首页 > 器件类别 > 存储 > 存储

IS45LV16100-50TA1

EDO DRAM, 1MX16, 50ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-50/44

器件类别:存储    存储   

厂商名称:Integrated Silicon Solution ( ISSI )

下载文档
器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
Integrated Silicon Solution ( ISSI )
零件包装代码
TSOP2
包装说明
0.400 INCH, PLASTIC, TSOP2-50/44
针数
50
Reach Compliance Code
compliant
ECCN代码
EAR99
访问模式
FAST PAGE WITH EDO
最长访问时间
50 ns
其他特性
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 代码
R-PDSO-G44
JESD-609代码
e0
长度
20.95 mm
内存密度
16777216 bit
内存集成电路类型
EDO DRAM
内存宽度
16
湿度敏感等级
3
功能数量
1
端口数量
1
端子数量
44
字数
1048576 words
字数代码
1000000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
1MX16
封装主体材料
PLASTIC/EPOXY
封装代码
TSOP2
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度)
NOT SPECIFIED
认证状态
Not Qualified
座面最大高度
1.2 mm
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
TIN LEAD
端子形式
GULL WING
端子节距
0.8 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
10.16 mm
文档预览
IS45C16100
IS45LV16100
1M x 16 (16-MBIT) DYNAMIC RAM
WITH EDO PAGE MODE
ISSI
DESCRIPTION
®
PRELIMINARY INFORMATION
OCTOBER 2002
FEATURES
• TTL compatible inputs and outputs; tristate I/O
• Refresh Interval:
Auto refresh Mode:
1,024 cycles /16 ms
RAS-Only, CAS-before-RAS
(CBR), and Hidden
Self refresh Mode
- 1,024 cycles / 128ms
• JEDEC standard pinout
• Single power supply:
5V ± 10% (IS45C16100)
3.3V ± 10% (IS45LV16100)
• Byte Write and Byte Read operation via two
CAS
Automotive Temperature Range:
Option A:
Option A1:
0°C to +70°C
-40°C to +85°C
The
ISSI
IS45C16100 and IS45LV16100 are 1,048,576 x 16-
bit high-performance CMOS Dynamic Random Access Memo-
ries. These devices offer an accelerated cycle access called
EDO Page Mode. EDO Page Mode allows 1,024 random
accesses within a single row with access cycle time as short as
20 ns per 16-bit word. The Byte Write control, of upper and lower
byte, makes the IS45C16100 ideal for use in 16-bit and 32-bit
wide data bus systems.
These features make the IS45C16100and IS45LV16100 ideally
suited for high-bandwidth graphics, digital signal processing,
high-performance computing systems, and peripheral applications.
The IS45C16100 and IS45LV16100 are packaged in a 42-pin
400-mil SOJ and 400-mil 50- (44-) pin TSOP (Type II).
PRODUCT SERIES OVERVIEW
Part No.
IS45C16100
IS45LV16100
Refresh
1K
1K
Voltage
5V ± 10%
3.3V ± 10%
KEY TIMING PARAMETERS
Parameter
Max.
RAS
Access Time (t
RAC
)
Max.
