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IDT70V27S35BFGI

Dual-Port SRAM, 32KX16, 35ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144

器件类别:存储   

厂商名称:IDT (Integrated Device Technology)

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
IDT (Integrated Device Technology)
零件包装代码
BGA
包装说明
LFBGA,
针数
144
Reach Compliance Code
compliant
ECCN代码
EAR99
最长访问时间
35 ns
JESD-30 代码
S-PBGA-B144
JESD-609代码
e3
长度
12 mm
内存密度
524288 bit
内存集成电路类型
DUAL-PORT SRAM
内存宽度
16
功能数量
1
端子数量
144
字数
32768 words
字数代码
32000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
32KX16
封装主体材料
PLASTIC/EPOXY
封装代码
LFBGA
封装形状
SQUARE
封装形式
GRID ARRAY, LOW PROFILE, FINE PITCH
并行/串行
PARALLEL
峰值回流温度(摄氏度)
260
认证状态
Not Qualified
座面最大高度
1.5 mm
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Matte Tin (Sn)
端子形式
BALL
端子节距
0.8 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
宽度
12 mm
Base Number Matches
1
文档预览
HIGH-SPEED 3.3V
32K x 16 DUAL-PORT
STATIC RAM
Features:
IDT70V27S/L
True Dual-Ported memory cells which allow simultaneous
access of the same memory location
High-speed access
– Commercial: 15/20/25/35/55ns (max.)
– Industrial: 20/35ns (max.)
Low-power operation
– IDT70V27S
Active: 500mW (typ.)
Standby: 3.3mW (typ.)
– IDT70V27L
Active: 500mW (typ.)
Standby: 660
µ
W (typ.)
Separate upper-byte and lower-byte control for bus
matching capability
Dual chip enables allow for depth expansion without
external logic
IDT70V27 easily expands data bus width to 32 bits or more
using the Master/Slave select when cascading more than
one device
M/S = V
IH
for
BUSY
output flag on Master,
M/S = V
IL
for
BUSY
input on Slave
Busy and Interrupt Flags
On-chip port arbitration logic
Full on-chip hardware support of semaphore signaling
between ports
Fully asynchronous operation from either port
LVTTL-compatible, single 3.3V (±0.3V) power supply
Available in 100-pin Thin Quad Flatpack (TQFP), and 144-
pin Fine Pitch BGA (fpBGA)
Industrial temperature range (-40°C to +85°C) is available
for selected speeds
Green parts available, see ordering information
Functional Block Diagram
R/
W
L
UB
L
CE
0L
R/W
R
UB
R
CE
0R
CE
1L
OE
L
LB
L
CE
1R
OE
R
LB
R
I/O
8-15L
I/O
0-7L
BUSY
L
(1,2)
I/O
8-15R
I/O
Control
I/O
Control
I/O
0-7R
BUSY
R
(1,2)
,
A
14L
A
0L
Address
Decoder
A
14L
A
0L
CE
0L
32Kx16
MEMORY
ARRAY
70V27
Address
Decoder
A
14R
A
0R
CE
1L
OE
L
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
A
14R
A
0R
CE
0R
CE
1R
OE
R
R/
W
L
SEM
L
INT
L
(2)
(2)
R/
W
R
SEM
R
(2)
INT
R
3603 drw 01
M/
S
NOTES:
1)
BUSY
is an input as a Slave (M/S=V
IL
) and an output as a Master (M/S=V
IH
).
2)
BUSY
and
INT
are non-tri-state totem-pole outputs (push-pull).
JANUARY 2006
6.01
1
©2006 Integrated Device Technology, Inc.
