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IDT74ALVCH16271PF8

Multiplexer And Demux/Decoder, ALVC/VCX/A Series, 1-Func, 1 Line Input, 2 Line Output, True Output, CMOS, PDSO56, TVSOP-56

器件类别:逻辑    逻辑   

厂商名称:IDT (Integrated Device Technology)

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器件参数
参数名称
属性值
厂商名称
IDT (Integrated Device Technology)
零件包装代码
SSOP
包装说明
TVSOP-56
针数
56
Reach Compliance Code
unknown
其他特性
USER SELECTABLE 3.3V VCC
系列
ALVC/VCX/A
JESD-30 代码
R-PDSO-G56
JESD-609代码
e0
长度
11.3 mm
逻辑集成电路类型
MULTIPLEXER AND DEMUX/DECODER
功能数量
1
输入次数
1
输出次数
2
端子数量
56
最高工作温度
85 °C
最低工作温度
-40 °C
输出特性
3-STATE
输出极性
TRUE
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
传播延迟(tpd)
6.4 ns
认证状态
Not Qualified
座面最大高度
1.2 mm
最大供电电压 (Vsup)
2.7 V
最小供电电压 (Vsup)
2.3 V
标称供电电压 (Vsup)
2.5 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
TIN LEAD
端子形式
GULL WING
端子节距
0.4 mm
端子位置
DUAL
宽度
4.4 mm
文档预览
IDT74ALVCH16271
3.3V CMOS 12-BIT TO 24-BIT MULTIPLEXED BUS EXCHANGER
INDUSTRIAL TEMPERATURE RANGE
3.3V CMOS 12-BIT TO
24-BIT MULTIPLEXED BUS
EXCHANGER WITH 3-STATE
OUTPUTS AND BUS-HOLD
• 0.5 MICRON CMOS Technology
• Typical t
SK(o)
(Output Skew) < 250ps
• ESD > 2000V per MIL-STD-883, Method 3015; > 200V using
machine model (C = 200pF, R = 0)
• V
CC
= 3.3V ± 0.3V, Normal Range
• V
CC
= 2.7V to 3.6V, Extended Range
• V
CC
= 2.5V ± 0.2V
• CMOS power levels (0.4µ W typ. static)
µ
• Rail-to-Rail output swing for increased noise margin
• Available in SSOP, TSSOP, and TVSOP packages
IDT74ALVCH16271
FEATURES:
DRIVE FEATURES:
• High Output Drivers: ±24mA
• Suitable for heavy loads
APPLICATIONS:
• 3.3V high speed systems
• 3.3V and lower voltage computing systems
The ALVCH16271 is intended for applications in which two separate data
paths must be multiplexed onto, or demultiplexed from, a single data path. This
device is particularly suitable as an interface between conventional DRAMs and
high-speed microprocessors.
A data is stored in the internal A-to-B registers on the low-to-high transition
of the clock (CLK) input, provided that the clock-enable (CLKENA) inputs are
low. Proper control of these inputs allows two sequential 12-bit words to be
presented as a 24-bit word on the B port. Transparent latches in the B-to-A path
allow asynchronous operation to maximize memory access throughput. These
latches transfer data when the latch-enable (LE) inputs are low. The select (SEL)
line selects 1B or 2B data for the A inputs. Data flow is controlled by the active-
low output enables (OEA,
OEB).
The ALVCH16271 has been designed with a ±24mA output driver. This
driver is capable of driving a moderate to heavy load while maintaining speed
performance.
The ALVCH16271 has “bus-hold” which retains the inputs’ last state when-
ever the input goes to a high impedance. This prevents floating inputs and
eliminates the need for pull-up/down resistors.
