IS25WQ040/020
IS25WQ040
IS25WQ020
4M/2M-BIT
1.8V QUAD SERIAL FLASH
MEMORY WITH
104MHZ MULTI I/O SPI
DATA SHEET
Integrated Silicon Solution, Inc.- www.issi.com
Rev. B1
02/22/2017
1
IS25WQ040/020
4M/2M-BIT 1.8V QUAD SERIAL FLASH MEMORY WITH MULTI-I/O SPI
FEATURES
Industry Standard Serial Interface
-
IS25WQ040: 4M-bit/ 512K-byte
-
IS25WQ020: 2M-bit/ 256K-byte
-
256-bytes per Programmable Page Standard
-
Standard SPI/Dual/Quad Multi-I/O SPI
High Performance Serial Flash (SPI)
-
-
-
-
-
33MHz SPI Normal Read
104 MHz SPI/Dual/Quad Multi-I/O SPI
416 MHz equivalent Quad SPI
52MB/S Continuous Data Throughput
Supports SPI Modes 0 and 3
Low Power with Wide Temp. Ranges
-
Single 1.65V to 1.95V Voltage Supply
-
8 mA Active Read Current (typ)
-
15 µA Standby Current
(typ.)
-
2 µA Deep Power Down
(typ.)
-
Temp Grades:
Extended: -40°C to +105°C
Advanced Security Protection
-
Software and Hardware Write Protection
-
256-Byte dedicated security area, One
Time Programmable (OTP) Memory
-
128 bit Unique ID for each device (Call Factory)
Industry Standard Pin-out &
Pb-Free
Packages
2
-
JN = 8-pin SOIC 150mil
-
JB = 8-pin SOIC 208mil
-
JV = 8-pin VVSOP 150mil
-
JK = 8-contact WSON 6x5mm
-
JU = 8-contact USON 2x3mm
-
KGD (Call Factory)
Note2: Call Factory for other package options available
-
More than 100,000 Erase/Program Cycles
(1)
-
More than 20-year Data Retention
Efficient Read and Program modes
-
Low Instruction Overhead Operations
-
Continuous data read
-
Allows XIP operations (execute in place)
-
Outperforms X16 Parallel Flash
Flexible & Cost Efficient Memory Architecture
-
Uniform 4 Kbyte Sectors or 32/64 Kbyte Blocks
-
Flexible 4, 32, 64 K-bytes, or Chip Erase
-
Standard Page Program 1 to 256 bytes
-
Program/Erase Suspend and Resume
GENERAL DESCRIPTION
The IS25WQ040/020 (4M/2Mbit) Serial Flash memory offers a storage solution with flexibility and performance in a
simplified pin count package. ISSI’s “Industry Standard Serial Interface” is for systems that have limited space, pins,
and power. The IS25WQ040/020 is accessed through a 4-wire SPI Interface consisting of a Serial Data Input (SI), Serial
Data Output (SO), Serial Clock (SCK), and Chip Enable (CE#) pins, which also serve as multi-function I/O pins in Dual
and Quad modes (see pin descriptions). The IS25xQ series of Flash is ideal for code shadowing to RAM, execute in
place (XIP) operations, and storing non-volatile data.
The memory array is organized into programmable pages of 256-bytes each. The IS25WQ040/020 supports page
program mode where 1 to 256 bytes of data can be programmed into the memory with one command. Pages can be
erased in groups of 4K-byte sectors, 32K-byte blocks, 64K-byte blocks, and/or the entire chip. The uniform sectors and
blocks allow greater flexibility for a variety of applications requiring solid data retention.
The device supports the standard Serial Peripheral Interface (SPI), Dual/Quad output (SPI), and Dual/Quad I/O (SPI).
Clock frequencies of up to 104MHz for all read modes allow for equivalent clock rates of up to 416MHz (104MHz x 4)
allowing up to 52MBytes/S of throughput. These transfer rates can outperform 16-bit Parallel Flash memories allowing
for efficient memory access for a XIP (execute in place) operation. The IS25WQ040/020 is manufactured using industry
leading non-volatile memory technology and offered in industry standard lead-free packages. See Ordering Information
for the density and package combinations available
.
Note1: 100,000 Continuous Chip and Block cycling, 100,000 Continuous Sector cycling.
Integrated Silicon Solution, Inc.- www.issi.com
Rev. B1
02/22/2017
2
IS25WQ040/020
TABLE OF CONTENTS
FEATURES
.......................................................................................................................................................... 2
GENERAL DESCRIPTION
.................................................................................................................................. 2
1.
2.
3.
4.
5.
6.
PIN CONFIGURATION ................................................................................................................................. 5
PIN DESCRIPTIONS
.................................................................................................................................... 6
BLOCK DIAGRAM
........................................................................................................................................ 7
SPI MODES DESCRIPTION
........................................................................................................................ 8
SYSTEM CONFIGURATION
...................................................................................................................... 10
5.1 BLOCK/SECTOR ADDRESSES
.......................................................................................................... 11
REGISTERS
............................................................................................................................................... 12
6.1. STATUS REGISTER
........................................................................................................................... 12
6.2. FUNCTION REGISTER
....................................................................................................................... 15
7.
PROTECTION MODE.................................................................................................................................
16
7.1 HARDWARE WRITE PROTECTION....................................................................................................
16
7.2 SOFTWARE WRITE PROTECTION
.................................................................................................... 16
8.
