型号
- 型号
- 关键词
Bi-Directional FIFO, 8KX36, 10ns, Synchronous, CMOS, PQFP128, TQFP-128
厂商名称：IDT (Integrated Device Technology)
下载文档| 型号 | IDT72V3676L15PF | IDT72V3676L10PF | IDT72V3666L10PF |
|---|---|---|---|
| 描述 | Bi-Directional FIFO, 8KX36, 10ns, Synchronous, CMOS, PQFP128, TQFP-128 | Bi-Directional FIFO, 8KX36, 6.5ns, Synchronous, CMOS, PQFP128, TQFP-128 | Bi-Directional FIFO, 4KX36, 6.5ns, Synchronous, CMOS, PQFP128, TQFP-128 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP | QFP | QFP |
| 包装说明 | TQFP-128 | TQFP-128 | LFQFP, QFP128,.63X.87,20 |
| 针数 | 128 | 128 | 128 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 10 ns | 6.5 ns | 6.5 ns |
| 其他特性 | MAIL BOX BYPASS REGISTER | MAIL BOX BYPASS REGISTER | MAIL BOX BYPASS REGISTER |
| 最大时钟频率 (fCLK) | 66.7 MHz | 100 MHz | 100 MHz |
| 周期时间 | 15 ns | 10 ns | 10 ns |
| JESD-30 代码 | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 |
| JESD-609代码 | e0 | e0 | e0 |
| 长度 | 20 mm | 20 mm | 20 mm |
| 内存密度 | 294912 bit | 294912 bit | 147456 bit |
| 内存集成电路类型 | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO |
| 内存宽度 | 36 | 36 | 36 |
| 湿度敏感等级 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 128 | 128 | 128 |
| 字数 | 8192 words | 8192 words | 4096 words |
| 字数代码 | 8000 | 8000 | 4000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C |
| 组织 | 8KX36 | 8KX36 | 4KX36 |
| 可输出 | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFQFP | LFQFP | LFQFP |
| 封装等效代码 | QFP128,.63X.87,20 | QFP128,.63X.87,20 | QFP128,.63X.87,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 |
| 电源 | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm |
| 最大待机电流 | 0.001 A | 0.001 A | 0.001 A |
| 最大供电电压 (Vsup) | 3.6 V | 3.45 V | 3.45 V |
| 最小供电电压 (Vsup) | 3 V | 3.15 V | 3.15 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 |
| 宽度 | 14 mm | 14 mm | 14 mm |
| Base Number Matches | 1 | 1 | 1 |
RF/无线
模拟电子
模拟电子
无线连接
DSP 与 ARM 处理器
嵌入式系统