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ICSSSTVF16859BG-T

Bus Driver, PDSO64

器件类别:逻辑    逻辑   

厂商名称:IDT (Integrated Device Technology)

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
IDT (Integrated Device Technology)
包装说明
TSSOP, TSSOP64,.32,20
Reach Compliance Code
not_compliant
JESD-30 代码
R-PDSO-G64
JESD-609代码
e0
逻辑集成电路类型
BUS DRIVER
湿度敏感等级
1
端子数量
64
最高工作温度
70 °C
最低工作温度
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装等效代码
TSSOP64,.32,20
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
电源
2.5 V
认证状态
Not Qualified
标称供电电压 (Vsup)
2.5 V
表面贴装
YES
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn85Pb15)
端子形式
GULL WING
端子节距
0.5 mm
端子位置
DUAL
文档预览
Integrated
Circuit
Systems, Inc.
ICSSSTVF16859B
DDR 13-Bit to 26-Bit Registered Buffer
Recommended Applications:
• DDR Memory Modules:
- DDRI (PC1600, PC2100)
- DDR333 (PC2700)
- DDRI-400 (PC3200)
• Provides complete DDR DIMM logic solution with
ICS93V857 or ICS95V857
• SSTL_2 compatible data registers
Product Features:
• Differential clock signals
• Meets SSTL_2 signal data
• Supports SSTL_2 class I specifications on outputs
• Low-voltage operation
- V
DD
= 2.3V to 2.7V
• Available in 64 pin TSSOP and 56 pin MLF packages
Pin Configuration
Q13A
Q12A
Q11A
Q10A
Q9A
VDDQ
GND
Q8A
Q7A
Q6A
Q5A
Q4A
Q3A
Q2A
GND
Q1A
Q13B
VDDQ
Q12B
Q11B
Q10B
Q9B
Q8B
Q7B
Q6B
GND
VDDQ
Q5B
Q4B
Q3B
Q2B
Q1B
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
VDDQ
GND
D13
D12
VDD
VDDQ
GND
D11
D10
D9
GND
D8
D7
RESET#
GND
CLK#
CLK
VDDQ
VDD
VREF
D6
GND
D5
D4
D3
GND
VDDQ
VDD
D2
D1
GND
VDDQ
Truth Table
1
Inputs
RESET#
L
H
H
H
CLK
X or
Floating
L or H
CLK#
X or
Floating
L or H
D
X or
Floating
H
L
X
Q Outputs
Q
L
H
L
Q
0(2)
64-Pin TSSOP
6.10 mm. Body, 0.50 mm. pitch
Q8A
VDDQ
Q9A
Q10A
Q11A
Q12A
Q13A
VDDQ
GND
D13
D12
VDD
VDDQ
D11
56
43
Notes:
1.
H = "High" Signal Level
L = "Low" Signal Level
= Transition "Low"-to-"High"
= Transition "High"-to-"Low"
X = Don't Care
Output level before the indicated steady state
input conditions were established.
2.
Block Diagram
CLK
CLK#
RESET#
D1
VREF
R
CLK
D1
Q1A
Q1B
Q7A
1
Q6A
Q5A
Q4A
Q3A
Q2A
Q1A
Q13B
VDDQ
Q12B
Q11B
Q10B
Q9B
Q8B
14
15
ICSSSTVF16859B
42
D10
ICSSSTVF16859B
D9
D8
D7
RESET#
GND
CLK#
CLK
VDDQ
VDD
VREF
D6
D5
29
D4
28
To 12 Other Channels
1019B—03/15/05
Q7B
Q6B
VDDQ
Q5B
Q4B
Q3B
Q2B
Q1B
VDDQ
D1
D2
VDD
VDDQ
D3
56-pin FVQFN (MLF2)
ICSSSTVF16859B
General Description
The 13-bit-to-26-bit
ICSSSTVF16859B
is a universal bus driver designed for 2.3V to 2.7V V
DD
operation and SSTL_2
I/O levels, except for the LVCMOS RESET# input.
Data flow from D to Q is controlled by the differential clock (CLK/CLK#) and a control signal (RESET#). The positive
edge of CLK is used to trigger the data flow and CLK# is used to maintain sufficient noise margins where as RESET#,
an LVCMOS asynchronous signal, is intended for use at the time of power-up only.
ICSSSTVF16859B
supports low-
power standby operation. A logic level “Low” at RESET# assures that all internal registers and outputs (Q) are reset
to the logic “Low” state, and all input receivers, data (D) and clock (CLK/CLK#) are switched off. Please note that
RESET# must always be supported with LVCMOS levels at a valid logic state because VREF may not be stable during
power-up.
To ensure that outputs are at a defined logic state before a stable clock has been supplied, RESET# must be held
at a logic “Low” level during power up.
In the DDR DIMM application, RESET# is specified to be completely asynchronous with respect to CLK and CLK#.
