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IDT54FBT2373CEB

Bus Driver, BCT/FBT Series, 1-Func, 8-Bit, True Output, BICMOS, CDFP20, CERPACK-20

器件类别:逻辑    逻辑   

厂商名称:IDT (Integrated Device Technology)

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
IDT (Integrated Device Technology)
零件包装代码
DFP
包装说明
DFP, FL20,.3
针数
20
Reach Compliance Code
not_compliant
系列
BCT/FBT
JESD-30 代码
R-GDFP-F20
JESD-609代码
e0
负载电容(CL)
50 pF
逻辑集成电路类型
BUS DRIVER
最大I(ol)
0.012 A
位数
8
功能数量
1
端口数量
2
端子数量
20
最高工作温度
125 °C
最低工作温度
-55 °C
输出特性
3-STATE WITH SERIES RESISTOR
输出极性
TRUE
封装主体材料
CERAMIC, GLASS-SEALED
封装代码
DFP
封装等效代码
FL20,.3
封装形状
RECTANGULAR
封装形式
FLATPACK
电源
5 V
最大电源电流(ICC)
1.5 mA
认证状态
Not Qualified
筛选级别
38535Q/M;38534H;883B
座面最大高度
2.337 mm
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
BICMOS
温度等级
MILITARY
端子面层
Tin/Lead (Sn/Pb)
端子形式
FLAT
端子节距
1.27 mm
端子位置
DUAL
宽度
6.9215 mm
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参数对比
与IDT54FBT2373CEB相近的元器件有:IDT74FBT2373CD、IDT74FBT2373CE、IDT74FBT2373CSO、IDT54FBT2373CLB、IDT54FBT2373CDB、IDT74FBT2373CP、IDT74FBT2373CL。描述及对比如下:
型号 IDT54FBT2373CEB IDT74FBT2373CD IDT74FBT2373CE IDT74FBT2373CSO IDT54FBT2373CLB IDT54FBT2373CDB IDT74FBT2373CP IDT74FBT2373CL
描述 Bus Driver, BCT/FBT Series, 1-Func, 8-Bit, True Output, BICMOS, CDFP20, CERPACK-20 Bus Driver, BCT/FBT Series, 1-Func, 8-Bit, True Output, BICMOS, CDIP20, 0.300 INCH, CERDIP-20 Bus Driver, BCT/FBT Series, 1-Func, 8-Bit, True Output, BICMOS, CDFP20, CERPACK-20 Bus Driver, BCT/FBT Series, 1-Func, 8-Bit, True Output, BICMOS, PDSO20, 0.300 INCH, SOIC-20 Bus Driver, BCT/FBT Series, 1-Func, 8-Bit, True Output, BICMOS, CQCC20, LCC-20 Bus Driver, BCT/FBT Series, 1-Func, 8-Bit, True Output, BICMOS, CDIP20, 0.300 INCH, CERDIP-20 Bus Driver, BCT/FBT Series, 1-Func, 8-Bit, True Output, BICMOS, PDIP20, 0.300 INCH, PLASTIC, DIP-20 Bus Driver, BCT/FBT Series, 1-Func, 8-Bit, True Output, BICMOS, CQCC20, LCC-20
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 DFP DIP DFP SOIC QLCC DIP DIP QLCC
包装说明 DFP, FL20,.3 DIP, DIP20,.3 DFP, FL20,.3 SOP, SOP20,.4 QCCN, LCC20,.35SQ DIP, DIP20,.3 DIP, DIP20,.3 QCCN, LCC20,.35SQ
针数 20 20 20 20 20 20 20 20
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
系列 BCT/FBT BCT/FBT BCT/FBT BCT/FBT BCT/FBT BCT/FBT BCT/FBT BCT/FBT
JESD-30 代码 R-GDFP-F20 R-GDIP-T20 R-GDFP-F20 R-PDSO-G20 S-CQCC-N20 R-GDIP-T20 R-PDIP-T20 S-CQCC-N20
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
最大I(ol) 0.012 A 0.001 A 0.001 A 0.001 A 0.012 A 0.012 A 0.001 A 0.001 A
位数 8 8 8 8 8 8 8 8
功能数量 1 1 1 1 1 1 1 1
端口数量 2 2 2 2 2 2 2 2
端子数量 20 20 20 20 20 20 20 20
最高工作温度 125 °C 70 °C 70 °C 70 °C 125 °C 125 °C 70 °C 70 °C
输出特性 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR
输出极性 TRUE TRUE TRUE TRUE TRUE TRUE TRUE TRUE
封装主体材料 CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
封装代码 DFP DIP DFP SOP QCCN DIP DIP QCCN
封装等效代码 FL20,.3 DIP20,.3 FL20,.3 SOP20,.4 LCC20,.35SQ DIP20,.3 DIP20,.3 LCC20,.35SQ
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR SQUARE
封装形式 FLATPACK IN-LINE FLATPACK SMALL OUTLINE CHIP CARRIER IN-LINE IN-LINE CHIP CARRIER
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
最大电源电流(ICC) 1.5 mA 1.5 mA 1.5 mA 1.5 mA 1.5 mA 1.5 mA 1.5 mA 1.5 mA
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.337 mm 4.445 mm 2.337 mm 2.65 mm 2.54 mm 4.445 mm 4.191 mm 2.54 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES NO YES YES YES NO NO YES
技术 BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS
温度等级 MILITARY COMMERCIAL COMMERCIAL COMMERCIAL MILITARY MILITARY COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb)
端子形式 FLAT THROUGH-HOLE FLAT GULL WING NO LEAD THROUGH-HOLE THROUGH-HOLE NO LEAD
端子节距 1.27 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL QUAD DUAL DUAL QUAD
宽度 6.9215 mm 7.62 mm 6.9215 mm 7.5 mm 8.89 mm 7.62 mm 7.62 mm 8.89 mm
厂商名称 IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
长度 - 25.3365 mm - 12.8 mm 8.89 mm 25.3365 mm 26.1874 mm 8.89 mm
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