DESCRIPTION:
FUNCTIONAL BLOCK DIAGRAM
CLK
29
LE1B
2
27
LE2B
30
CLKENA1
55
CLKENA2
OEB
SEL
56
28
OEA
1
LE
1D
23
1
B
1
0
LE
A
1
8
1
1D
6
2
B
1
CE
C1
1D
CE
C1
1D
1 of 12 Channels
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
INDUSTRIAL TEMPERATURE RANGE
1
© 1999 Integrated Device Technology, Inc.
MARCH 1999
DSC-4476/2
IDT74ALVCH16271
3.3V CMOS 12-BIT TO 24-BIT MULTIPLEXED BUS EXCHANGER
INDUSTRIAL TEMPERATURE RANGE
PIN CONFIGURATION
OEA
LE1B
2
B
3
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
Description
Max
V
TERM
(2)
Terminal Voltage with Respect to GND
–0.5 to +4.6
–0.5 to V
CC
+0.5
–65 to +150
–50 to +50
±50
–50
±100
OEB
CLKENA2
2
B
4
Unit
V
V
°C
mA
mA
mA
mA
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
V
TERM
(3)
Terminal Voltage with Respect to GND
T
STG
I
OUT
I
IK
I
OK
I
CC
I
SS
Storage Temperature
DC Output Current
Continuous Clamp Current,
V
I
< 0 or V
I
> V
CC
Continuous Clamp Current, V
O
< 0
Continuous Current through each
V
CC
or GND
GND
2
B
2
2
B
1
GND
2
B
5
2
B
6
V
CC
A
1
A
2
A
3
GND
A
4
A
5
A
6
A
7
A
8
A
9
GND
A
10
A
11
A
12
V
CC
1
B
1
1
B
2
V
CC
2
B
7
2
B
8
2
B
9
GND
2
B
10
2
B
11
2
B
12
1
B
12
1
B
11
1
B
10
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. V
CC
terminals.
3. All terminals except V
CC
.
CAPACITANCE
(T
A
= +25°C, F = 1.0MHz)
Symbol
C
IN
C
OUT
C
I/O
Parameter
(1)
Input Capacitance
Output Capacitance
I/O Port Capacitance
Conditions
V
IN
= 0V
V
OUT
= 0V
V
IN
= 0V
Typ.
5
7
7
Max.
7
9
9
Unit
pF
pF
pF
GND
1
B
9
1
B
8
1
B
7
NOTE:
1. As applicable to the device type.
V
CC
1
B
6
1
B
5
FUNCTION TABLES
(1)
OUTPUT ENABLE
Inputs
OEA
H
H
L
L
OEB
H
L
H
L
Ax
Z
Z
Active
Active
Outputs
1
Bx,
2
Bx
GND
1
B
3
GND
1
B
4
Z
Active
Z
Active
LE2B
SEL
CLKENA1
CLK
SSOP/ TSSOP/ TVSOP
TOP VIEW
A-TO-B STORAGE (OEB = L )
Inputs
Outputs
CLK
X
Ax
X
L
H
L
H
1
Bx
1
B
0(2)
2
Bx
2
B
0(2)
B-TO-A STORAGE (OEA = L)
Inputs
LE1B
H
H
L
L
X
X
LE2B
H
H
X
X
L
L
SEL
X
X
H
H
L
L
1
Bx
2
Bx
CLKENA1
Outputs
Ax
A
0(2)
A
0(2)
L
H
L
H
H
L
L
X
X
CLKENA2
H
X
X
L
L
L
H
X
X
X
X
L
H
X
X
L
H
X
X
X
X
X
X
L
H
NOTES:
1. H = HIGH Voltage Level
L = LOW Voltage Level
X = Don’t Care
Z = High Impedance
= LOW-to-HIGH transition
2. Output level before the indicated steady-state input conditions were established.
2
IDT74ALVCH16271
3.3V CMOS 12-BIT TO 24-BIT MULTIPLEXED BUS EXCHANGER
INDUSTRIAL TEMPERATURE RANGE
PIN DESCRIPTION
Pin Names
Ax
(1:12)
1Bx
(1:12)
2Bx
(1:12)
CLK
CLKENA1
CLKENA2
LE1B
LE2B
SEL
OEA
OEB
I/O
I/O
I/O
I/O
I
I
I
I
I
I
I
I
Description
Bidirectional Data Port A. Usually connected to the CPU’s Address/Data bus.
