型号
- 型号
- 关键词
IC,MICROPROGRAM SEQUENCER,TTL,DIP,28PIN,CERAMIC
器件类别：嵌入式处理器和控制器 微控制器和处理器
厂商名称：National Semiconductor（TI ）
厂商官网：http://www.ti.com
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| 型号 | IDM2909AJM/883 | IDM2909ANC | IDM2909AJC | IDM2909AJM | IDM2911AJC | IDM2911AJM/883B | IDM2911AJM | IDM2911AJM/883 | IDM2911ANC |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC,MICROPROGRAM SEQUENCER,TTL,DIP,28PIN,CERAMIC | IC 4-BIT, MICROPROGRAM SEQUENCER, PDIP28, PLASTIC, DIP-28, Bit-Slice Processor | IC,MICROPROGRAM SEQUENCER,TTL,DIP,28PIN,CERAMIC | IC,MICROPROGRAM SEQUENCER,TTL,DIP,28PIN,CERAMIC | IC,MICROPROGRAM SEQUENCER,TTL,DIP,20PIN,CERAMIC | IC 4-BIT, MICROPROGRAM SEQUENCER, DIP20, DIP-20, Bit-Slice Processor | IC,MICROPROGRAM SEQUENCER,TTL,DIP,20PIN,CERAMIC | IC,MICROPROGRAM SEQUENCER,TTL,DIP,20PIN,CERAMIC | IC 4-BIT, MICROPROGRAM SEQUENCER, PDIP20, PLASTIC, DIP-20, Bit-Slice Processor |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| Reach Compliance Code | compliant | unknown | compliant | compliant | compliant | unknown | compliant | compliant | unknown |
| JESD-30 代码 | R-XDIP-T28 | R-PDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-PDIP-T20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 28 | 28 | 28 | 28 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C |
| 最低工作温度 | -55 °C | - | - | -55 °C | - | -55 °C | -55 °C | -55 °C | - |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | UNSPECIFIED | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | TTL | TTL | TTL | TTL | TTL | BIPOLAR | TTL | TTL | TTL |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| uPs/uCs/外围集成电路类型 | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
