DATASHEET
PCI-EXPRESS CLOCK SOURCE
Description
The ICS557-01 is a clock chip designed for use in
PCI-Express Cards as a clock source. It provides a pair of
differential outputs at 100 MHz in a small 8-pin SOIC
package.
Using IDT’ patented Phase-Locked Loop (PLL) techniques,
the device takes a 25 MHz crystal input and produces
HCSL (Host Clock Signal Level) differential outputs at 100
MHz clock frequency. LVDS signal levels can also be
supported via an alternative termination scheme.
ICS557-01
Features
•
Supports PCI-Express
TM
HCSL Outputs
•
•
•
•
•
•
•
•
•
0.7 V current mode differential pair
Supports LVDS Output Levels
Packaged in 8-pin SOIC
Available in RoHS 5 (green ) or RoHS 6 (green and lead
free) compliant packaging
Operating voltage of 3.3 V
Low power consumption
Input frequency of 25 MHz
Short term jitter 100 ps (peak-to-peak)
Output Enable via pin selection
Industrial temperature range available
NOTE: EOL for non-green parts to occur on 5/13/10
per PDN U-09-01
Block Diagram
VDD
Phase Lock
Loop
X1
25 MHz
crystal /clock
X2
Clock
Buffer/
Crystal
Oscillator
CLK
CLK
Crystal Tuning Capacitors
GND
OE
R
R
(IREF)
IDT™ / ICS™
PCI-EXPRESS CLOCK SOURCE
1
ICS557-01
REV J 092409
ICS557-01
PCI-EXPRESS CLOCK SOURCE
PCIE SSCG
Pin Assignment
OE
X1
X2
GN D
1
2
3
4
8
7
6
5
V DD
CL K
CL K
I RE F
8 P i n ( 1 5 0 mi l ) S OI C
Pin Descriptions
Pin
Number
1
Pin
Name
OE
Pin
Type
Input
Pin Description
Output Enable signal
(H = outputs are enabled, L = outputs are disabled/tristated).
Internal pull-up resistor.
Crystal or clock input. Connect to a 25 MHz crystal or single ended clock.
Crystal Connection. Connect to a parallel mode crystal.
Leave floating if clock input.
Connect to ground.
2
3
4
5
6
7
8
X1
X2
GND
IREF
CLK
CLK
VDD
Input
XO
Power
Output A 475Ω precision resistor connected between this pin and ground
establishes the external reference current.
Output HCSL differential complementary clock output.
Output HCSL differential clock output.
Power
Connect to +3.3 V.
IDT™ / ICS™
PCI-EXPRESS CLOCK SOURCE
2
ICS557-01
REV J 092409
ICS557-01
PCI-EXPRESS CLOCK SOURCE
PCIE SSCG
Applications Information
External Components
A minimum number of external components are required for
proper operation.
Output Structures
IREF
=2.3 mA
6*IREF
Decoupling Capacitors
Decoupling capacitors of 0.01
µF
should be connected
between VDD and the ground plane (pin 4) as close to the
VDD pin as possible. Do not share ground vias between
components. Route power from power source through the
capacitor pad and then into IDT pin.
Crystal
A 25 MHz fundamental mode parallel resonant crystal with
C
L
= 16 pF should be used. This crystal must have less than
300 ppm of error across temperature in order for the
ICS557-01 to meet PCI Express specifications.
R
R
475
W
See Output Termination
Sections - Pages 3 ~ 5
Crystal Capacitors
Crystal capacitors are connected from pins X1 to ground
and X2 to ground to optimize the accuracy of the output
frequency.
C
L
= Crystal’s load capacitance in pF
Crystal Capacitors (pF) = (C
L
- 8) * 2
For example, for a crystal with a 16 pF load cap, each
external crystal cap would be 16 pF. (16-8)*2=16.
Current Source (Iref) Reference Resistor - R
R
If board target trace impedance (Z) is 50Ω then R
R
= 475Ω
,
(1%), providing IREF of 2.32 mA. The output current (I
OH
) is
equal to 6*IREF.
