型号 | IMS1423S-25S | IMS1423S-45S | IMS1423P-35S | IMS1423W-35S | IMS1423W-45S | IMS1423W-25S | IMS1423W-55S | IMS1423P-45S | IMS1423P-25S |
---|---|---|---|---|---|---|---|---|---|
描述 | IC,SRAM,4KX4,CMOS,DIP,20PIN,CERAMIC | IC,SRAM,4KX4,CMOS,DIP,20PIN,CERAMIC | IC,SRAM,4KX4,CMOS,DIP,20PIN,PLASTIC | IC,SRAM,4KX4,CMOS,LLCC,20PIN,CERAMIC | IC,SRAM,4KX4,CMOS,LLCC,20PIN,CERAMIC | IC,SRAM,4KX4,CMOS,LLCC,20PIN,CERAMIC | IC,SRAM,4KX4,CMOS,LLCC,20PIN,CERAMIC | IC,SRAM,4KX4,CMOS,DIP,20PIN,PLASTIC | IC,SRAM,4KX4,CMOS,DIP,20PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
最长访问时间 | 25 ns | 40 ns | 35 ns | 35 ns | 40 ns | 25 ns | 55 ns | 40 ns | 25 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XDIP-T20 | R-XDIP-T20 | R-PDIP-T20 | R-XQCC-N20 | R-XQCC-N20 | R-XQCC-N20 | R-XQCC-N20 | R-PDIP-T20 | R-PDIP-T20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
字数 | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
字数代码 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | QCCN | QCCN | QCCN | QCCN | DIP | DIP |
封装等效代码 | DIP20,.3 | DIP20,.3 | DIP20,.3 | LCC20,.3X.43 | LCC20,.3X.43 | LCC20,.3X.43 | LCC20,.3X.43 | DIP20,.3 | DIP20,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最小待机电流 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
最大压摆率 | 0.105 mA | 0.105 mA | 0.105 mA | 0.105 mA | 0.105 mA | 0.105 mA | 0.105 mA | 0.105 mA | 0.105 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | YES | YES | YES | YES | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | QUAD | DUAL | DUAL |
厂商名称 | ST(意法半导体) | ST(意法半导体) | - | - | ST(意法半导体) | - | - | ST(意法半导体) | ST(意法半导体) |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |