | 28 | 28 | 36 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | R-XUUC-N30 | R-CDIP-T28 | S-CQFP-G36 | R-PDIP-T28 | R-PDIP-T28 | S-PQCC-J28 | R-CDIP-T28 | S-CQFP-G36 |
信道数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 30 | 28 | 36 | 28 | 28 | 28 | 28 | 36 |
标称断态隔离度 | 45 dB | 45 dB | 45 dB | 45 dB | 45 dB | 45 dB | 45 dB | 45 dB |
通态电阻匹配规范 | 7.5 Ω | 7.5 Ω | 7.5 Ω | 8.25 Ω | 7.5 Ω | 7.5 Ω | 7.5 Ω | 8.25 Ω |
最大通态电阻 (Ron) | 50 Ω | 50 Ω | 50 Ω | 55 Ω | 50 Ω | 50 Ω | 50 Ω | 50 Ω |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIE | DIP | QFP | DIP | DIP | QCCJ | DIP | QFP |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
封装形式 | UNCASED CHIP | IN-LINE | FLATPACK | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | FLATPACK |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 (Vsup) | 70 V | 70 V | 70 V | 80 V | 70 V | 70 V | 80 V | 80 V |
表面贴装 | YES | NO | YES | NO | NO | YES | NO | YES |
最长断开时间 | 10000 ns | 10000 ns | 10000 ns | 10000 ns | 10000 ns | 10000 ns | 10000 ns | 10000 ns |
最长接通时间 | 5000 ns | 5000 ns | 5000 ns | 5000 ns | 5000 ns | 5000 ns | 5000 ns | 5000 ns |
技术 | NMOS | NMOS | NMOS | CMOS | NMOS | NMOS | NMOS | NMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | GULL WING |
端子位置 | UPPER | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL | QUAD |
标称负供电电压 (Vsup) | -70 V | -70 V | -70 V | - | -70 V | -70 V | -80 V | -80 V |
最大供电电流 (Isup) | 1.6 mA | 1.6 mA | 1.6 mA | - | 1.6 mA | 1.6 mA | 1.6 mA | 1.6 mA |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
长度 | - | 35.56 mm | 10.16 mm | - | 36.83 mm | 11.43 mm | 35.56 mm | 10.16 mm |
湿度敏感等级 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
峰值回流温度(摄氏度) | - | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
座面最大高度 | - | 3.937 mm | 2.921 mm | 3.937 mm | 3.937 mm | 4.57 mm | 3.937 mm | 2.921 mm |
端子节距 | - | 2.54 mm | 1.016 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.016 mm |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | - | 15.24 mm | 10.16 mm | 15.24 mm | 15.24 mm | 11.43 mm | 15.24 mm | 10.16 mm |