型号
- 型号
- 关键词
Multiplexer And Demux/Decoder, CBTLV/3B Series, 1-Func, 1 Line Input, 8 Line Output, True Output, CMOS, PDSO16, GREEN, QSOP-16
厂商名称：IDT (Integrated Device Technology)
器件标准：
| 型号 | IDT74CBTLV3251QG | IDT74CBTLV3251QG8 | IDT74CBTLV3251PGG | IDT74CBTLV3251PGG8 |
|---|---|---|---|---|
| 描述 | Multiplexer And Demux/Decoder, CBTLV/3B Series, 1-Func, 1 Line Input, 8 Line Output, True Output, CMOS, PDSO16, GREEN, QSOP-16 | Multiplexer And Demux/Decoder, CBTLV/3B Series, 1-Func, 1 Line Input, 8 Line Output, True Output, CMOS, PDSO16, GREEN, QSOP-16 | Multiplexer And Demux/Decoder, CBTLV/3B Series, 1-Func, 1 Line Input, 8 Line Output, True Output, CMOS, PDSO16, GREEN, TSSOP-16 | Multiplexer And Demux/Decoder, CBTLV/3B Series, 1-Func, 1 Line Input, 8 Line Output, True Output, CMOS, PDSO16, GREEN, TSSOP-16 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | SOIC | SOIC | TSSOP | TSSOP |
| 包装说明 | SSOP, SSOP16,.25 | SSOP, SSOP16,.25 | TSSOP, TSSOP16,.25 | TSSOP, TSSOP16,.25 |
| 针数 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 系列 | CBTLV/3B | CBTLV/3B | CBTLV/3B | CBTLV/3B |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e3 | e3 | e3 | e3 |
| 长度 | 4.9 mm | 4.9 mm | 5 mm | 5 mm |
| 逻辑集成电路类型 | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER |
| 湿度敏感等级 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 输入次数 | 1 | 1 | 1 | 1 |
| 输出次数 | 8 | 8 | 8 | 8 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | SSOP | TSSOP | TSSOP |
| 封装等效代码 | SSOP16,.25 | SSOP16,.25 | TSSOP16,.25 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 电源 | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
| 传播延迟（tpd） | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.635 mm | 0.635 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 |
| 宽度 | 3.9116 mm | 3.9116 mm | 4.4 mm | 4.4 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
嵌入式系统
单片机
模拟与混合信号
FPGA/CPLD
无线连接
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