CAS
Access Time (t
CAC
)
Max. Column Address Access Time (t
AA
)
Min. EDO Page Mode Cycle Time (t
PC
)
Min. Read/Write Cycle Time (t
RC
)
-50
50
13
25
20
84
-60
60
15
30
25
104
Unit
ns
ns
ns
ns
ns
Copyright © 2002 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
IIntegrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. 00A
10/21/02
1
IS45C16100
IS45LV16100
FUNCTIONAL BLOCK DIAGRAM
ISSI
®
OE
WE
LCAS
UCAS
CAS
CLOCK
GENERATOR
WE
CONTROL
LOGICS
OE
CONTROL
LOGIC
OE
CAS
WE
RAS
RAS
CLOCK
GENERATOR
DATA I/O BUS
REFRESH
COUNTER
DATA I/O BUFFERS
ROW DECODER
RAS
COLUMN DECODERS
SENSE AMPLIFIERS
DQ0-DQ15
MEMORY ARRAY
1,048,576 x 16
ADDRESS
BUFFERS
A0-A9
2
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. 00A
10/21/02
IS45C16100
IS45LV16100
TRUTH TABLE
Function
Standby
Read: Word
Read: Lower Byte
Read: Upper Byte
Write: Word (Early Write)
Write: Lower Byte (Early Write)
Write: Upper Byte (Early Write)
Read-Write
(1,2)
EDO Page-Mode Read
(2)
1st Cycle:
2nd Cycle:
Any Cycle:
1st Cycle:
2nd Cycle:
1st Cycle:
2nd Cycle:
Read
(2)
Write
(1,3)
RAS
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L→H→L
L→H→L
L
H→L
LCAS
H
L
L
H
L
L
H
L
H→L
H→L
L→H
H→L
H→L
H→L
H→L
L
L
H
L
UCAS
H
L
H
L
L
H
L
L
H→L
H→L
L→H
H→L
H→L
H→L
H→L
L
L
H
L
WE
X
H
H
H
L
L
L
H→L
H
H
H
L
L
H→L
H→L
H
L
X
X
OE
X
L
L
L
X
X
X
L→H
L
L
L
X
X
L→H
L→H
L
X
X
X
Address t
R
/t
C
X
ROW/COL
ROW/COL
ROW/COL
ROW/COL
ROW/COL
ROW/COL
ROW/COL
ROW/COL
NA/COL
NA/NA
ROW/COL
NA/COL
ROW/COL
NA/COL
ROW/COL
ROW/COL
ROW/NA
X
I/O
ISSI
High-Z
D
OUT
Lower Byte, D
OUT
Upper Byte, High-Z
Lower Byte, High-Z
Upper Byte, D
OUT
D
IN
Lower Byte, D
IN
Upper Byte, High-Z
Lower Byte, High-Z
Upper Byte, D
IN
D
OUT
, D
IN
D
OUT
D
OUT
D
OUT
D
IN
D
IN
D
OUT
, D
IN
D
OUT
, D
IN
D
OUT
D
OUT
High-Z
High-Z
®
EDO Page-Mode Write
(1)
EDO Page-Mode
(1,2)
Read-Write
Hidden Refresh
RAS-Only
Refresh
CBR Refresh
(4)
Notes:
1. These WRITE cycles may also be BYTE WRITE cycles (either
LCAS
or
UCAS
active).
2. These READ cycles may also be BYTE READ cycles (either
LCAS
or
UCAS
active).
3. EARLY WRITE only.
4. At least one of the two
CAS
signals must be active (LCAS or
UCAS).
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. 00A
10/21/02
3
IS45C16100
IS45LV16100
Functional Description
The IS45C16100 and IS45LV16100 is a CMOS DRAM
optimized for high-speed bandwidth, low power applications.
During READ or WRITE cycles, each bit is uniquely
addressed through the 16 address bits. These are entered
ten bits (A0-A9) at time. The row address is latched by
the Row Address Strobe (RAS). The column address is
latched by the Column Address Strobe (CAS).
RAS
is used
to latch the first nine bits and
CAS
is used to latch the latter nine bits.
The IS45C16100 and IS45LV16100 has two
CAS
controls,
LCAS
and
UCAS.
The
LCAS
and
UCAS
inputs internally
generates a
CAS
signal functioning in an identical manner to the
single
CAS
input on the other 1M x 16 DRAMs. The key differ-
ence is that each
CAS
controls its corresponding I/O
tristate logic (in conjunction with
OE
and
WE
and
RAS). LCAS
controls I/O0 through I/O7 and
UCAS
controls I/O8 through I/O15.
The IS45C16100 and IS45LV16100
CAS
function is
determined by the first
CAS
(LCAS or
UCAS)
transitioning
LOW and the last transitioning back HIGH. The two
CAS
controls give the IS45C16100 and IS45LV16100 both
BYTE READ and BYTE WRITE cycle capabilities.
ISSI
®
while holding
CAS
LOW. In
CAS-before-RAS
refresh
cycle, an internal 9-bit counter provides the row ad-
dresses and the external address inputs are ignored.
CAS-before-RAS
is a refresh-only mode and no data
access or device selection is allowed. Thus, the output
remains in the High-Z state during the cycle.