(1)
Bidirectional Data Port 1B. Usually connected to the even path or even bank of memory.
(1)
Bidirectional Data Port 2B. Usually connected to the odd path or odd bank of memory.
(1)
Clock Input
Clock Enable Input for the A-1B Register. If
CLKENA1
is LOW during the rising edge of CLK, data will be clocked into register A-1B (Active LOW).
Clock Enable Input for the A-2B Register. If
CLKENA2
is LOW during the rising edge of CLK, data will be clocked into register A-2B (Active LOW).
Latch Enable Input for the 1B-A latch
Latch Enable Input for the 2B-A latch
1B or 2B Port Selection. When HIGH,
SEL
enables data transfer from 1B Port to A Port. When LOW,
SEL
enables data transfer from 2B Port to A
Port (Active LOW).
Output Enable for A Port (Active LOW)
Output Enable for B Port (Active LOW)
NOTE:
1. These pins have "Bus-Hold". All other pins are standard inputs, outputs, or I/Os.
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE
Following Conditions Apply Unless Otherwise Specified:
Operating Condition: T
A
= –40°C to +85°C
Symbol
V
IH
V
IL
I
IH
I
IL
I
OZH
I
OZL
V
IK
V
H
I
CCL
I
CCH
I
CCZ
∆I
CC
Parameter
Input HIGH Voltage Level
Input LOW Voltage Level
Input HIGH Current
Input LOW Current
High Impedance Output Current
(3-State Output pins)
Clamp Diode Voltage
Input Hysteresis
Quiescent Power Supply Current
V
CC
= 2.3V, I
IN
= –18mA
V
CC
= 3.3V
V
CC
= 3.6V
V
IN
= GND or V
CC
One input at V
CC
- 0.6V, other inputs at V
CC
or GND
V
CC
= 2.3V to 2.7V
V
CC
= 2.7V to 3.6V
V
CC
= 2.3V to 2.7V
V
CC
= 2.7V to 3.6V
V
CC
= 3.6V
V
CC
= 3.6V
V
CC
= 3.6V
V
I
= V
CC
V
I
= GND
V
O
= V
CC
V
O
= GND
Test Conditions
Min.
1.7
2
Typ.
(1)
–0.7
100
0.1
Max.
0.7
0.8
±5
±5
±10
±10
–1.2
40
V
mV
µA
µA
µA
µA
V
Unit
V
Quiescent Power Supply Current
Variation
750
µA
NOTE:
1. Typical values are at V
CC
= 3.3V, +25°C ambient.
3
IDT74ALVCH16271
3.3V CMOS 12-BIT TO 24-BIT MULTIPLEXED BUS EXCHANGER
INDUSTRIAL TEMPERATURE RANGE
BUS-HOLD CHARACTERISTICS
Symbol
I
BHH
I
BHL
I
BHH
I
BHL
I
BHHO
I
BHLO
NOTES:
1. Pins with Bus-Hold are identified in the pin description.
2. Typical values are at V
CC
= 3.3V, +25°C ambient.
Parameter
(1)
Bus-Hold Input Sustain Current
Bus-Hold Input Sustain Current
Bus-Hold Input Overdrive Current
V
CC
= 3V
V
CC
= 2.3V
V
CC
= 3.6V
Test Conditions
V
I
= 2V
V
I
= 0.8V
V
I
= 1.7V
V
I
= 0.7V
V
I
= 0 to 3.6V
Min.
– 75
75
– 45
45
Typ.
(2)
Max.