DSC 3603/9
IDT 70V27S/L
High-Speed 3.3V 32K x 16 Dual-Port Static RAM
Commercial and Industrial Temperature Range
Description:
The IDT70V27 is a high-speed 32K x 16 Dual-Port Static RAM,
designed to be used as a stand-alone 512K-bit Dual-Port RAM or as a
combination MASTER/SLAVE Dual-Port RAM for 32-bit and wider word
systems. Using the IDT MASTER/SLAVE Dual-Port RAM approach in 32-
bit or wider memory system applications results in full-speed, error-free
operation without the need for additional discrete logic.
The device provides two independent ports with separate control,
address, and I/O pins that permit independent, asynchronous access for
reads or writes to any location in memory. An automatic power down
feature controlled by the chip enables (
CE
0
and
CE
1
) permits the on-chip
circuitry of each port to enter a very low standby power mode.
Fabricated using IDT’s CMOS high-performance technology,
these devices typically operate on only 500mW of power. The IDT70V27
is packaged in a 100-pin Thin Quad Flatpack (TQFP) and a 144-pin Fine
Pitch BGA (fp BGA).
Pin Configurations
(1,2,3)
INDEX
A
9L
A
10L
A
11L
A
12L
A
13L
A
14L
NC
NC
NC
LB
L
UB
L
CE
0L
CE
1L
SEM
L
V
DD
R/W
L
OE
L
V
SS
V
SS
I/O
15L
I/O
14L
I/O
13L
I/O
12L
I/O
11L
I/O
10L
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
1
75
2
74
3
73
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
A
8L
A
7L
A
6L
A
5L
A
4L
A
3L
A
2L
A
1L
A
0L
NC
INT
L
BUSY
L
V
SS
M/S
BUSY
R
INT
R
A
0R
A
1R
A
2R
A
3R
A
4R
A
5R
A
6R
A
7R
A
8R
IDT70V27PF
PN100-1
(4)
100-PIN TQFP
TOP VIEW
(5)
51
25
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
07/29/04
A
9R
A
10R
A
11R
A
12R
A
13R
A
14R
NC
NC
NC
LB
R
UB
R
CE
0R
CE
1R
SEM
R
V
SS
R/W
R
OE
R
V
SS
V
SS
I/O
15R
I/O
14R
I/O
13R
I/O
12R
I/O
11R
I/O
10R
3603 drw 02
NOTES:
1. All V
DD
pins must be connected to power supply.
2. All V
SS
pins must be connected to ground supply.
3. Package body is approximately 14mm x 14mm x 1.4mm.
4. This package code is used to reference the package diagram.
5. This text does not indicate orientation of the actual part-marking.
I/O
9L
I/O
8L
V
DD
I/O
7L
I/O
6L
I/O
5L
I/O
4L
I/O
3L
I/O
2L
V
SS
I/O1
L
I/O
0L
V
SS
I/O
0R
I/O
1R
I/O
2R
I/O
3R
I/O
4R
I/O
5R
I/O
6R
V
DD
I/O
7R
I/O
8R
I/O
9R
NC
2
IDT 70V27S/L
High-Speed 3.3V 32K x 16 Dual-Port Static RAM
Commercial and Industrial Temperature Range
Pin Configurations
(1,2,3)
(con't.)