Self Refresh Cycle
The Self Refresh allows the user a dynamic refresh, data
retention mode at the extended refresh period of 128 ms.
i.e., 125 µs per row when using distributed CBR refreshes.
The feature also allows the user the choice of a fully
static, low power data retention mode. The optional Self
Refresh feature is initiated by performing a CBR Refresh
cycle and holding
RAS
LOW for the specified t
RAS
.
The Self Refresh mode is terminated by driving
RAS
HIGH for a minimum time of t
RP
. This delay allows for the
completion of any internal refresh cycles that may be in
process at the time of the
RAS
LOW-to-HIGH transition.
If the DRAM controller uses a distributed refresh sequence,
a burst refresh is not required upon exiting Self Refresh.
However, if the DRAM controller utilizes a
RAS-only
or
burst refresh sequence, all 1,024 rows must be refreshed
within the average internal refresh rate, prior to the
resumption of normal operation.
Memory Cycle
A memory cycle is initiated by bring
RAS
LOW and it is
terminated by returning both
RAS
and
CAS
HIGH. To
ensures proper device operation and data integrity any
memory cycle, once initiated, must not be ended or
aborted before the minimum t
RAS
time has expired. A new
cycle must not be initiated until the minimum precharge
time t
RP
, t
CP
has elapsed.
Read Cycle
A read cycle is initiated by the falling edge of
CAS
or
OE,
whichever occurs last, while holding
WE
HIGH. The column
address must be held for a minimum time specified by t
AR
.
Data Out becomes valid only when t
RAC
, t
AA
, t
CAC
and t
OEA
are all satisfied. As a result, the access time is dependent
on the timing relationships between these parameters.
Extended Data Out Page Mode
EDO page mode operation permits all 1,024 columns within
a selected row to be randomly accessed at a high data rate.
In EDO page mode read cycle, the data-out is held to the
next
CAS
cycle’s falling edge, instead of the rising edge.
For this reason, the valid data output time in EDO page
mode is extended compared with the fast page mode. In
the fast page mode, the valid data output time becomes
shorter as the
CAS
cycle time becomes shorter. There-
fore, in EDO page mode, the timing margin in read cycle
is larger than that of the fast page mode even if the
CAS
cycle time becomes shorter.
In EDO page mode, due to the extended data function, the
CAS
cycle time can be shorter than in the fast page mode
if the timing margin is the same.
The EDO page mode allows both read and write opera-
tions during one
RAS
cycle, but the performance is
equivalent to that of the fast page mode in that case.
Power-On
After application of the VDD supply, an initial pause of
200 µs is required followed by a minimum of eight
initialization cycles (any combination of cycles contain-
ing a
RAS
signal).
During power-on, it is recommended that
RAS
track with
VDD or be held at a valid V
IH
to avoid current surges.
Write Cycle
A write cycle is initiated by the falling edge of
CAS
and
WE,
whichever occurs last. The input data must be valid at or
before the falling edge of
CAS
or
WE,
whichever occurs first.
Auto Refresh Cycle
To retain data, 1,024 refresh cycles are required in each
16 ms period. There are two ways to refresh the memory.
1. By clocking each of the 1,024 row addresses (A0 through A9)
with
RAS
at least once every 128 ms. Any read, write, read-
modify-write or
RAS-only
cycle refreshes the addressed row.
2. Using a
CAS-before-RAS
refresh cycle.
