型号
- 型号
- 关键词
| 型号 | IPA1764/560 | IPA1764/460 |
|---|---|---|
| 描述 | IC,PREAMPLIFIER, NON-AUDIO,HYBRID,DIP,20PIN,CERAMIC | IC,PREAMPLIFIER, NON-AUDIO,HYBRID,DIP,20PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| Reach Compliance Code | unknown | unknown |
| Is Samacsys | N | N |
| JESD-30 代码 | R-XDIP-T20 | R-XDIP-T20 |
| JESD-609代码 | e0 | e0 |
| 端子数量 | 20 | 20 |
| 最高工作温度 | 70 °C | 125 °C |
| 封装主体材料 | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP |
| 封装等效代码 | DIP20,.6 | DIP20,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE |
| 电源 | +-12/+-15 V | +-12/+-15 V |
| 认证状态 | Not Qualified | Not Qualified |
| 最大压摆率 | 50 mA | 50 mA |
| 表面贴装 | NO | NO |
| 技术 | HYBRID | HYBRID |
| 温度等级 | COMMERCIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL |
| Base Number Matches | 1 | 1 |