±500
Unit
µA
µA
µA
OUTPUT DRIVE CHARACTERISTICS
Symbol
V
OH
Parameter
Output HIGH Voltage
V
CC
= 2.3V
V
CC
= 2.3V
V
CC
= 2.7V
V
CC
= 3V
V
CC
= 3V
V
OL
Output LOW Voltage
V
CC
= 2.3V to 3.6V
V
CC
= 2.3V
V
CC
= 2.7V
V
CC
= 3V
I
OH
= – 24mA
I
OL
= 0.1mA
I
OL
= 6mA
I
OL
= 12mA
I
OL
= 12mA
I
OL
= 24mA
Test Conditions
(1)
V
CC
= 2.3V to 3.6V
I
OH
= – 0.1mA
I
OH
= – 6mA
I
OH
= – 12mA
Min.
V
CC
– 0.2
2
1.7
2.2
2.4
2
Max.
0.2
0.4
0.7
0.4
0.55
V
Unit
V
NOTE:
1. V
IH
and V
IL
must be within the min. or max. range shown in the DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE table for the appropriate V
CC
range.
T
A
= – 40°C to + 85°C.
OPERATING CHARACTERISTICS, T
A
= 25°C
V
CC
= 2.5V ± 0.2V
Symbol
outputs enabled
C
PD
Power Dissipation Capacitance Ax to xBx,
outputs disabled
Power Dissipation Capacitance xBx to Ax,
outputs enabled
Power Dissipation Capacitance xBx to Ax,
outputs disabled
11
13
39
43
C
L
= 0pF, f = 10Mhz
61
76
pF
Parameter
Power Dissipation Capacitance Ax to xBx,
Test Conditions
Typical
92
V
CC
= 3.3V ± 0.3V
Typical
105
Unit
4
IDT74ALVCH16271
3.3V CMOS 12-BIT TO 24-BIT MULTIPLEXED BUS EXCHANGER
INDUSTRIAL TEMPERATURE RANGE
SWITCHING CHARACTERISTICS
(1)
V
CC
= 2.5V ± 0.2V
Symbol
f
MAX
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
SU
t
SU
t
SU
t
H
t
H
t
H
t
W
t
W
t
SK(O)
Propagation Delay
CLK to xBx
Propagation Delay
xBx to Ax
Propagation Delay
LE
to Ax
Propagation Delay
SEL
to Ax
Output Enable Time
OEB
to Ax or
OEB
to xBx
Output Disable Time
OEB
to Ax or
OEB
to xBx
Set-up Time, Ax data before CLK↑
Set-up Time, Bx data before
LE
Set-up Time,
CLKEN
before CLK↑
Hold Time, Ax data after CLK↑
Hold Time, Bx data after
LE
Hold Time,
CLKEN
after CLK↑
Pulse Width, CLK HIGH or LOW
Pulse Width,
LExB
LOW
Output Skew
(2)
2.6
1.7
1.6
0.6
0.9
1
3.3
3.3
2.1
1.5
1.3
0.6
0.9
0.9
3.3
3.3
1.7
1.3
1
0.7
1.1
0.9
3.3
3.3
500
ns
ns
ns
ns
ns
ns
ns
ns
ps
1.4
5.4
4.6
1.7
4.2
ns
1
6
6.1
1
5.1
ns
1.1
6.4
6.2
1.3
5.2
ns
1
6
5.9
1.4
4.8
ns
1
5.3
4.7
1.4
4
ns
Parameter
Min.
130
1
Max.
6.2
V
CC
= 2.7V
Min.
130
Max.
5
V
CC
= 3.3V ± 0.3V
Min.
130
1
Max.
4.3
Unit
MHz
ns
NOTES:
1. See TEST CIRCUITS AND WAVEFORMS. T
A
= – 40°C to + 85°C.