CAS-before-
RAS
refresh is activated by the falling edge of
RAS,
4
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. 00A
10/21/02
IS45C16100
IS45LV16100
PIN CONFIGURATIONS
50(44)-Pin TSOP (Type II)
42-Pin SOJ
ISSI
®
VDD
DQ0
DQ1
DQ2
DQ3
VDD
DQ4
DQ5
DQ6
DQ7
NC
NC
NC
WE
RAS
NC
NC
A0
A1
A2
A3
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
GND
DQ15
DQ14
DQ13
DQ12
GND
DQ11
DQ10
DQ9
DQ8
NC
NC
LCAS
UCAS
OE
A9
A8
A7
A6
A5
A4
GND
VDD
DQ0
DQ1
DQ2
DQ3
VDD
DQ4
DQ5
DQ6
DQ7
NC
NC
WE
RAS
NC
NC
A0
A1
A2
A3
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
GND
DQ15
DQ14
DQ13
DQ12
GND
DQ11
DQ10
DQ9
DQ8
NC
LCAS
UCAS
OE
A9
A8
A7
A6
A5
A4
GND
PIN DESCRIPTIONS
A0-A9
DQ0-15
WE
OE
RAS
UCAS
LCAS
V
DD
GND
NC
Address Inputs
Data Inputs/Outputs
Write Enable
Output Enable
Row Address Strobe
Upper Column Address Strobe
Lower Column Address Strobe
Power
Ground
No Connection
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. 00A
10/21/02
5
查看更多>
参数对比
与IS45LV16100-50TA1相近的元器件有:IS45C16100-60KA、IS45LV16100-50KA1、IS45C16100-60KA1、IS45LV16100-50TA、IS45C16100-60TA、IS45C16100-60TA1、IS45LV16100-50KA。描述及对比如下:
型号 IS45LV16100-50TA1 IS45C16100-60KA IS45LV16100-50KA1 IS45C16100-60KA1 IS45LV16100-50TA IS45C16100-60TA IS45C16100-60TA1 IS45LV16100-50KA
描述 EDO DRAM, 1MX16, 50ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-50/44 EDO DRAM, 1MX16, 60ns, CMOS, PDSO42, 0.400 INCH, SOJ-42 EDO DRAM, 1MX16, 50ns, CMOS, PDSO42, 0.400 INCH, SOJ-42 EDO DRAM, 1MX16, 60ns, CMOS, PDSO42, 0.400 INCH, SOJ-42 EDO DRAM, 1MX16, 50ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-50/44 EDO DRAM, 1MX16, 60ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-50/44 EDO DRAM, 1MX16, 60ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-50/44 EDO DRAM, 1MX16, 50ns, CMOS, PDSO42, 0.400 INCH, SOJ-42
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 TSOP2 SOJ SOJ SOJ TSOP2 TSOP2 TSOP2 SOJ
包装说明 0.400 INCH, PLASTIC, TSOP2-50/44 SOJ, SOJ, SOJ, 0.400 INCH, PLASTIC, TSOP2-50/44 TSOP2, TSOP2, SOJ,
针数 50 42 42 42 50 50 50 42
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO
最长访问时间 50 ns 60 ns 50 ns 60 ns 50 ns 60 ns 60 ns 50 ns
其他特性 RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 代码 R-PDSO-G44 R-PDSO-J42 R-PDSO-J42 R-PDSO-J42 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-J42
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0
长度 20.95 mm 27.305 mm 27.305 mm 27.305 mm 20.95 mm 20.95 mm 20.95 mm 27.305 mm
内存密度 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit
内存集成电路类型 EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM
内存宽度 16 16 16 16 16 16 16 16
湿度敏感等级 3 3 3 3 3 3 3 3
功能数量 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1
端子数量 44 42 42 42 44 44 44 42
字数 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
字数代码 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 70 °C 85 °C 85 °C 70 °C 70 °C 85 °C 70 °C
组织 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP2 SOJ SOJ SOJ TSOP2 TSOP2 TSOP2 SOJ
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 3.75 mm 3.75 mm 3.75 mm 1.2 mm 1.2 mm 1.2 mm 3.75 mm
最大供电电压 (Vsup) 3.6 V 5.5 V 3.6 V 5.5 V 3.6 V 5.5 V 5.5 V 3.6 V
最小供电电压 (Vsup) 3 V 4.5 V 3 V 4.5 V 3 V 4.5 V 4.5 V 3 V
标称供电电压 (Vsup) 3.3 V 5 V 3.3 V 5 V 3.3 V 5 V 5 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
端子面层 TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
端子形式 GULL WING J BEND J BEND J BEND GULL WING GULL WING GULL WING J BEND
端子节距 0.8 mm 1.27 mm 1.27 mm 1.27 mm 0.8 mm 0.8 mm 0.8 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm
厂商名称 Integrated Silicon Solution ( ISSI ) - - Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
热门器件
热门资源推荐
器件捷径:
L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ
需要登录后才可以下载。
登录取消