DEVICE OPERATION
................................................................................................................................ 17
8.1 READ DATA OPERATION (RD, 03h)
.................................................................................................. 18
8.2 FAST READ DATA OPERATION (FR, 0Bh)
........................................................................................ 20
8.3 HOLD OPERATION
.............................................................................................................................. 21
8.4 FAST READ DUAL I/O OPERATION (FRDIO, BBh)
........................................................................... 21
8.5 FAST READ DUAL OUTPUT OPERATION (FRDO, 3Bh)
.................................................................. 24
8.6 FAST READ QUAD OUTPUT (FRQO, 6Bh)
........................................................................................ 26
8.7 FAST READ QUAD I/O OPERATION (FRQIO, EBh)
.......................................................................... 28
8.8 PAGE PROGRAM OPERATION (PP, 02h)
.......................................................................................... 31
8.9 QUAD INPUT PAGE PROGRAM OPERATION (PPQ, 32h)
............................................................... 32
8.10 ERASE OPERATION
......................................................................................................................... 33
8.11 SECTOR ERASE OPERATION (SER, D7h/20h)
............................................................................... 33
8.12 BLOCK ERASE OPERATION (BER32K:52h, BER64K:D8h)
............................................................ 34
8.13 CHIP ERASE OPERATION (CER, C7h/60h)
..................................................................................... 35
8.14 WRITE ENABLE OPERATION (WREN, 06h)
.................................................................................... 36
8.15 WRITE DISABLE OPERATION (WRDI, 04h)
..................................................................................... 36
8.16 READ STATUS REGISTER OPERATION (RDSR, 05h)
................................................................... 37
8.17 WRITE STATUS REGISTER OPERATION (WRSR, 01h)
................................................................. 37
8.18 READ FUNCTION REGISTER OPERATION (RDFR, 07h)
............................................................... 38
8.19 PROGRAM/ERASE SUSPEND & RESUME
...................................................................................... 39
8.20 DEEP POWER DOWN (DP, B9h)
...................................................................................................... 41
8.21 RELEASE DEEP POWER DOWN (RDPD, ABh)
............................................................................... 42
8.22 READ PRODUCT IDENTIFICATION (RDID, ABh)
............................................................................ 43
Integrated Silicon Solution, Inc.- www.issi.com
Rev. B1
02/22/2017
3
IS25WQ040/020
8.23 READ PRODUCT IDENTIFICATION BY JEDEC ID OPERATION (RDJDID, 9Fh)
........................... 44
8.24 READ DEVICE MANUFACTURER AND DEVICE ID OPERATION (RDMDID, 90h)
........................ 45
8.25 READ UNIQUE ID NUMBER (RDUID, A1h)
...................................................................................... 46
8.26 SECURITY INFORMATION ROW (OTP MEMORY)
......................................................................... 47
8.27 INFORMATION ROW PROGRAM OPERATION (IRP, B1h)
............................................................. 48
8.28 INFORMATION ROW READ OPERATION (IRRD, 4Bh)
................................................................... 49
8.29 SECTOR LOCK/UNLOCK FUNCTIONS
............................................................................................ 50
9.
ELECTRICAL CHARACTERISTICS
........................................................................................................... 52
9.1 ABSOLUTE MAXIMUM RATINGS
(1)
................................................................................................... 52
9.2 OPERATING RANGE
........................................................................................................................... 52
9.3 DC CHARACTERISTICS
...................................................................................................................... 53
9.4 AC MEASUREMENT CONDITIONS
.................................................................................................... 54
9.5
PIN CAPACITANCE (TA = 25°C, VCC=1.8V, 1MHz) .......................................................................... 54
9.6 AC CHARACTERISTICS
...................................................................................................................... 55
9.7 SERIAL INPUT/OUTPUT TIMING
(1)
.................................................................................................... 56
9.8 POWER-UP AND POWER-DOWN
...................................................................................................... 57
9.9 PROGRAM/ERASE PERFORMANCE
................................................................................................. 58
9.10 RELIABILITY CHARACTERISTICS
1
.................................................................................................. 58
10.
PACKAGE TYPE INFORMATION
......................................................................................................... 59
10.1 8-Pin JEDEC 150mil Broad Small Outline Integrated Circuit (SOIC) Package (JN)
.......................... 59
10.2 8-Pin 150mil VVSOP Package (JV)
.................................................................................................... 60
10.3 8-Contact Ultra-Thin Small Outline No-Lead (WSON) 6x5mm Package (JK)
.................................... 61
10.4 8-Contact Ultra-Thin Small Outline No-Lead (USON) Package 2x3mm (JU) .................................... 62
10.5 8-Pin JEDEC 208mil Broad Small Outline Integrated Circuit (SOIC) Package (JB) .......................... 63
11.
ORDERING INFORMATION
- Valid Part Numbers ............................................................................... 64
Integrated Silicon Solution, Inc.- www.issi.com
Rev. B1
02/22/2017
4
IS25WQ040/020
1. PIN CONFIGURATION
CE#
1
8
Vcc
CE#
1
2
3
4
8
Vcc
7
HOLD# (IO3)
6
SCK
5
SI (IO0
)
SO (IO1)
2
7
HOLD# (IO3)
SO (IO1)
WP# (IO2)
3
6
SCK
WP# (IO2)
GND
GND
4
5
SI (IO0
)
8-contact WSON 6x5mm (Package: JK)
8-pin SOIC 150mil (Package: JN)
8-pin SOIC 208mil (Package: JB)
8-pin VVSOP 150mil (Package: JV)
CE#
SO (IO1)
WP# (IO2)
GND
1
2
3
4
8
7
6
5
Vcc
HOLD# (IO3)
SCK
SI (IO0
)
8-contact USON 2x3mm (Package: JU)
Integrated Silicon Solution, Inc.- www.issi.com
Rev. B1
02/22/2017
5
