型号
- 型号
- 关键词
EEPROM, 2KX8, Serial, CMOS, PDSO8, 3 X 4.40 MM, LEAD FREE, MO-153, TSSOP-8
厂商名称：Integrated Silicon Solution ( ISSI )
器件标准：
| 型号 | IS24C16A-3ZLA3 | IS24C04A-2CLI | IS24C02A-2CLI | IS24C02A-2PLI | IS24C02A-2DLI-TR | IS24C08A-3GLA3 | IS24C08A-3ZLA3 | IS24C16A-3GLA3 |
|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 2KX8, Serial, CMOS, PDSO8, 3 X 4.40 MM, LEAD FREE, MO-153, TSSOP-8 | EEPROM, 512X8, Serial, CMOS, LEAD FREE, DIE-8 | EEPROM, 256X8, Serial, CMOS, LEAD FREE, DIE-8 | EEPROM, 256X8, Serial, CMOS, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC, DIP-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, 2 X 3 MM, LEAD FREE, MO-229, DFN-8 | EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, SOIC-8 | EEPROM, 1KX8, Serial, CMOS, PDSO8, 3 X 4.40 MM, LEAD FREE, MO-153, TSSOP-8 | EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, SOIC-8 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
| 零件包装代码 | TSSOP | DIE | DIE | DIP | SON | SOIC | TSSOP | SOIC |
| 包装说明 | TSSOP, TSSOP8,.25 | DIE, | DIE, | DIP, DIP8,.3 | 2 X 3 MM, LEAD FREE, MO-229, DFN-8 | SOP, SOP8,.25 | TSSOP, TSSOP8,.25 | SOP, SOP8,.25 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
| JESD-30 代码 | R-PDSO-G8 | R-XUUC-N8 | R-XUUC-N8 | R-PDIP-T8 | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e3 | e1 | e1 | e3 | e3 | e3 | e3 | e3 |
| 内存密度 | 16384 bi | 4096 bit | 2048 bit | 2048 bit | 2048 bit | 8192 bit | 8192 bit | 16384 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 2048 words | 512 words | 256 words | 256 words | 256 words | 1024 words | 1024 words | 2048 words |
| 字数代码 | 2000 | 512 | 256 | 256 | 256 | 1000 | 1000 | 2000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 2KX8 | 512X8 | 256X8 | 256X8 | 256X8 | 1KX8 | 1KX8 | 2KX8 |
| 封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | DIE | DIE | DIP | HVSON | SOP | TSSOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | UNCASED CHIP | UNCASED CHIP | IN-LINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 2.5 V | 2.5 V | 2.5 V |
| 标称供电电压 (Vsup) | 5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | NO | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) - annealed | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD | GULL WING | GULL WING | GULL WING |
| 端子位置 | DUAL | UPPER | UPPER | DUAL | DUAL | DUAL | DUAL | DUAL |
| 最长写入周期时间 (tWC) | 10 ms | 5 ms | 5 ms | 5 ms | 5 ms | 10 ms | 10 ms | 10 ms |
| 是否无铅 | 不含铅 | 不含铅 | - | - | - | 不含铅 | 不含铅 | 不含铅 |
| 数据保留时间-最小值 | 100 | - | - | 100 | 100 | 100 | 100 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles | - | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010MMMR | - | - | 1010DDDR | 1010DDDR | 1010DMMR | 1010DMMR | 1010MMMR |
| 长度 | 4.4 mm | - | - | 9.27 mm | 3 mm | 4.9 mm | 4.4 mm | 4.9 mm |
| 封装等效代码 | TSSOP8,.25 | - | - | DIP8,.3 | SOLCC8,.11,20 | SOP8,.25 | TSSOP8,.25 | SOP8,.25 |
| 峰值回流温度（摄氏度） | 260 | 260 | - | 260 | - | 260 | 260 | 260 |
| 电源 | 3/5 V | - | - | 2/5 V | 2/5 V | 3/5 V | 3/5 V | 3/5 V |
| 座面最大高度 | 1.2 mm | - | - | 4.2 mm | 0.8 mm | 1.75 mm | 1.2 mm | 1.75 mm |
| 最大待机电流 | 0.000002 A | - | - | 0.000001 A | 0.000001 A | 0.000002 A | 0.000002 A | 0.000002 A |
| 最大压摆率 | 0.003 mA | - | - | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
| 端子节距 | 0.65 mm | - | - | 2.54 mm | 0.5 mm | 1.27 mm | 0.65 mm | 1.27 mm |
| 处于峰值回流温度下的最长时间 | 40 | 40 | - | 40 | - | 40 | 40 | 40 |
| 宽度 | 3 mm | - | - | 7.62 mm | 2 mm | 3.9 mm | 3 mm | 3.9 mm |
| 写保护 | HARDWARE | - | - | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |