Multi-Port SRAM, 4KX16, 25ns, CMOS, CQFP84, QFP-84
厂商名称:IDT (Integrated Device Technology)
下载文档型号 | IDT70V24L25F | IDT70V24L55F | IDT70V24L35F | IDT70V24S35F | IDT70V24S55F | IDT70V24S25F |
---|---|---|---|---|---|---|
描述 | Multi-Port SRAM, 4KX16, 25ns, CMOS, CQFP84, QFP-84 | Multi-Port SRAM, 4KX16, 55ns, CMOS, CQFP84, QFP-84 | Multi-Port SRAM, 4KX16, 35ns, CMOS, CQFP84, QFP-84 | Multi-Port SRAM, 4KX16, 35ns, CMOS, CQFP84, QFP-84 | Multi-Port SRAM, 4KX16, 55ns, CMOS, CQFP84, QFP-84 | Multi-Port SRAM, 4KX16, 25ns, CMOS, CQFP84, QFP-84 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP |
包装说明 | QFF, | QFF, | QFF, | QFF, | QFF, | QFF, |
针数 | 84 | 84 | 84 | 84 | 84 | 84 |
Reach Compliance Code | compli | compliant | compliant | compliant | compliant | compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 25 ns | 55 ns | 35 ns | 35 ns | 55 ns | 25 ns |
其他特性 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN |
JESD-30 代码 | S-CQFP-F84 | S-CQFP-F84 | S-CQFP-F84 | S-CQFP-F84 | S-CQFP-F84 | S-CQFP-F84 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 29.21 mm | 29.21 mm | 29.21 mm | 29.21 mm | 29.21 mm | 29.21 mm |
内存密度 | 65536 bi | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bi |
内存集成电路类型 | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 84 | 84 | 84 | 84 | 84 | 84 |
字数 | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
字数代码 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 4KX16 | 4KX16 | 4KX16 | 4KX16 | 4KX16 | 4KX16 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
可输出 | YES | YES | YES | YES | YES | YES |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QFF | QFF | QFF | QFF | QFF | QFF |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 225 | 225 | 225 | 225 | 225 | 225 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.556 mm | 3.556 mm | 3.556 mm | 3.556 mm | 3.556 mm | 3.556 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 |
宽度 | 29.21 mm | 29.21 mm | 29.21 mm | 29.21 mm | 29.21 mm | 29.21 mm |