Output Termination
The PCI-Express differential clock outputs of the ICS557-01
are open source drivers and require an external series
resistor and a resistor to ground. These resistor values and
their allowable locations are shown in detail in the
PCI-Express Layout Guidelines
section.
The ICS557-01can also be configured for LVDS compatible
voltage levels. See the LVDS Compatible Layout Guidelines
section
General PCB Layout Recommendations
For optimum device performance and lowest output phase
noise, the following guidelines should be observed.
1. Each 0.01µF decoupling capacitor should be mounted on
the component side of the board as close to the VDD pin as
possible.
2. No vias should be used between decoupling capacitor
and VDD pin.
3. The PCB trace to VDD pin should be kept as short as
possible, as should the PCB trace to the ground via.
Distance of the ferrite bead and bulk decoupling from the
device is less critical.
4. An optimum layout is one with all components on the
same side of the board, minimizing vias through other signal
layers (any ferrite beads and bulk decoupling capacitors can
be mounted on the back). Other signal traces should be
routed away from the ICS557-01.This includes signal traces
just underneath the device, or on layers adjacent to the
ground plane layer used by the device.
IDT™ / ICS™
PCI-EXPRESS CLOCK SOURCE
3
ICS557-01
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ICS557-01
PCI-EXPRESS CLOCK SOURCE
PCIE SSCG
PCI-Express Layout Guidelines
Common Recommendations for Differential Routing
L1 length, Route as non-coupled 50 ohm trace.
L2 length, Route as non-coupled 50 ohm trace.
L3 length, Route as non-coupled 50 ohm trace.
R
S
R
T
Differential Routing on a Single PCB
L4 length, Route as coupled
microstrip
100 ohm differential trace.
L4 length, Route as coupled
stripline
100 ohm differential trace.
Differential Routing to a PCI Express Connector
L4 length, Route as coupled
microstrip
100 ohm differential trace.
L4 length, Route as coupled
stripline
100 ohm differential trace.
Dimension or Value
0.5 max
0.2 max
0.2 max
33
49.9
Dimension or Value
2 min to 16 max
1.8 min to 14.4 max
Dimension or Value
0.25 to 14 max
0.225 min to 12.6 max
Unit
inch
inch
inch
ohm
ohm
Unit
inch
inch
Unit
inch
inch
Figure
1,2
1,2
1,2
1,2
1,2
Figure
1
1
Figure
2
2
Notes
Notes
Notes
Figure 1: PCI-Express Device Routing
L1
R
S
L1’
R
S
L2
L2’
R
T
L3’
R
T
L3
L4
L4’
ICS557-01
Output
Clock
PCI-Express
Load or
Connector
Typical PCI-Express (HCSL) Waveform
700 mV
0
t
OR
0.52 V
0.175 V
500 ps
500 ps
t
OF
0.52 V
0.175 V
IDT™ / ICS™
PCI-EXPRESS CLOCK SOURCE
4
ICS557-01
REV J 092409
ICS557-01
PCI-EXPRESS CLOCK SOURCE
PCIE SSCG
LVDS Compatible Layout Guidelines
LVDS Recommendations for Differential Routing
L1 length, Route as non-coupled 50 ohm trace.
L2 length, Route as non-coupled 50 ohm trace.
R
P
R
Q
R
T
L3 length, Route as coupled 50 ohm differential trace.
L3 length, Route as coupled 50 ohm differential trace.
Dimension or Value
0.5 max
0.2 max
100
100
150
Unit
inch
inch
ohm
ohm
ohm
Figure 3: LVDS Device Routing
L1
R
Q
L1’
L3
L3’
R
P
R
T
ICS557-01
Clock
Output
L2’
L2
R
T
LVDS
Device
Load
Typical LVDS Waveform
1325 mV
1000 mV
t
OR
500 ps
500 ps
t
OF
1250 mV
1150 mV
1250 mV
1150 mV
IDT™ / ICS™
PCI-EXPRESS CLOCK SOURCE
5
ICS557-01
REV J 092409