07/29/04
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
NC
B1
NC
B2
A
8L
B3
A
5L
B4
A
1L
B5
INT
L
B6
V
SS
B7
BUSY
R
A
1R
B8
B9
A
5R
B10
NC
B11
NC
B12
NC
B13
NC
C1
NC
C2
NC
C3
A
6L
C4
A
2L
C5
NC
C6
M/S
C7
INT
R
C8
A
2R
C9
A
6R
C10
NC
C11
NC
C12
NC
C13
A
10L
D1
A
9L
D2
NC
D3
A
7L
D4
A
3L
D5
NC
D6
NC
D7
D8
NC
A
3R
D9
A
7R
D10
A
9R
D11
A
10R
D12
A
11R
D13
A
14L
E1
A
13L
E2
A
12L
E3
A
11L
E4
A
4L
A
0L
BUSY
L
A
0R
A
4R
A
8R
E10
A
12R
E11
A
13R
E12
A
14R
E13
LB
L
F1
NC
F2
F3
NC
F4
NC
UB
L
G4
NC
F10
NC
F11
NC
F12
LB
R
F13
SEM
L
CE
1L
G1
G2
CE
0L
G3
IDT70V27BF
BF144-1
(4)
UB
R
G10
CE
0R
CE
1R
SEM
R
G11
G12
G13
V
DD
H1
V
DD
H2
V
DD
H3
H4
NC
144-Pin fpBGA
Top View
(5)
NC
H10
NC
H11
V
SS
H12
V
SS
H13
NC
J1
R/W
L
J2
J3
OE
L
J4
NC
NC
J10
OE
R
J11
R/W
R
J12
V
SS
J13
V
SS
K1
I/O
15L
I/O
14L
I/0
13L
K2
K3
K4
K5
K6
K7
K8
K9
I/O
13R
I/O
14R
I/O1
5R
K10
K11
K12
V
SS
K13
I/O
12L
L1
NC
L2
NC
L3
L4
NC
I/O
6L
I/O
3L
L5
L6
I/O
0R
I/O
3R
L7
L8
I/O
6R
I/O
11R
L9
L10
NC
L11
NC
L12
I/O
12R
L13
,
I/O
11L
I/O
10L
M1
M2
NC
M3
NC
M4
I/O
5L
M5
I/O
2L
M6
V
SS
M7
V
DD
M8
I/O
5R
M9
NC
M10
NC
M11
NC
M12
I/O
10R
M13
I/O
9L
N1
NC
N2
NC
N3
V
DD
N4
I/O
4L
N5
V
SS
N6
I/O
0L
N7
I/O
2R
N8
I/O
4R
I/O
7R
N9
N10
I/O
8R
N11
NC
N12
I/O
9R
N13
NC
NC
I/O
8L
I/O
7L
NC
I/O
1L
V
DD
I/O
1R
NC
V
DD
NC
NC
NC
3603 drw 02a
NOTES:
1. All V
DD
pins must be connected to power supply.
2. All V
SS
pins must be connected to ground supply.
3. Package body is approximately 12mm x 12mm x 1.4mm.
4. This package code is used to reference the package diagram.
5. This text does not indicate orientation of the actual part-marking.
Pin Names
Left Port
CE
0L
, CE
1L
R/W
L
OE
L
A
0L
- A
14L
I/O
0L
- I/O
15L
SEM
L
UB
L
LB
L
INT
L
BUSY
L
Right Port
CE
0R
, CE
1R
R/W
R
OE
R
A
0R
- A
14R
I/O
0R
- I/O
15R
SEM
R
UB
R
LB
R
INT
R
BUSY
R
M/S
V
DD
V
ss
Chip Enable
Read/Write Enable
Output Enable
Address
Data Input/Output
Semaphore Enable
Upper Byte Select
Lower Byte Select
Interrupt Flag
Busy Flag
Master or Slave Select
Power (3.3V)
Ground (0V)
3603 tbl 01
Names
3
IDT 70V27S/L
High-Speed 3.3V 32K x 16 Dual-Port Static RAM
Commercial and Industrial Temperature Range
Truth Table I – Chip Enable
(1,2,3)
CE
CE
0
V
IL
L
< 0.2V
V
IH
X
H
>V
DD
-0.2V
X
NOTES:
CE
1
V
IH
>V
DD
-0.2V
X
V
IL
X
<0.2V
Port Selected (TTL Active)
Port Selected (CMOS Active)
Port Deselected (TTL Inactive)
Port Deselected (TTL Inactive)
Mode
Port Deselected (CMOS Inactive)
Port Deselected (CMOS Inactive)
3603 tbl 02
1. Chip Enable references are shown above with the actual
CE
0
and CE
1
levels,
CE
is a reference only.
2. Port "A" and "B" references are located where
CE
is used.
