型号
- 型号
- 关键词
Synchronous DRAM, 16MX32, 5.4ns, CMOS, PBGA90, 11 X 13 MM, 0.80 MM PITCH, LEAD FREE, WBGA-90
厂商名称：Integrated Silicon Solution ( ISSI )
器件标准：
| 型号 | IS42S32160B-6BLI | IS42S32160B-75EBLI | IS42S32160B-75ETLI | IS42S32160B-6TLI |
|---|---|---|---|---|
| 描述 | Synchronous DRAM, 16MX32, 5.4ns, CMOS, PBGA90, 11 X 13 MM, 0.80 MM PITCH, LEAD FREE, WBGA-90 | Synchronous DRAM, 16MX32, 5.5ns, CMOS, PBGA90, 11 X 13 MM, 0.80 MM PITCH, LEAD FREE, WBGA-90 | Synchronous DRAM, 16MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, TSOP2-86 | Synchronous DRAM, 16MX32, 5.4ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, TSOP2-86 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
| 零件包装代码 | BGA | BGA | TSOP2 | TSOP2 |
| 包装说明 | TFBGA, BGA90,9X15,32 | TFBGA, BGA90,9X15,32 | TSOP2, TSSOP86,.46,20 | TSOP2, TSSOP86,.46,20 |
| 针数 | 90 | 90 | 86 | 86 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
| 最长访问时间 | 5.4 ns | 5.5 ns | 5.5 ns | 5.4 ns |
| 其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| 最大时钟频率 (fCLK) | 166 MHz | 133 MHz | 133 MHz | 166 MHz |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON |
| 交错的突发长度 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 |
| JESD-30 代码 | R-PBGA-B90 | R-PBGA-B90 | R-PDSO-G86 | R-PDSO-G86 |
| JESD-609代码 | e1 | e1 | e3 | e3 |
| 长度 | 13 mm | 13 mm | 22.22 mm | 22.22 mm |
| 内存密度 | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit |
| 内存集成电路类型 | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
| 内存宽度 | 32 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 90 | 90 | 86 | 86 |
| 字数 | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
| 字数代码 | 16000000 | 16000000 | 16000000 | 16000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 16MX32 | 16MX32 | 16MX32 | 16MX32 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFBGA | TFBGA | TSOP2 | TSOP2 |
| 封装等效代码 | BGA90,9X15,32 | BGA90,9X15,32 | TSSOP86,.46,20 | TSSOP86,.46,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 8192 | 8192 | 8192 | 8192 |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 自我刷新 | YES | YES | YES | YES |
| 连续突发长度 | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP |
| 最大待机电流 | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 最大压摆率 | 0.35 mA | 0.3 mA | 0.3 mA | 0.35 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | BALL | BALL | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 0.8 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | BOTTOM | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 |
| 宽度 | 11 mm | 11 mm | 10.16 mm | 10.16 mm |
PCB设计
模拟与混合信号
单片机
电子竞赛
MEMS传感器
嵌入式系统