Therefore, no timing relationship can be guaranteed between the two signals. When entering a low-power standby state,
the register will be cleared and the outputs will be driven to a logic “Low” level quickly relative to the time to disable
the differential input receivers. This ensures there are no glitches on the output. However, when coming out of low-power
standby state, the register will become active quickly relative to the time to enable the differential input receivers. When
the data inputs are at a logic level “Low” and the clock is stable during the “Low”-to-”High” transition of RESET# until
the input receivers are fully enabled, the design ensures that the outputs will remain at a logic “Low” level.
Pin Configuration (64-Pin TSSOP)
PIN NUMBER
1-5, 8-14, 16, 17, 19-25, 28-32
7, 15, 26, 34, 39, 43, 50, 54,
58, 63
6, 18, 27, 33, 38, 47, 59, 64
35, 36, 40-42, 44, 52, 53, 55-
57, 61, 62
48
49
37, 46, 60
51
45
PIN NAME
Q (13:1)
GND
VDDQ
D (13:1)
CLK
CLK#
VDD
RESET#
VREF
TYPE
OUTPUT
PWR
PWR
INPUT
INPUT
INPUT
PWR
INPUT
INPUT
Data output
Ground
Output supply voltage, 2.5V nominal
Data input
Positive master clock input
Negative master clock input
Core supply voltage, 2.5V nominal
Reset (active low)
Input reference voltage, 2.5V nominal
DESCRIPTION
Pin Configuration (56-Pin MLF2)
PIN NUMBER
1-8, 10-16, 18-22, 50-54, 56
37, 48
9, 17, 23, 27, 34, 44, 49, 55
24, 25, 28-31, 39-43, 46, 47
35
36
26, 33, 45
38
32
-
1019B—03/15/05
PIN NAME
Q (13:1)
GND
VDDQ
D (13:1)
CLK
CLK#
VDD
RESET#
VREF
Center PAD
TYPE
OUTPUT
PWR
PWR
INPUT
INPUT
INPUT
PWR
INPUT
INPUT
PWR
Data output
Ground
DESCRIPTION
Output supply voltage, 2.5V nominal
Data input
Positive master clock input
Negative master clock input
Core supply voltage, 2.5V nominal
Reset (active low)
Input reference voltage, 2.5V nominal
Ground (MLF2 package only)
2
ICSSSTVF16859B
Absolute Maximum Ratings
Storage Temperature . . . . . . . . . . . . . . . . . . . .
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . .
Input Voltage
1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Voltage
1,2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Clamp Current . . . . . . . . . . . . . . . . . . . .
Output Clamp Current . . . . . . . . . . . . . . . . . . .
Continuous Output Current . . . . . . . . . . . . . . .
V
DD
, V
DDQ
or GND Current/Pin . . . . . . . . . . .
Package Thermal Impedance
3
...............
–65°C to +150°C
-0.5 to 3.6V
-0.5 to V
DD
+0.5
-0.5 to V
DDQ
+0.5
±50 mA
±50 mA
±50 mA
±100 mA
55°C/W
Notes:
1. The input and output negative voltage
ratings may be excluded if the input
and output clamp ratings are observed.
2. This current will flow only when the
output is in the high state level
V
0
>V
DDQ
.
3. The package thermal impedance is
calculated in accordance with
JESD 51.
Stresses above those listed under
Absolute Maximum Ratings
may cause permanent damage to the device. These
ratings are stress specifications only and functional operation of the device at these or any other conditions above those
listed in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect product reliability.
Recommended Operating Conditions - DDRI/DDR333 (PC1600, PC2100, PC2700)
PARAMETER
V
DD
V
DDQ
V
REF
V
TT
V
I
V
IH (DC)
V
IH (AC)
V
IL (DC)
V
IL (DC)
V
IH
V
IL
V
ICR
V
ID
V
IX
I
OH
I
OL
T
A
1
DESCRIPTION
Supply Voltage
I/O Supply Voltage
Reference Voltage
Termination Voltage
Input Voltage
DC Input High Voltage
AC Input High Voltage
Data Inputs
DC Input Low Voltage
AC Input Low Voltage
Input High Voltage Level
RESET#
Input Low Voltage Level
Common mode Input Range
CLK, CLK#
Differential Input Voltage
Cross Point Voltage of Differential Clock
Pair
High-Level Output Current
Low-Level Output Current
Operating Free-Air Temperature
MIN
2.3
2.3
1.15
V
REF
- 0.04
0
V
REF
+ 0.15
V
REF
+ 0.31
TYP
2.5
2.5
1.25
V
REF
MAX
2.7
2.7
1.35
V
REF
+ 0.04
V
DDQ
UNITS
V
REF
- 0.15
V
REF
- 0.31
1.7
0.97
0.36
(V
DDQ
/2) - 0.2
0.7
1.53
V
(V
DDQ
/2) + 0.2
-16
16
70
mA
°C
0
Guaranteed by design, not 100% tested in production.