3. "H" = V
IH
and "L" = V
IL
Truth Table II – Non-Contention Read/Write Control
Inputs
(1)
CE
(2)
H
X
L
L
L
L
L
L
X
R/W
X
X
L
L
L
H
H
H
X
OE
X
X
X
X
X
L
L
L
H
UB
X
H
L
H
L
L
H
L
X
LB
X
H
H
L
L
H
L
L
X
SEM
H
H
H
H
H
H
H
H
X
Outputs
I/O
8-15
High-Z
High-Z
DATA
IN
High-Z
DATA
IN
DATA
OUT
High-Z
DATA
OUT
High-Z
I/O
0-7
High-Z
High-Z
High-Z
DATA
IN
DATA
IN
High-Z
DATA
OUT
DATA
OUT
High-Z
Mode
Deselected: Power-Down
Both Bytes Deselected
Write to Upper Byte Only
Write to Lower Byte Only
Write to Both Bytes
Read Upper Byte Only
Read Lower Byte Only
Read Both Bytes
Outputs Disabled
3603 tbl 03
NOTES:
1. A
0L
— A
14L
A
0R
— A
14R.
2. Refer to Chip Enable Truth Table.
Truth Table III – Semaphore Read/Write Control
Inputs
(1)
CE
(2)
H
X
H
X
L
L
R/W
H
H
OE
L
L
X
X
X
X
UB
X
H
X
H
L
X
LB
X
H
X
H
X
L
SEM
L
L
L
L
L
L
Outputs
I/O
8-15
DATA
OUT
DATA
OUT
DATA
IN
DATA
IN
______
______
I/O
0-7
DATA
OUT
DATA
OUT
DATA
IN
DATA
IN
______
______
Mode
Read Data in Semaphore Flag
Read Data in Semaphore Flag
Write I/O
0
into Semaphore Flag
Write I/O
0
into Semaphore Flag
Not Allowed
Not Allowed
3603 tbl 04
X
X
NOTES:
1. There are eight semaphore flags written to I/O
0
and read from all the I/Os (I/O
0
-I/O
15
). These eight semaphore flags are addressed by A
0
-A
2
.
2. Refer to Chip Enable Truth Table.
4
IDT 70V27S/L
High-Speed 3.3V 32K x 16 Dual-Port Static RAM
Commercial and Industrial Temperature Range
Absolute Maximum Ratings
(1)
Symbol
V
TERM
(2)
Rating
Terminal Voltage
with Respect
to GND
Temperature
Under Bias
Storage
Temperature
DC Output
Current
Commercial
& Industrial
-0.5 to +4.6
Unit
V
Maximum Operating Temperature
and Supply Voltage
(1)
Grade
Commercial
Ambient
Temperature
0
O
C to +70
O
C
-40
O
C to +85
O
C
GND
0V
0V
V
DD
3.3V
+
0.3V
3.3V
+
0.3V
3603 tbl 06
T
BIAS
T
STG
I
OUT
-55 to +125
-65 to +150
50
o
C
C
Industrial
o
NOTES:
1. This is the parameter T
A
. This is the "instant on" case temperature.
mA
3603 tbl 05
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS
may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above those
indicated in the operational sections of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect
reliability.
2. V
TERM
must not exceed V
DD
+ 0.3V for more than 25% of the cycle time or 10ns
maximum, and is limited to < 20mA for the period of V
TERM
> V
DD
+ 0.3V.
Recommended DC Operating
Conditions
(1)
Symbol
V
DD
V
SS
V
IH
Parameter
Supply Voltage
Ground
Input High Voltage
Input Low Voltage
Min.
3.0
0
2.0
-0.3
(1)
Typ.
3.3
0
____
Max.
3.6
0
V
DD
+0.3V
(2)
0.8
Unit
V
V
V
V
3603 tbl 07
Capacitance
Symbol
C
IN
C
OUT
(2)
(1)
V
IL
____
(T
A
= +25°C, f = 1.0mhz)TQFP ONLY
Parameter
Input Capacitance
Output Capacitance
Conditions
V
IN
= 0V
V
OUT
= 0V
Max.