2. Skew between any two outputs of the same package and switching in the same direction.
5
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参数对比
与IDT74ALVCH16271PF8相近的元器件有:IDT74ALVCH16271PA、IDT74ALVCH16271PA8、IDT74ALVCH16271PV、IDT74ALVCH16271PV8、IDT74ALVCH16271PF。描述及对比如下:
型号 IDT74ALVCH16271PF8 IDT74ALVCH16271PA IDT74ALVCH16271PA8 IDT74ALVCH16271PV IDT74ALVCH16271PV8 IDT74ALVCH16271PF
描述 Multiplexer And Demux/Decoder, ALVC/VCX/A Series, 1-Func, 1 Line Input, 2 Line Output, True Output, CMOS, PDSO56, TVSOP-56 Multiplexer And Demux/Decoder, ALVC/VCX/A Series, 12-Func, CMOS, PDSO56, 0.50 MM PITCH, TSSOP-56 Multiplexer And Demux/Decoder, ALVC/VCX/A Series, 12-Func, True Output, CMOS, PDSO56, 0.50 MM PITCH, TSSOP-56 Multiplexer And Demux/Decoder, ALVC/VCX/A Series, 12-Func, CMOS, PDSO56, 0.635 MM PITCH, SSOP-56 Multiplexer And Demux/Decoder, ALVC/VCX/A Series, 12-Func, True Output, CMOS, PDSO56, 0.635 MM PITCH, SSOP-56 Multiplexer And Demux/Decoder, ALVC/VCX/A Series, 1-Func, 1 Line Input, 2 Line Output, True Output, CMOS, PDSO56, TVSOP-56
零件包装代码 SSOP TSSOP TSSOP SSOP SSOP SSOP
包装说明 TVSOP-56 0.50 MM PITCH, TSSOP-56 0.50 MM PITCH, TSSOP-56 SSOP, SSOP56,.4 SSOP, TVSOP-56
针数 56 56 56 56 56 56
Reach Compliance Code unknown not_compliant unknown not_compliant unknown not_compliant
系列 ALVC/VCX/A ALVC/VCX/A ALVC/VCX/A ALVC/VCX/A ALVC/VCX/A ALVC/VCX/A
JESD-30 代码 R-PDSO-G56 R-PDSO-G56 R-PDSO-G56 R-PDSO-G56 R-PDSO-G56 R-PDSO-G56
JESD-609代码 e0 e0 e0 e0 e0 e0
长度 11.3 mm 14 mm 14 mm 18.415 mm 18.415 mm 11.3 mm
逻辑集成电路类型 MULTIPLEXER AND DEMUX/DECODER MULTIPLEXER AND DEMUX/DECODER MULTIPLEXER AND DEMUX/DECODER MULTIPLEXER AND DEMUX/DECODER MULTIPLEXER AND DEMUX/DECODER MULTIPLEXER AND DEMUX/DECODER
功能数量 1 12 12 12 12 1
端子数量 56 56 56 56 56 56
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP TSSOP TSSOP SSOP SSOP TSSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm 1.2 mm 2.794 mm 2.794 mm 1.2 mm
最大供电电压 (Vsup) 2.7 V 3.6 V 3.6 V 3.6 V 3.6 V 2.7 V
最小供电电压 (Vsup) 2.3 V 2.7 V 2.7 V 2.7 V 2.7 V 2.3 V
标称供电电压 (Vsup) 2.5 V 3.3 V 3.3 V 3.3 V 3.3 V 2.5 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 TIN LEAD Tin/Lead (Sn85Pb15) TIN LEAD Tin/Lead (Sn85Pb15) TIN LEAD Tin/Lead (Sn85Pb15)
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.4 mm 0.5 mm 0.5 mm 0.635 mm 0.635 mm 0.4 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL
宽度 4.4 mm 6.1 mm 6.1 mm 7.5 mm 7.5 mm 4.4 mm
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - - IDT (Integrated Device Technology)
输出极性 TRUE - TRUE - TRUE TRUE
Base Number Matches - 1 1 1 1 -
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