型号
- 型号
- 关键词
FIFO, 16KX9, 15ns, Synchronous, CMOS, CPGA68, CAVITY-UP, PGA-68
厂商名称：IDT (Integrated Device Technology)
下载文档| 型号 | IDT72264L25GB | IDT72264L15GB | IDT72274L25GB | IDT72274L15GB |
|---|---|---|---|---|
| 描述 | FIFO, 16KX9, 15ns, Synchronous, CMOS, CPGA68, CAVITY-UP, PGA-68 | FIFO, 16KX9, 10ns, Synchronous, CMOS, CPGA68, CAVITY-UP, PGA-68 | FIFO, 32KX9, 15ns, Synchronous, CMOS, CPGA68, CAVITY-UP, PGA-68 | FIFO, 32KX9, 10ns, Synchronous, CMOS, CPGA68, CAVITY-UP, PGA-68 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | PGA | PGA | PGA | PGA |
| 包装说明 | CAVITY-UP, PGA-68 | CAVITY-UP, PGA-68 | CAVITY-UP, PGA-68 | CAVITY-UP, PGA-68 |
| 针数 | 68 | 68 | 68 | 68 |
| Reach Compliance Code | _compli | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 15 ns | 10 ns | 15 ns | 10 ns |
| 其他特性 | RETRANSMIT; AUTOMATIC POWER-DOWN | RETRANSMIT; AUTOMATIC POWER-DOWN | RETRANSMIT; AUTOMATIC POWER-DOWN | RETRANSMIT; AUTOMATIC POWER-DOWN |
| 备用内存宽度 | 9 | 9 | 9 | 9 |
| 最大时钟频率 (fCLK) | 40 MHz | 66.7 MHz | 40 MHz | 66.7 MHz |
| 周期时间 | 25 ns | 15 ns | 25 ns | 15 ns |
| JESD-30 代码 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 29.464 mm | 29.464 mm | 29.464 mm | 29.464 mm |
| 内存密度 | 147456 bi | 147456 bit | 294912 bit | 294912 bit |
| 内存集成电路类型 | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| 内存宽度 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 68 | 68 | 68 | 68 |
| 字数 | 16384 words | 16384 words | 32768 words | 32768 words |
| 字数代码 | 16000 | 16000 | 32000 | 32000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 16KX9 | 16KX9 | 32KX9 | 32KX9 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA | PGA | PGA | PGA |
| 封装等效代码 | PGA68,11X11 | PGA68,11X11 | PGA68,11X11 | PGA68,11X11 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.207 mm | 5.207 mm | 5.207 mm | 5.207 mm |
| 最大压摆率 | 0.19 mA | 0.19 mA | 0.19 mA | 0.19 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
| 宽度 | 29.464 mm | 29.464 mm | 29.464 mm | 29.464 mm |
| Base Number Matches | - | 1 | 1 | 1 |