9
10
Unit
pF
pF
NOTES:
1. V
IL
> -1.5V for pulse width less than 10ns.
2. V
TERM
must not exceed V
DD
+ 0.3V.
NOTES:
1. This parameter is determined by device characterization but is not
production tested.
2. C
OUT
also reference C
I/O
.
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range
(V
DD
= 3.3V ± 0.3V)
70V27S
Symbol
|I
LI
|
|I
LO
|
V
OL
V
OH
NOTE:
1. At
V
DD
70V27L
Min.
___
Parameter
Input Leakage Current
(1)
Output Leakage Current
Output Low Voltage
Output High Voltage
Test Conditions
V
DD
= 3.6V, V
IN
= 0V to V
DD
CE
= V
IH
, V
OUT
= 0V to V
DD
I
OL
= 4mA
I
OH
= -4mA
Min.
___
Max.
10
10
0.4
___
Max.
5
5
0.4
___
Unit
µA
µA
V
V
3603 tbl 09
___
___
___
___
2.4
2.4
<
2.0V, input leakages are undefined.
5
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参数对比
与IDT70V27S35BFGI相近的元器件有:IDT70V27L20BFGI、IDT70V27S35PFGI、IDT70V27S20BFGI、IDT70V27S20PFGI、IDT70V27L35BFGI。描述及对比如下:
型号 IDT70V27S35BFGI IDT70V27L20BFGI IDT70V27S35PFGI IDT70V27S20BFGI IDT70V27S20PFGI IDT70V27L35BFGI
描述 Dual-Port SRAM, 32KX16, 35ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144 Dual-Port SRAM, 32KX16, 20ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144 Dual-Port SRAM, 32KX16, 35ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-100 Dual-Port SRAM, 32KX16, 20ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144 Dual-Port SRAM, 32KX16, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-100 Dual-Port SRAM, 32KX16, 35ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 BGA BGA QFP BGA QFP BGA
包装说明 LFBGA, LFBGA, LFQFP, LFBGA, LFQFP, LFBGA,
针数 144 144 100 144 100 144
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 3A991.B.2.B EAR99 3A991.B.2.B 3A991.B.2.B EAR99
最长访问时间 35 ns 20 ns 35 ns 20 ns 20 ns 35 ns
JESD-30 代码 S-PBGA-B144 S-PBGA-B144 S-PQFP-G100 S-PBGA-B144 S-PQFP-G100 S-PBGA-B144
JESD-609代码 e3 e3 e3 e3 e3 e3
长度 12 mm 12 mm 14 mm 12 mm 14 mm 12 mm
内存密度 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 16 16 16 16 16 16
功能数量 1 1 1 1 1 1
端子数量 144 144 100 144 100 144
字数 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
字数代码 32000 32000 32000 32000 32000 32000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 32KX16 32KX16 32KX16 32KX16 32KX16 32KX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFBGA LFBGA LFQFP LFBGA LFQFP LFBGA
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 260 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.5 mm 1.5 mm 1.6 mm 1.5 mm 1.6 mm 1.5 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Matte Tin (Sn) Matte Tin (Sn) MATTE TIN Matte Tin (Sn) MATTE TIN Matte Tin (Sn)
端子形式 BALL BALL GULL WING BALL GULL WING BALL
端子节距 0.8 mm 0.8 mm 0.5 mm 0.8 mm 0.5 mm 0.8 mm
端子位置 BOTTOM BOTTOM QUAD BOTTOM QUAD BOTTOM
处于峰值回流温度下的最长时间 30 30 30 30 30 30
宽度 12 mm 12 mm 14 mm 12 mm 14 mm 12 mm
Base Number Matches 1 1 1 1 1 -
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器件捷径:
00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W
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