IDT61594L30DB,IDT61594L30DB pdf中文资料,IDT61594L30DB引脚图,IDT61594L30DB电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

厂商名称

IDT (Integrated Device Technology)

零件包装代码

DIP

包装说明

DIP,

针数

Reach Compliance Code

unknown

ECCN代码

3A001.A.2.C

最长访问时间

13 ns

JESD-30 代码

R-GDIP-T28

JESD-609代码

内存密度

65536 bit

内存集成电路类型

CACHE SRAM

内存宽度

功能数量

端口数量

端子数量

字数

16384 words

字数代码

16000

工作模式

SYNCHRONOUS

最高工作温度

125 °C

最低工作温度

-55 °C

组织

16KX4

输出特性

3-STATE

可输出

YES

封装主体材料

CERAMIC, GLASS-SEALED

封装代码

DIP

封装形状

RECTANGULAR

封装形式

IN-LINE

并行/串行

PARALLEL

认证状态

Not Qualified

标称供电电压 (Vsup)

5 V

表面贴装

技术

CMOS

温度等级

MILITARY

端子面层

TIN LEAD

端子形式

THROUGH-HOLE

端子位置

DUAL

参数对比

与IDT61594L30DB相近的元器件有：IDT61594S30CB、IDT61594L25P、IDT61594S25C、IDT61594L30CB、IDT61594S30DB、IDT61594L25D、IDT61594S25D、IDT61594S25P、IDT61594L25C。描述及对比如下：

型号	IDT61594L30DB	IDT61594S30CB	IDT61594L25P	IDT61594S25C	IDT61594L30CB	IDT61594S30DB	IDT61594L25D	IDT61594S25D	IDT61594S25P	IDT61594L25C
描述	Cache SRAM, 16KX4, 13ns, CMOS, CDIP28, DIP-28	Cache SRAM, 16KX4, 13ns, CMOS, CDIP28, DIP-28	Cache SRAM, 16KX4, 10ns, CMOS, PDIP28, DIP-28	Cache SRAM, 16KX4, 10ns, CMOS, CDIP28, DIP-28	Cache SRAM, 16KX4, 13ns, CMOS, CDIP28, DIP-28	Cache SRAM, 16KX4, 13ns, CMOS, CDIP28, DIP-28	Cache SRAM, 16KX4, 10ns, CMOS, CDIP28, DIP-28	Cache SRAM, 16KX4, 10ns, CMOS, CDIP28, DIP-28	Cache SRAM, 16KX4, 10ns, CMOS, PDIP28, DIP-28	Cache SRAM, 16KX4, 10ns, CMOS, CDIP28, DIP-28
零件包装代码	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
包装说明	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,
针数	28	28	28	28	28	28	28	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	3A001.A.2.C	3A001.A.2.C	EAR99	EAR99	3A001.A.2.C	3A001.A.2.C	EAR99	EAR99	EAR99	EAR99
最长访问时间	13 ns	13 ns	10 ns	10 ns	13 ns	13 ns	10 ns	10 ns	10 ns	10 ns
JESD-30 代码	R-GDIP-T28	R-CDIP-T28	R-PDIP-T28	R-CDIP-T28	R-CDIP-T28	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-PDIP-T28	R-CDIP-T28
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
内存密度	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit
内存集成电路类型	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM
内存宽度	4	4	4	4	4	4	4	4	4	4
功能数量	1	1	1	1	1	1	1	1	1	1
端口数量	1	1	1	1	1	1	1	1	1	1
端子数量	28	28	28	28	28	28	28	28	28	28
字数	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words
字数代码	16000	16000	16000	16000	16000	16000	16000	16000	16000	16000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	125 °C	125 °C	70 °C	70 °C	125 °C	125 °C	70 °C	70 °C	70 °C	70 °C
组织	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
可输出	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
封装主体材料	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
封装代码	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
端子形式	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
厂商名称	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)