1019B—03/15/05
3
ICSSSTVF16859B
Recommended Operating Conditions - DDRI-400 (PC3200)
PARAMETER
V
DD
V
DDQ
V
REF
V
TT
V
I
V
IH (DC)
V
IH (AC)
V
IL (DC)
V
IL (DC)
V
IH
V
IL
V
ICR
V
ID
V
IX
I
OH
I
OL
T
A
1
DESCRIPTION
Supply Voltage
I/O Supply Voltage
Reference Voltage
Termination Voltage
Input Voltage
DC Input High Voltage
AC Input High Voltage
Data Inputs
DC Input Low Voltage
AC Input Low Voltage
Input High Voltage Level
RESET#
Input Low Voltage Level
Common mode Input Range
CLK, CLK#
Differential Input Voltage
Cross Point Voltage of Differential Clock
Pair
High-Level Output Current
Low-Level Output Current
Operating Free-Air Temperature
MIN
2.5
2.5
1.25
V
REF
- 0.04
0
V
REF
+ 0.15
V
REF
+ 0.31
TYP
2.6
2.6
1.3
V
REF
MAX
2.7
2.7
1.35
V
REF
+ 0.04
V
DDQ
UNITS
V
REF
- 0.15
V
REF
- 0.31
1.7
0.97
0.36
(V
DDQ
/2) - 0.2
0.7
1.53
V
(V
DDQ
/2) + 0.2
-16
16
70
mA
°C
0
Guaranteed by design, not 100% tested in production.
1019B—03/15/05
4
ICSSSTVF16859B
DC Electrical Characteristics - DDRI/DDR333 (PC1600, PC2100, PC2700)
T
A
= 0 - 70°C; V
DD
= 2.5 +/-0.2V, V
DDQ
=2.5 +/-0.2V; (unless otherwise stated)
SYMBOL
V
IK
V
OH
V
OL
I
I
I
DD
All Inputs
Standby (Static)
Operating (Static)
Dynamic operating
(clock only)
PARAMETERS
I
I
= -18mA
I
OH
= -100µA
I
OH
= -8mA
I
OL
= 100µA
I
OL
= 8mA
V
I
= V
DD
or GND
RESET# = GND
V
I
= V
IH(AC)
or V
IL(AC)
,
RESET# = V
DD
RESET# = V
DD
,
V
I
= V
IH(AC)
or V
IL(AC)
, CLK
and CLK# switching 50%
duty cycle.
RESET# = V
DD
,
V
I
= V
IH(AC)
or V
IL (AC)
, CLK
and CLK# switching 50%
duty cycle. One data input
switching at half clock
frequency, 50% duty cycle
I
OH
= -16mA
I
OL
= 16mA
I
O
= 20mA, T
A
= 25° C
V
I
= V
REF
±350mV
V
ICR
= 1.25V, V
I(PP)
= 360mV
2.3V-2.7V
2.3V-2.7V
2.5V
2.5V
2.5
2.5
7
7
CONDITIONS
V
DDQ
2.3V
2.3V-2.7V
2.3V
2.3V-2.7V
2.3V
2.7V
MIN
V
DDQ
-
0.2
1.95
0.2
0.35
±5
0.01
TBD
TYP
MAX
-1.2
UNITS
V
µA
µA
mA
TBD
I
O
= 0
2.7V
µ/clock MHz
I
DDD
Dynamic Operating
(per each data input)
TBD
µA/ clock
MHz/data
r
OH
r
OL
r
O(D)
C
i
Output High
Output Low
[r
OH
- r
OL
] each
separate bit
Data Inputs
CLK and CLK#
13.5
13
20
20
4
3.5
3.5
pF
Notes:
1 - Guaranteed by design, not 100% tested in production.
1019B—03/15/05
5
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参数对比
与ICSSSTVF16859BG-T相近的元器件有:ICSSSTVF16859BKLF-T、ICSSSTVF16859BGLF-T、ICSSSTVF16859BK-T、ICSSSTVF16859BKT。描述及对比如下:
型号 ICSSSTVF16859BG-T ICSSSTVF16859BKLF-T ICSSSTVF16859BGLF-T ICSSSTVF16859BK-T ICSSSTVF16859BKT
描述 Bus Driver, PDSO64 Bus Driver, PQCC56 Bus Driver, PDSO64 Bus Driver, PQCC56 Bus Driver, PQCC56
是否Rohs认证 不符合 符合 符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Reach Compliance Code not_compliant unknown unknown unknown not_compliant
JESD-30 代码 R-PDSO-G64 S-PQCC-N56 R-PDSO-G64 S-PQCC-N56 S-PQCC-N56
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
端子数量 64 56 64 56 56
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP QCCN TSSOP QCCN QCCN
封装等效代码 TSSOP64,.32,20 LCC56,.31SQ,20 TSSOP64,.32,20 LCC56,.31SQ,20 LCC56,.31SQ,20
封装形状 RECTANGULAR SQUARE RECTANGULAR SQUARE SQUARE
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER CHIP CARRIER
电源 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES YES
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 GULL WING NO LEAD GULL WING NO LEAD NO LEAD
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 DUAL QUAD DUAL QUAD QUAD
JESD-609代码 e0 e3 e3 - e0
湿度敏感等级 1 3 1 - 3
端子面层 Tin/Lead (Sn85Pb15) Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed - Tin/Lead (Sn85Pb15)
Is Samacsys - N N N -
Base Number Matches - 1 1 1 -
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