型号
- 型号
- 关键词
DDR DRAM, 16MX32, CMOS, PBGA134, FBGA-134
厂商名称：Integrated Silicon Solution ( ISSI )
器件标准：
| 型号 | IS46LD32160A-18BLA2 | IS43LD32160A-18BLI | IS46LD32160A-18BLA1 | IS46LD32160A-18BPLA1 | IS46LD32160A-18BPLA2 | IS46LD32160A-25BPLA2 | IS46LD32160A-3BPLA1 | IS46LD32160A-3BPLA2 |
|---|---|---|---|---|---|---|---|---|
| 描述 | DDR DRAM, 16MX32, CMOS, PBGA134, FBGA-134 | DDR DRAM, 16MX32, CMOS, PBGA134, FBGA-134 | DDR DRAM, 16MX32, CMOS, PBGA134, FBGA-134 | DDR DRAM, 16MX32, CMOS, PBGA168, FBGA-168 | DDR DRAM, 16MX32, CMOS, PBGA168, FBGA-168 | DDR DRAM, 16MX32, CMOS, PBGA168, FBGA-168 | DDR DRAM, 16MX32, CMOS, PBGA168, FBGA-168 | DDR DRAM, 16MX32, CMOS, PBGA168, FBGA-168 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
| 包装说明 | TFBGA, | TFBGA, | TFBGA, | VFBGA, | VFBGA, | VFBGA, | VFBGA, | VFBGA, |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
| 其他特性 | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM |
| JESD-30 代码 | R-PBGA-B134 | R-PBGA-B134 | R-PBGA-B134 | S-PBGA-B168 | S-PBGA-B168 | S-PBGA-B168 | S-PBGA-B168 | S-PBGA-B168 |
| JESD-609代码 | e1 | e1 | e1 | e1 | e1 | e1 | e1 | e1 |
| 长度 | 11.5 mm | 11.5 mm | 11.5 mm | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm |
| 内存密度 | 536870912 bi | 536870912 bi | 536870912 bi | 536870912 bi | 536870912 bi | 536870912 bi | 536870912 bi | 536870912 bi |
| 内存集成电路类型 | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM |
| 内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 134 | 134 | 134 | 168 | 168 | 168 | 168 | 168 |
| 字数 | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
| 字数代码 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 组织 | 16MX32 | 16MX32 | 16MX32 | 16MX32 | 16MX32 | 16MX32 | 16MX32 | 16MX32 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFBGA | TFBGA | TFBGA | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | 260 | 260 | 260 | 260 | 260 | 260 |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm |
| 自我刷新 | YES | YES | YES | YES | YES | YES | YES | YES |
| 最大供电电压 (Vsup) | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V |
| 最小供电电压 (Vsup) | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V |
| 标称供电电压 (Vsup) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 10 | NOT SPECIFIED | 10 | 10 | 10 | 10 | 10 | 10 |
| 宽度 | 10 mm | 10 mm | 10 mm | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm |